NFPA 318-2015 Standard for the Protection of Semiconductor Fabrication Facilities (Effective Date 5 19 2014).pdf

1、NFPA318 Standard for the Protection of Semiconductor Fabrication Facilities 2015 Edition NFPA, 1 Batterymarch Park, Quincy, MA 02169-7471 An International Codes and Standards Organization 1/14ISBN: 978-145590906-3 (Print)ISBN: 978-145590946-9 (PDF)IMPORTANT NOTICES AND DISCLAIMERS CONCERNING NFPASTA

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29、tandards can be viewed at no cost at www.nfpa.org/freeaccess.Copyright 2014 National Fire Protection Association. All Rights Reserved.NFPA318Standard for theProtection of Semiconductor Fabrication Facilities2015 EditionThis edition of NFPA 318, Standard for the Protection of Semiconductor Fabricatio

30、n Facilities, wasprepared by the Technical Committee on Semiconductor and Related Facilities. It was issuedby the Standards Council on April 29, 2014, with an effective date of May 19, 2014, andsupersedes all previous editions.This edition of NFPA 318 was approved as an American National Standard on

31、 May 19, 2014.Origin and Development of NFPA 318The Committee on Cleanrooms was formed in 1988 and held its first meeting during Mayof that year. The Committee was organized into chapter subcommittees that separately pre-pared individual chapters and related appendix material for review by the full

32、committee atmeetings held October 1988, March 1989, September 1989, March 1990, September 1990,and June 1991.The standard was submitted and adopted at the Fall Meeting in Montreal in 1991. The1992 edition was the first edition of this standard.The standard was revised in 1995.The 1998 and 2000 editi

33、ons were partial revisions of the standard.The 2002 edition of this standard incorporated Article 51 of NFPA 1, Uniform Fire Code, andwas reformatted to comply with the Manual of Style for NFPATechnical Committee Documents.The 2006 edition contained a new chapter addressing quantity limits for hazar

34、dous mate-rials following coordination of this information with NFPA 5000, Building Construction andSafety Code.The 2009 edition clarified the requirements for both Type 1 and Type 2 subatmosphericgas systems. Revisions also included the removal of seismic considerations, in order to focusthe scope

35、of the document.The 2012 edition provided additional modifications to the requirements for subatmo-spheric gas systems (SAGS) based on the technical committees review of necessary safe-guards for these systems. Several reference standards were updated as part of this revision.The 2015 edition has be

36、en completely reorganized in an effort to make the standard moreuser friendly. The term subatmospheric gas system has been revised to subatmospheric gas sourcethroughout the standard to clarify its meaning. Various categories of hazardous materialshave been identified, and the concept of “HPM risk a

37、ssessment” has been introduced. Newrequirements have been added throughout the standard that encompass the following sub-ject matter: hazardous materials, liquid chemical storage and handling, gas storage and han-dling, production and support equipment, waste treatment, and fire protection.3181NFPA

38、and National Fire Protection Association are registered trademarks of the National Fire Protection Association, Quincy, Massachusetts 02169.Technical Committee on Semiconductor and Related FacilitiesVincent A. DeGiorgio, ChairFM Global, RI IRep. FM GlobalRick Guevara, SecretaryTechnology Risk Consul

39、ting Services, LLC, CA SEWayne J. Aho, Xtralis, Inc., MA MRep. National Electrical Manufacturers AssociationBernard Argo, Sandia National Laboratories/USDOE,NM ERobert G. Backstrom, UL LLC, IL RTPaul Breder, Intertek Testing Services, CA RTAlastair R. Brown, Rushbrook Consultants, Ltd.,Scotland SESt

40、eve C. Dryden, Poole Fire Protection, Inc., KS SEJonathan M. Eisenberg, The RJA Group, Inc., MA SEStephen L. Fox, Global Foundries Inc., NY UJeffrey S. Kidd, Hiller New England Fire Protection, Inc.,MA IMRep. Fire Suppression Systems AssociationRichard M. Lattanzio, Spansion, Inc., TX URandy Luckman

41、, XL Global Asset Protection Services,CA INorman J. MacDonald, III, FlexHead Industries, Inc.,MA MThomas L. Multer, Reliable Automatic SprinklerCompany, Inc., SC MRep. National Fire Sprinkler AssociationEugene Y. Ngai, Chemically Speaking LLC, NJ SEDavid A. Quadrini, Consultant, TX SERodney D. Randa

42、ll, Zurich Services Corporation, CA IGordon C. Robbins, Texas Instruments, Inc., TX UJohn G. Ronan, Micron Technology, Inc., ID UCharles F. Rowe, Global Risk Consultants Corporation,IL SELawrence E. Shea, Shea Technology, NV MScott E. Swanson, Intel Corporation, OR URandell T. Thompson, American Int

43、ernational Group,Inc. (AIG), TX ISteven R. Trammell, Sematech, TX UJeffrey S. Tubbs, Arup, MA SEJoshua C. Vogel, U.S. Department of Defense, MD UDerek A. White, Hughes Associates, Inc., MD SEMatthew T. Wyman, Koetter Fire Protection InternationalInc., TX MAlternatesWilliam P. Adams, Apollo America,

44、GA M(Alt. to W. J. Aho)Jeffrey S. Grove, The RJA Group, Inc., NV SE(Alt. to J. M. Eisenberg)Ricky R. Jackson, Northstar Fire Protection of Texas,Inc., TX M(Alt. to T. L. Multer)Mark W. Slight, Intel Corporation, CA U(Alt. to S. E. Swanson)Dwayne E. Sloan, UL LLC, NC RT(Alt. to R. G. Backstrom)Bobbie

45、 L. Smith, Micron Technology, Inc., ID U(Alt. to J. G. Ronan)Ernest L. Timlin, IBM Corporation, NY U(Voting Alt. for IBM)Jeff B. Vickery, Spansion LLC, TX U(Alt. to R. M. Lattanzio)Josh Yacknowitz, Arup, NY SE(Alt. to J. S. Tubbs)NonvotingDennis H. Collins, Florence, OR SE(Member Emeritus)Dennis Kir

46、son, NAVFAC MIDLANT, VA SE(Member Emeritus)Chad Duffy, NFPA Staff LiaisonThis list represents the membership at the time the Committee was balloted on the final text of this edition. Since that time,changes in the membership may have occurred. A key to classifications is found at the back of the doc

47、ument.NOTE: Membership on a committee shall not in and of itself constitute an endorsement of the Association orany document developed by the committee on which the member serves.Committee Scope: This Committee shall have primary responsibility for documents on the fire protectionfor fabrication fac

48、ilities and comparable fabrication processes for semiconductor, display panel, photovol-taic, and related facilities. When bulk gas systems are involved the responsibility begins at a point downstreamof the source valve.3182 PROTECTION OF SEMICONDUCTOR FABRICATION FACILITIES2015 EditionContentsChapt

49、er 1 Administration . 31851.1 Scope . 31851.2 Purpose 31851.3 Retroactivity 31851.4 Equivalency . 31851.5 Units 3185Chapter 2 Referenced Publications . 31852.1 General 31852.2 NFPA Publications . 31852.3 Other Publications 31862.4 References for Extracts in MandatorySections 3186Chapter 3 Definitions 31863.1 General 31863.2 NFPA Official Definitions 31863.3 General Definitions . 3187Chapter 4 Building Construction and RelatedServices 31894.1 General 31894.2 Classification of Occupan