NFPA 318-2018 Standard for the Protection of Semiconductor Fabrication Facilities (Effective Date 08 21 2017).pdf

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31、no cost at www.nfpa.org/docinfo.318-1 NFPA and National Fire Protection Association are registered trademarks of the National Fire Protection Association, Quincy, Massachusetts 02169. Copyright 2017 National Fire Protection Association . All Rights Reserved. NFPA 318 Standard for the Protection of S

32、emiconductor Fabrication Facilities 2018 Edition This edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, was prepared by the Technical Committee on Semiconductor and Related Facilities. It was issued by the Standards Council on August 1, 2017, with an effective

33、 date of August 21, 2017, and supersedes all previous editions. This edition of NFPA 318 was approved as an American National Standard on August 21, 2017. Origin and Development of NFPA 318 The Committee on Cleanrooms was formed in 1988 and held its rst meeting during May of that year. The committee

34、 was organized into chapter subcommittees that separately prepared individual chapters and related appendix material for review by the full committee at meetings held October 1988, March 1989, September 1989, March 1990, September 1990, and June 1991. The standard was submitted and adopted at the Fa

35、ll Meeting in Montreal in 1991. The 1992 edition was the rst edition of this standard. The standard was revised in 1995. The 1998 and 2000 editions were partial revisions of the standard. The 2002 edition of this standard incorporated Article 51 of NFPA 1, Uniform Fire Code, and was reformatted to c

36、omply with the Manual of Style for NFPA Technical Committee Documents. The 2006 edition contained a new chapter addressing quantity limits for hazardous materials following coordination of this information with NFPA 5000, Building Construction and Safety Code. The 2009 edition claried the requiremen

37、ts for both Type 1 and Type 2 subatmospheric gas systems. Revisions also included the removal of seismic considerations, in order to focus the scope of the document. The 2012 edition provided additional modications to the requirements for subatmospheric gas systems (SAGS) based on the technical comm

38、ittees review of necessary safeguards for these systems. Several reference standards were updated as part of this revision. The 2015 edition was completely reorganized in an effort to make the standard more user friendly. The term subatmospheric gas system was revised to subatmospheric gas source th

39、roughout the standard to clarify its meaning. Various categories of hazardous materials were identied, and the concept of “HPM risk assessment” was introduced. New requirements were added throughout the standard that encompassed the following subject matter: hazardous materials, liquid chemical stor

40、age and handling, gas storage and handling, production and support equipment, waste treatment, and re protection. For the 2018 edition, the most noteworthy changes are major revisions to the requirements for both gas-detection systems as well as smoke detection systems. Both topics were technically

41、modied and also revised for clarity. Gas detection criteria has been revised to clarify when detection is needed and where it is required to be physically provided. The smoke detection requirements were revised to include not just minimum capabilities of detectors but also coverage areas, alert and

42、alarm sensitivities, and maximum transport times taken from NFPA 76, which were based on research conducted by the Fire Protection Research Foundation.PROTECTION OF SEMICONDUCTOR FABRICATION FACILITIES 318-2 2018 Edition Technical Committee on Semiconductor and Related Facilities Rick Guevara, Chair

43、 Technology Risk Consulting Services, LLC, CA SE John G. Ronan, Secretary Micron Technology, Inc., ID U Bernard Argo, Sandia National Laboratories/USDOE, NM E Robert J. Ballard, Victaulic Company of America, PA M Rep. Fire Suppression Systems Association Alastair R. Brown, Rushbrook Consultants, Ltd

44、., Scotland SE Allan Cose, Intertek Testing Services, CA RT Jonathan M. Eisenberg, Arup, MA SE Richard Ffrench, FM Global, RI I Amanda Gonzalez, Global Foundries, Inc., NY U Younghoon Joo, Samsung F&M Insurance, South Korea I Steven W. Joseph, Honeywell/Xtralis, Inc., OR M Richard M. Lattanzio, Span

45、sion, Inc., TX U Randy Luckman, Global Asset Protection Services, CA I Thomas L. Multer, Reliable Automatic Sprinkler Company, Inc., SC M Rep. National Fire Sprinkler Association Eugene Y. Ngai, Chemically Speaking LLC, NJ SE David A. Quadrini, Consultant, TX SE Rodney D. Randall, Zurich Services Co

46、rporation, CA I Charles F. Rowe, TUV SUD America Inc./Global Risk Consultants Corporation, IL SE Scott E. Swanson, Intel Corporation, OR U Randell T. Thompson, American International Group, Inc. (AIG), TX I Steven R. Trammell, Environmental and Occupational Risk Management, Inc. (EORM), TX SE Joshua

47、 C. Vogel, U.S. Department of Defense, MD U Derek A. White, JENSEN HUGHES, MD SE Matthew T. Wyman, Koetter Fire Protection International Inc., TX M Alternates Bruce H. Clarke, American International Group, Inc. (AIG), NC I (Alt. to Randell T. Thompson) Brett Jay Davis, Cypress Semiconductor/Spansion

48、, Inc., TX U (Alt. to Richard M. Lattanzio) Vincent DeGiorgio, Samsung F&M Insurance, South Korea I (Alt. to Younghoon Joo) Stephen L. Fox, Global Foundries Inc., NY U (Alt. to Amanda Gonzalez) Jeffrey S. Grove, JENSEN HUGHES, NV SE (Alt. to Derek A. White) Ricky R. Jackson, Northstar Fire Protectio

49、n of Texas, Inc., TX M (Alt. to Thomas L. Multer) Phil Mazzurco, Siemens Industry, Inc., NJ M (Voting Alt.) Joseph V. Porada, Zurich Services Corporation, NV I (Alt. to Rodney D. Randall) Bryan K. Powell, Global Asset Protection Services, VA I (Alt. to Randy Luckman) Mark W. Slight, Intel Corporation, CA U (Alt. to Scott E. Swanson) Dwayne E. Sloan, UL LLC, NC RT (Voting Alt.) Bobbie L. Smith, Micron Technology, Inc., ID U (Alt. to John G. Ronan) Jeffrey S. Tubbs, Arup, MA SE (Alt