ASTM E650 E650M-2017 red 4375 Standard Guide for Mounting Piezoelectric Acoustic Emission Sensors《安装压电声发射传感器的标准指南》.pdf
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1、Designation: E650/E650M 12E650/E650M 17Standard Guide forMounting Piezoelectric Acoustic Emission Sensors1This standard is issued under the fixed designation E650/E650M; the number immediately following the designation indicates the yearof original adoption or, in the case of revision, the year of l
2、ast revision. A number in parentheses indicates the year of last reapproval.A superscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This document provides guidelines for mounting piezoelectric acoustic emission (AE) sensors.1.2 UnitsThe values stated
3、 in either SI units or inch-pound units are to be regarded separately as standard. The values statedin each system may not be exact equivalents; therefore, each system shall be used independently of the other. Combining valuesfrom the two systems may result in non-conformance with the standard.1.3 T
4、his standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibilityof the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatorylimitations prior to use.1.4 This international
5、 standard was developed in accordance with internationally recognized principles on standardizationestablished in the Decision on Principles for the Development of International Standards, Guides and Recommendations issuedby the World Trade Organization Technical Barriers to Trade (TBT) Committee.2.
6、 Referenced Documents2.1 ASTM Standards:2E976 Guide for Determining the Reproducibility of Acoustic Emission Sensor ResponseE1316 Terminology for Nondestructive Examinations3. Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 bonding agenta couplant that physically attaches the sen
7、sor to the structure.3.1.2 couplanta material used at the structure-to-sensor interface to improve the transfer of acoustic energy across theinterface.3.1.3 mounting fixturea device that holds the sensor in place on the structure to be monitored.3.1.4 sensora detection device that transforms the par
8、ticle motion produced by an elastic wave into an electrical signal.3.1.5 waveguide, acoustica device that couples acoustic energy from a structure to a remotely mounted sensor. For example,a solid wire or rod, coupled to a sensor at one end and to the structure at the other.3.2 Definitions:3.2.1 For
9、 definitions of additional terms relating to acoustic emission, refer to Terminology E1316.4. Significance and Use4.1 The methods and procedures used in mounting AE sensors can have significant effects upon the performance of thosesensors. Optimum and reproducible detection of AE requires both appro
10、priate sensor-mounting fixtures and consistentsensor-mounting procedures.5. Mounting Methods5.1 The purpose of the mounting method is to hold the sensor in a fixed position on a structure and to ensure that the acousticcoupling between the sensor and the structure is both adequate and constant. Moun
11、ting methods will generally fall into one of thefollowing categories:1 This guide is under the jurisdiction of ASTM Committee E07 on Nondestructive Testing and is the direct responsibility of Subcommittee E07.04 on Acoustic EmissionMethod.Current edition approved June 15, 2012June 1, 2017. Published
12、 July 2012June 2017. Originally approved in 1985. Last previous edition approved in 20072012 asE650 - 97E650 - 12.(2007). DOI: 10.1520/E0650-12.10.1520/E0650-17.2 For referencedASTM standards, visit theASTM website, www.astm.org, or contactASTM Customer Service at serviceastm.org. For Annual Book of
13、 ASTM Standardsvolume information, refer to the standards Document Summary page on the ASTM website.This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Becauseit may not be technicall
14、y possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current versionof the standard as published by ASTM is to be considered the official document.*A Summary of Changes section appears at the end of this stand
15、ardCopyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States15.1.1 Compression MountsThe compression mount holds the sensor in intimate contact with the surface of the structurethrough the use of force. This force is generally supplied by sprin
16、gs, torqued-screw threads, magnets, tape, or elastic bands. Theuse of a couplant is strongly advised with a compression mount to maximize the transmission of acoustic energy through thesensor-structure interface.5.1.2 BondingThe sensor may be attached directly to the structure with a suitable adhesi
17、ve. In this method, the adhesive actsas the couplant. The adhesive must be compatible with the structure, the sensor, the environment, and the examination procedure.6. Mounting Requirements6.1 Sensor SelectionThe correct sensors should be chosen to optimally accomplish the acoustic-emissionAE examin
18、ationobjective. SensorSelection parameters to be considered are as follows: size, sensitivity, frequency response, surface-motionresponse, and environmental and material compatibility. environmental compatibility, background noise, source locationrequirements, and material properties of the structur
19、e under examination. When a multichannel acoustic-emission examination isbeing conducted, a subset of sensors with characteristics similar to each other should be selected. See Guide E976 for methods ofcomparing sensor characteristics.6.1.1 If the examination objective is to includeAE source locatio
20、n, sensor selection may be governed by the material propertiesof the structure and may affect subsequent sensor spacing due to attenuation. It may be necessary to evaluate attenuation effectsas part of the pre-examination procedure. If performed, the attenuation data shall be retained as part of the
21、 experimental record.6.1.2 When a multichannel acoustic-emission examination is being conducted, a subset of sensors with characteristics similarto each other should be selected. See Guide E976 for methods of comparing sensor characteristics.6.2 Structure PreparationThe contacting surfaces should be
22、 cleaned and mechanically prepared. This will enhance thedetection of the desired acoustic waves by assuring reliable coupling of the acoustic energy from the structure to the sensor.Preparation of these surfaces must be compatible with the construction materials used in both the sensor and the stru
23、cture. Possiblelosses in acoustic energy transmission caused by coatings such as paint, encapsulants, loose-mill scale, weld spatter, and oxidesas well as losses due to surface curvature at the contact area must be considered.6.2.1 The location of each sensor should be measured and marked accordingl
24、y on the structure and recorded as part of theexamination record.6.2.2 If surface preparation requires removing paint from a metal surface, the paint may be removed with a grinder or othermechanical means, down to bare metal. The area of paint removal should be slightly larger than the diameter of t
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