ImageVerifierCode 换一换
格式:PDF , 页数:5 ,大小:17.86KB ,
资源ID:1018460      下载积分:10000 积分
快捷下载
登录下载
邮箱/手机:
温馨提示:
如需开发票,请勿充值!快捷下载时,用户名和密码都是您填写的邮箱或者手机号,方便查询和重复下载(系统自动生成)。
如填写123,账号就是123,密码也是123。
特别说明:
请自助下载,系统不会自动发送文件的哦; 如果您已付费,想二次下载,请登录后访问:我的下载记录
支付方式: 支付宝扫码支付 微信扫码支付   
注意:如需开发票,请勿充值!
验证码:   换一换

加入VIP,免费下载
 

温馨提示:由于个人手机设置不同,如果发现不能下载,请复制以下地址【http://www.mydoc123.com/d-1018460.html】到电脑端继续下载(重复下载不扣费)。

已注册用户请登录:
账号:
密码:
验证码:   换一换
  忘记密码?
三方登录: 微信登录  

下载须知

1: 本站所有资源如无特殊说明,都需要本地电脑安装OFFICE2007和PDF阅读器。
2: 试题试卷类文档,如果标题没有明确说明有答案则都视为没有答案,请知晓。
3: 文件的所有权益归上传用户所有。
4. 未经权益所有人同意不得将文件中的内容挪作商业或盈利用途。
5. 本站仅提供交流平台,并不能对任何下载内容负责。
6. 下载文件中如有侵权或不适当内容,请与我们联系,我们立即纠正。
7. 本站不保证下载资源的准确性、安全性和完整性, 同时也不承担用户因使用这些下载资源对自己和他人造成任何形式的伤害或损失。

版权提示 | 免责声明

本文(REG NASA-LLIS-0814-2000 Lessons Learned Electrical Electronic and Electromechnical (EEE) Parts Screening.pdf)为本站会员(eastlab115)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

REG NASA-LLIS-0814-2000 Lessons Learned Electrical Electronic and Electromechnical (EEE) Parts Screening.pdf

1、Best Practices Entry: Best Practice Info:a71 Committee Approval Date: 2000-04-18a71 Center Point of Contact: GSFCa71 Submitted by: Wil HarkinsSubject: Electrical, Electronic, and Electromechnical (EEE) Parts Screening Practice: Implement a 100% nondestructive screening test on EEE parts prior to ass

2、embly, which would prevent early-life failures (generally referred to as infant mortality).Programs that Certify Usage: This practice has been used on all Goddard Space Flight Center (GSFC) flight programs.Center to Contact for Information: GSFCImplementation Method: This Lesson Learned is based on

3、Reliability Practice number PT-TE-1401, from NASA Technical Memorandum 4322A, Reliability Preferred Practices for Design and Test.Benefit:EEE Parts Screening provides a lower rework cost during manufacturing and lower incident of component failures during flight.Implementation Method:Screening for e

4、ach part can be established as follows:Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-a71 Refer to NASAs compilation of screening criteria for use with various EEE part types. An example may be found in Appendix C of the GSFC Preferred Parts List.a7

5、1 If Class S parts are purchased, the screening tests shown in Table 1 have already been conducted. When Class S parts are not available, the screens of Table 1 should be used.a71 Failure criteria during screening should specify Percent Defectives Allowable (PDA) and allowable parameter drift. Typic

6、al PDA criterion is 5%.A sample listing of failure mechanisms, the associated distribution of failures, and related screening tests are provided in Table 2.refer to D descriptionProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-D Table 1. 100% Parts Sc

7、reening Matrixrefer to D descriptionD Table 2. Failure Mechanisms/Screening MethodsTechnical Rationale:Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-The EEE parts manufacturing is controlled by military specification requirements covering a variety

8、 of areas such as: starting materials, process controls, electrical or electromechanical performance characteristics, and periodic inspections of some characteristics of finished product. Despite these requirements, defects that cause early-life failures can be randomly built into a product. The scr

9、eening tests are designed to be destructive to parts with particular defects but nondestructive to good parts.As an example, integrated circuits such as CMOS are highly susceptible to electrical performance failures caused by ionic contamination on the die surface. The contamination can be introduce

10、d by any of several uncontrollable avenues during manufacture and cannot be ruled out as an occurrence in any given lot of parts. To avoid early-life failures at higher assembly levels, the lot of parts is subjected to a 100% static burn-in. The burn-in is designed to drive contamination into the di

11、e areas where it will interfere with proper circuit operation and cause electrical failures before parts are installed on boards.References:1. NASA GSFC Preferred Parts List (NPPL) 18/19.2. Seidl, Raymond H., Garry, William J., “Pi Factors Revisited,“ Proceedings of the Annual Reliability and Mainta

12、inability Symposium, 1990.Impact of Non-Practice: Without screening, there could be latent failure mechanisms that could cause flight delays and/or failures. For example, two circuits on the Solar Maximum Mission (SMM) spacecraft failed. The failed parts were analyzed upon return from the repair mis

13、sion and found to contain defects that would have been revealed through screening. In one case, the microcircuit had a metallization flaw; in the second, the CMOS microcircuit had contamination on the die. In another example, screening tests performed on microcircuits resulted in an 85% failure rate

14、. Subsequent failure analysis revealed that improper parts had been used.Related Practices: N/AAdditional Info: Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Approval Info: a71 Approval Date: 2000-04-18a71 Approval Name: Eric Raynora71 Approval Organization: QSa71 Approval Phone Number: 202-358-4738Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1