SAE ARD 4461-1990 ASSEMBLY AND SOLDERING CRITERIA FOR HIGH QUALITY HIGH RELIABILITY SOLDERED WIRE AND CABLE TERMINATION IN AEROSPACE VEHICLES《宇航飞行器中高质量 高可靠性焊接的电线和电缆终端设备的组装和焊接标准》.pdf

1、ARDU61 * Issued 1990-11-05 I Submitted for recognition as an American National Standard I I ASSEMBLY AND SOLDERING CRITERIA FOR HIGH QUALITYIHIGH RELIABILITY SOLDERED WIRE AND CABLE TERMINATION IN AEROSPACE VEHICLES TABLE OF CONTENTS 1. SCOPE 4 1.1 Applicability 4 1.1.1 Safety Considerations 4 2. RE

2、FERENCES . 4 2.1 Government Documents . 4 2.1.1 Specifications 4 2.1.2 Standards 4 2.1.3 Handbooks 5 2.2 Other Publications 5 . . 3. DEFINITIONS 5 3.1 Terms and Definitions 5 4. 4.1 4.1.1 4.2 4.3 4.4 4.5 4.6 4.6.1 4.6.2 4.6.3 . GENERAL REQUIREMENTS 5 Conflict 5 Line Drawings 5 Acceptance Criteria 6

3、Visual Inspection 6 Electrostatic Discharge 6 Soiderability 6 Facilities and Equipment 6 The Soldering Facility 6 Conductor Preparation Tools 7 Soldering Equipment 7 . . . *NOTE: THIS DOCUMENT IS A NONCONSENSUS DRAFT REPORT MADE AVAILABLE BY AN SAE TECHNICAL COMMITTEE DURING THE PROCESS OF STANDARDS

4、 DEVELOPMENT. THE INFORMATION CONTAINED IN THIS REPORT IS BEING DISSEMINATED SOLELY FOR COMMENT PURPOSE AND SHOULD NOT BE RELIED UPON AT THIS TIME. SAE Technical Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this rep

5、ort is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefrom, is the sole responsibility of the user.“ Copyright 19 9 bciety of Automotive Engineers, Inc. AI rights resewed. Printed in U.S.A. ! SA AR04461 4.7 4.7.1 4.7.2

6、 4.7.3 4.8 4.8.1 4.8.2 4.8.3 4.8.4 4.8.5 4.8.6 4.8.7 4.8.8 4.9 4.9.1 4.9.2 4.9.3 4.9.4 4.9.5 4.9.6 4.10 4.10.1 4.10.2 4.11 4.11.1 4.11.2 4.12 5 . 5.1 5.1.1 5.1.2 5.1.3 5.1.4 5.1.5 5.1.6 5.2 5.2.1 5.2.2 5.2.3 TABLE OF CONTENTS (Continued) Materials 9 Solder . 9 Flux . 9 Cleaning Solvents 10 Preparati

7、on for Soldering 11 Insulation Removal . 11 Preparatlon of Gold Plated Areas . 12 Preparation of Solder Cups . 13 Tinning of Stranded Wire . 14 Preparation of Shielded Wire . 14 Precleaning 14 Handling and Storage of Parts 14 Component Workmanship 14 Manual Soldering . 15 Preparation of the Solderin

8、g Iron 15 Use of Solder Pots . 15 Flux Application With Soldering Iron Heating . 15 Heat Application With Soldering Iron . 16 Solder Application With Soldering Iron . 16 Cooling 18 Soldering by Use of Controlled Soldering Devices . 18 Preparation and Assembly . 18 Heat Application . 18 Post Solderin

9、g Operations 19 Rework of Unsatisfactory Solder Connections 19 Cleaning 19 Workmanship 19 DETAIL REQUIREMENTS 20 Inspection Criteria for Manually Soldered Connections 20 Finish . 20 Wetting and Filleting 20 Coverage . 20 Insulation Clearance . 20 Physical Attributes . 20 Criteria for Specific Applic

10、ations . 21 Inspection Criterla for Controlled Soldering Devices . 21 Finish . 29 Wetting and Filleting 29 Criteria for Specific Applications . 29 I . FIGURES 1 Typical Thermal Stripper . 7 2 Mechanical Hand Wire Stripper 8 3 Insulation Stripping Examples 11 4 Solder Application and Bridging 16 5 Cu

11、p Type Terminals . 17 6 Prefilling Hollow Cylindrical Terminals 17 7 Soldering of Hollow Cylindrical Connections 18 -2- 1 SA ARD4461 a 9 10 11 12 13 14 15 16 17 18 TABLE OF CONTENTS (Continued) FIGURES (Continued) Hook Terminal. Solder Connection . 22 Hook Terminal. Wire Connection Methods . 23 Cup

12、Terminal. Wire Insertion . 25 Cup Terminal. Solder Connection 27 Wire and Lead Soldering to Contacts 28 Controlled Soldering Devices . Round Wires to Terminals 29 Controlled Soldering Devices . Round Wire Splices 33 Controlled Soldering Devices . Solder Contacts . 35 Controlled Soldering Devices . S

13、hield Braid Splices 38 Controlled Soldering Devices . Flat Conductor Terminations . 40 Controlled Soldering Devices . Shield Terminations . 31 TABLES 1 Acceptable Solvents and Cleaners . 10 2 Maximum Allowable Nicked and Broken Strands 12 3 Solder Bath Maximum Contaminant Levels . 13 I -3- I SA ARD4

14、461 1. SCOPE: 1.1 Applicability: This standard is applicable to manual soldering and machine soldering processes uti 1 izing control led soldering devices, for electrical connect for wiring and cabling used in aerospace vehicles. component or device herein is not to be construed as authorizing the u

15、se the component or device. Description of a on s of 1.1.1 Safety Considerations: This standard may involve hazardous materials, operations, and equipment. This standard does not purport to address all of the safety problems associated with its use. It is the responsibility of users of this standard

16、 to comply with appropriate safety and health practices and regulatory limitations. 2. REFERENCES: 2.1 Government Documents: Specifications, standards, and handbooks. 2.1.1 Specifications: 2.1 . 1 .l federal : O-E-760 Ethyl Alcohol (Ethanol); Denatured Alcohol; Proprietary Solvents and Special Indus

17、trial Solvents 0-M-232 Methanol (Methyl Alcohol) OQ-S-571 Solder: Tin Alloy, Tin-Lead Alloy, and Lead Alloy TT-1-735 Isopropyl Alcohol 2.1.1.2 Military: MIL-f-14256 MI L-C-8 1 302 MIL-T-81533 MIL-S-83519 MIL-C-85447 2.1.2 Standards: 2.1.2.1 Military: MI L-STD-202 MIL-STD-1686 Flux, Soldering, Liquid

18、 (Rosin Base) Cleaning Compound, Solvent, Trichlorotrifluoroethane 1, 1, 1 Trichloroethane (Methyl Chloroform) Inhibited, Shield Termination, Solder Style, Insulated, Heat- Cleaning Compounds, Electrical and Electronic Components Vapor Degreasing Shrinkable, Environment Resistant Test Methods for El

19、ectronic and Electrical Component Parts Electrostatic Discharqe Control Program for Protection of Assemblies and Electrical and Elecb-onic Parts Equipment (Excluding Electrical Devi ces) y Initiated Explosive -4- *8 SAE ARD4461 2.1.3 Handbooks: 2.1.3.1 Military: DOD-HDBK-263 Electrostatic Discharge

20、Control Handbook for Protection of Electrical and Electronic Parts, Assemblies, and Equipment (Excluding Electrically Initiated Explosive Dev 1 ces ) (Copies of specifications, standards, handbooks, drawings, and publications required by contractors in connection with specific acquisition functions

21、should be obtained from the contracting activity or as directed by the government.) I 2.2 Other Publications: The following document(s) form a part of this standard to the extent specified herein. The issues of the documents which are indicated as DOD adopted shall be the issue in the DODISS and the

22、 supplement thereto, if appl i cab1 e. ASTM D 235 Specification for Mineral Spirits (Petroleum Spirits) (Hydrocarbon Drycleaning Solvents) ASTM D 1007 Specification for Sec-Butyl Alcohol ASTM D 1193 Standard Specification for Reagent Water ASTM D 3622 Speciflcation for n-Propyl Alcohol (1-Propanol)

23、(Applications for copies should be addressed to: ASTM, 1916 Race Street, Philadelphia, PA 19103-1187.) SAE ARP1931 (Applications for copies should be addressed to: Society of Automotive Engineers, 400 Commonwealth Drive, Warrendale, PA 15096.) Glossary of Terms With Specific Reference to Electrical

24、Wire and Cable 3. DEFINITIONS: 3.1 Terms and Definitions: The definitions appllcable to this standard shall be in accordance with SAE ARP1931. 4. GENERAL REQUIREMENTS: 4.1 Conflict: In the event of conflict between the requirements of this standard and the appllcable procurlng activity approved asse

25、mbly drawing(s), the requirements of the assembly drawing(s) shall govern. 1 4.1.1 Line Drawings: Line drawings, illustrations, and photographs depicted 1 herein are provided as aids for determining compliance with the written requirements and shall not take precedence over the written requirements.

26、 -5- I SA ARD4461 4.2 Acceptance Criteria: Acceptance requirements and illustrations for use as comparison criteria for soldering shall be as specified herein. The written requirements shall take precedence over the illustrations. 4.3 Visual Inspection: One hundred percent visual inspection of all m

27、anual soldered connections and assemblies shall be performed using the magnification aids of 4.6.1.3. The soldered connections and assemblies shall conform to the requirements specified herein. performed as part of a statistical process control system approved by the procuring activity. Sampling may

28、 be used in lieu of 1001. inspection when 4.4 Electrostatic Discharge: Where applicable, electrostatic discharge control criteria for the protection of electrical and electronic parts, components, assemblies, and equipment shall be in accordance with MIL-STD-1686 and DOD-HDBK-263. 4.5 Sol der ab i 1

29、 i ty : All surfaces to be soldered shall be tested no more than 120 davs Drior to soldering for conformance to the requirements except that steam aging shall not be required requirements shall be pretinned prior to term 4.6 Facilities and Equipment: 4.6.1 The Soldering Facility: 4.6.1.1 Environment

30、al Conditions: When humiditv 4- I- - - of MIL-STD-202, Test Method 208, nation. Items not meeting these s 30% or lower, electrostatic discharge (ESD) sensi tive devices and Gsembl les shall be processed only if extraordinary electrostatic discharge controls in accordance with MIL-STD-1686 are utiliz

31、ed. 4.6.1.2 Cleanliness: Work areas shall be maintained in a clean and orderly condition. All visible dirt, grease, flux, solder spatter, chips, and other foreign objects or debris (FOD) shall be promptly removed. Eating, smoking, or drinking at the soldering work station shall not be permitted. 4.6

32、.1.3 Magnification Aids and Lighting: Magnification aids and lighting used for assembly and inspection shall be commensurate with the site of the item being processed and conform to the following requirements: a. Shall be suitable to permit inspection of each solder connection in its. entirety. b. T

33、he optical system shall have a magnification power not less than 2X nor more than 4X, and shall be capable of rendering appropriate contrast, proportional dimensions , and adequate resolution. c. Light source for shadowless illumination of the area being viewed. -6- 4.6.2 Conductor Preparation Tools

34、: 4.6.2.1 Thermal Strippers: Thermal strippers utilized to remove insulation from stranded and solid conductor wires shall be of a type that can be regulated to provide the required temperature (see Figure 1). Temperature controls shall be sufficient to prevent damage to the wire or unstripped insul

35、ation. I I I 4.6.2.2 Mechanical Strippers: Mechanical strippers utilized to remove FIGURE 1 - Typical Thermal Stripper (see 4.6.2.1) insulation from stranded or solid conductor wires may be of the hand operated or automatic high volume machine type. Hand operated strippers the type of insulation to

36、be removed. Automatic high volume machine strippers shall be of a type utilizing either fixed dies, dies adjustable to calibrated stops, or roller cutters adjustable to calibrated stops. Dies, whether adjustable or fixed, shall be properly maintained to assure consistently sharp and even cuts withou

37、t damage to the wires or unstripped insulation. , shall be of a fixed die configuration (see Figure 2). designed to strip 4.6.2.3 Wire and Lead Cutting Tools: Cutters shall be of a shear type, designed to cut squarely without leaving burrs, excessive ridges, or sharp points. 4.6.2.4 Bending Tools: a

38、utomatic or hand implements and shall be of a material that will not cut, nick, or otherwise damage solid or stranded wires, leads, integral insulation, or any other insulation or insulators added prior to the bending operation. Bending tools used for wire or lead bending may be 4.6.3 Soldering Equi

39、pment: Soldering equipment shall not produce levels of electromagnetic, electrostatic, electromechanical, electrical or other forms of energy which will be detrimental to the item(s) being soldered. Protective devices to prevent potential differences greater than 2 mV shall be used when voltage sens

40、itive devices are being soldered. Transformer type soldering guns shall not be used. -7- Di e-type blades SA ARD4461 4.6.3.1 4.6.3.2 4.6.3.3 4.6.3.4 FIGURE 2 - Mechanical Hand Wire Stripper (see 4.6.2.21 Soldering Irons: Soldering irons shall be of the temperature controlled type, controllable withi

41、n 26C (11 1F) of the preselected id1 ing temperature unless It can be demonstrated to the procuring activity that uncontrolled soldering irons are essential for a particular appl ication. The size and shape of the soldering iron and tip shall permit soldering with maximum ease and control without ca

42、using damage to adjacent areas or connections. The soldering iron or resistance heating element shall heat the connection area rapidly and maintain proper soldering temperature at the connection throughout the soldering operation, and shall have a thermal capacity adequate to make a solder connectio

43、n in not more than 5 s. Soldering Iron Tips: The soldering iron tips or resistance soldering element shall be sized to the operations involved. Soldering iron tips shall be made of commercially pure copper, tellurium copper, or lead copper and shall be plated or coated with another metal that preven

44、ts degradation of the tip in molten solder. Soldering Iron Holders: satisfactory for the soldering iron utilized. The holder shall leave the soldering iron element and tip unsupported without applying excessive mechanical stress or heat sinking. A soldering iron holder shall be of a type Solder Pots

45、: Solder pots shall be capable of maintaining the solder temperature within 26C (211 “F) of the preselected temperature specified In 4.9.2. Solder pots shall be grounded. I- -8- SA ARD4461 4.6.3.5 4.6.3.6 4.6.3.7 4.6.3.8 Holding Devices: Tools, fixtures, and materials used to hold or restrain wires

46、and components shall be of a type which will not damage or deform the wires, leads, wire insulation, or components. If toothed clips are utilized, the jaws of the clips shall be plastic covered. Antiwicking Tools: Antiwicking tools shall be of a design which fits only a specific conductor gage size

47、and shall be marked with that conductor gage s 1 ze . Wiping Pads: Sponge pads for wipe cleaning the soldering iron tip shall be moistened and finely textured. Heating Tools for Controlled Soldering Devices: used for installing controlled soldering devices, and for installing heat-shrinkable insulat

48、ing products over soldered terminations, shall produce a stream of heated air of sufficient volume and temperature for the heat-shrinkable product and applicati.on. Suitable air reflectors shall be used to concentrate and control the heated air around products being installed and to prevent damage t

49、o adjacent components or insulation. Controlled infrared or other type heating tools may be used where suitable for the heat-shrinkable product and application. Hot-air heating tools 4.7 Materials: Materials used in the soldering processes stipulated in this standard shall be as specified herein. It is possible that the materials and processes specified may be incompatible in some combinations. It shall be the responsibility of the manufacturer to select those materials and processes that will produce acceptable products. 4.7.1 Solder: Solder composition Sn60, Sn62, or Sn63, sol