ImageVerifierCode 换一换
格式:PDF , 页数:5 ,大小:19.06KB ,
资源ID:1018456      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-1018456.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(REG NASA-LLIS-0810-2000 Lessons Learned Thermal Cycling.pdf)为本站会员(eastlab115)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

REG NASA-LLIS-0810-2000 Lessons Learned Thermal Cycling.pdf

1、Best Practices Entry: Best Practice Info:a71 Committee Approval Date: 2000-04-17a71 Center Point of Contact: GRCa71 Submitted by: Wil HarkinsSubject: Thermal Cycling Practice: As a minimum, run eight thermal cycles over the approximate temperature range for hardware that cycles in flight over ranges

2、 greater than 20oC. The last three thermal cycles should be failure free.Programs that Certify Usage: This practice has been used on ATLAS, CENTAUR, Space Electronic Rocket Tests (SERTs) 1 and 2, Communication Technology Satellite (CTS), GOES, COBE, NOAA, LANDSAT, Solar Maximum Mission.Center to Con

3、tact for Information: GRCImplementation Method: This Lesson Learned is based on Reliability Practice number PT-TE-1402, from NASA Technical Memorandum 4322A, Reliability Preferred Practices for Design and Test.Benefit:Demonstrates readiness of the hardware to operate in the intended cyclic environme

4、nt. Precipitates defects from design or manufacturing processes that could result in flight failures.Implementation Method:Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-As part of ATP, run at least eight thermal cycles over the temperature range ex

5、perienced by the hardware during storage, shipping, launch, flight, and reentry. The maximum and minimum temperatures anticipated should be exceeded by 10 degrees C. The last three thermal cycles should be failure-free.Equipment must stabilize at these limits before cycling to the opposing limit. Eq

6、uipment generally should be operated within the anticipated thermal range rather than at the thermal limits.Thermal cycling should be conducted in a vacuum if the test item is designed to operate in a vacuum.Technical Rationale:Thermal cycle modeling has shown that the general form of the thermal cy

7、cling test math model is given by Equation (1).refer to D descriptionD: Where:a71 TE = Test Effectivenessa71 F = Fraction of total failures that can be recipitated by a thermal cyclea71 Pd= Probability of detectiona71 lO= Failure rate at TOa71 N = Number of thermal cyclesa71 K = A constanta71 DT = T

8、 - TOa71 T = Operating temperature for la71 TO= Operating temperature for lOFig. 1 shows that the failures available are the sum of three parts:1. Failures detected by thermal cycle tests2. Undetected failures3. Failures not precipitatedProvided by IHSNot for ResaleNo reproduction or networking perm

9、itted without license from IHS-,-,-refer to D descriptionD Figure 1: General Form of TC Test Model For single temperature range of 50oC, the test effectiveness equation reduces to Equation (2).refer to D descriptionD Figure 2 shows a plot of Equation (2) based on a probability of detection, Pd, of 0

10、.9. The equation is based on values of lOand K that were found by solving two simultaneous equations.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-refer to D descriptionD Figure 2. Test Effectiveness Plot for lT = 50oC Printed circuit boards (PCBs)

11、 are especially prone to solder joint cracking. The design is required to minimize the mechanical forces, as generated by thermal mismatch of materials or vibration, in the solder joints.References:1. GDCD BNZ 69-007, Curssell, G. M., “Atlas and Centaur Component Acceptance Test Plan,“ 1984.2. NASA

12、TMX-53731, Van Orden, R. E., “Mounting of Components to Printed Wiring Boards,“ 1968.3. Laube, R. B., “Space Vehicle Thermal Cycling Test Parameters,“ Proceeding of the Institute of Environmental Sciences, 1983.4. Nelson, C. E., “System Level Reliability Thermal Cycling,“ Proceeding of the Institute

13、 of Environment Sciences, 1983.Impact of Non-Practice: Design and manufacturing defects that could have been detected during ground testing manifest themselves during flight.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Related Practices: N/AAdditional Info: Approval Info: a71 Approval Date: 2000-04-17a71 Approval Name: Eric Raynora71 Approval Organization: QSa71 Approval Phone Number: 202-358-4738Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1