SAE AS 6294 1-2017 Requirements for Plastic Encapsulated Microcircuits in Space Applications.pdf

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4、70 (outside USA) Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.org SAE values your input. To provide feedback on this Technical Report, please visit http:/standards.sae.org/AS6294/1 AEROSPACE STANDARD AS6294 /1 Issued 2017-11 Requirements for Plastic Encapsulated Mic

5、rocircuits in Space Applications RATIONALE This document defines the requirements for screening, qualification and lot acceptance testing for use of plastic encapsulated microcircuits (PEMs) in space flight applications. The level of testing on PEMs should be dependent on a risk based approach, the

6、application, reliability and radiation requirements of the mission. It shall be the responsibility of the user to have the tests conducted using the requirements specified herein. Reporting procedures shall be documented on how the tests are conducted and results obtained. This document addresses ma

7、ny of the concerns associated with PEMs such as narrower operating temperature ranges and greater susceptibility to infant mortality and moisture absorption than space grade products. ACKNOWLEDGMENT Members of Task Group for Plastic Encapsulated Microcircuits (PEMs) Screening and Lot Acceptance Test

8、ing of the SSTCG12 Solid State Devices Committee developed this document. We would like to thank them for their dedication to this effort. To each of them, the members of the GEIA G-12 Solid State Devices Committee extend their gratitude. SAE INTERNATIONAL AS6294/1 Page 2 of 22 TABLE OF CONTENTS 1.

9、SCOPE 3 1.1 Purpose . 3 2. REFERENCES 3 2.1 Applicable Documents 3 2.1.1 Military . 3 2.1.2 Industry 3 2.1.3 NASA. 4 2.1.4 Aerospace . 4 2.2 Acronyms 4 3. General Requirements 5 4. Device Classification Determination . 5 4.1 Purpose of Determining Device Classification 5 5. DEVICE CHARACTERIZATION .

10、 7 5.1 Purpose of Device Characterization . 7 5.2 Part Information . 8 5.3 Construction Analysis (CA) . 9 5.3.1 Purposes of CA for PEMs . 9 5.4 Device Evaluation Analysis . 11 5.4.1 The Need for an Evaluation Analysis 11 5.4.2 Recommended Evaluations 11 5.4.3 Customization of Tests 12 5.4.4 Molding

11、Material Glass Transition Temperature (Tg) . 12 5.5 Radiation Hardness . 12 6. REQUIREMENTS FOR SCREENING 15 7. BURN-IN AND ELECTRICAL MEASUREMENT REQUIREMENTS 18 8. REQUIREMENTS FOR LOT ACCEPTANCE TESTING 18 9. NOTES 22 9.1 Revision Indicator 22 APPENDIX A PEM Capability Requirements Determination.

12、 23 Figure 1 Device classification determination 1/ - QML Class N is non-space, VID (vendor item drawing), EP (enhanced product) . 6 Figure 2 Typical device characterization flow for PEMs . 7 Figure 3 Typical construction analysis test flow for PEMs 10 Figure 4 Typical screening test flow for PEMs 1

13、5 Figure 5 Typical lot acceptance testing flow for PEMs . 20 Table 1 Manufacturer information 8 Table 2 Tests for CA 9 Table 3 Recommended evaluations or tests 11 Table 4 Screening requirements for PEMs 1/, 8/ . 16 Table 5A Lot sampling plan 1/ 18 Table 5B Lot sampling plan 1/ 19 Table 6 Lot accepta

14、nce requirements for PEMS 1/ . 21 SAE INTERNATIONAL AS6294/1 Page 3 of 22 1. SCOPEThis document establishes common industry practices and recommended screening, qualification, and lot acceptance testing of Plastic Encapsulated Microcircuits (PEMs) for use in space application environments. 1.1 Purpo

15、se Plastic encapsulated products have been used based on testing and analysis for high reliability applications such as those for Medical, Military hardware and in Space applications. There are some complex Electrical, Electronic and Electromechanical (EEE) products that may only exist in plastic pa

16、ckages and have been risk mitigated for the intended applications. However, the industry has different ways of screening and qualifying PEMs. This document was created by a subcommittee of SAE SSTG G12 to standardize a PEMs flow and address possible future extension of the QML system to include PEMs

17、 for space. The committee has utilized existing documents such as NASA Goddard PEMS-INST-001 (Instructions for Plastic Encapsulated Microcircuits (PEMs) Selection, Screening, and Qualification), NASA EEE-INST-002 (Instructions for EEE Parts Selection, Screening, Qualification, and Derating), NASA Ma

18、rshall Space Flight Center MSFC-STD-3012 (EEE Parts Management and Control Requirements for MSFC Space Flight Hardware) and SAE SSB-1 (Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications), as well as reviews of multiple indu

19、stry practices. In many cases, MSFC-STD-3012 (Revision A, dated 2/12/2012) was used as the baseline for this document. 2. REFERENCES2.1 Applicable DocumentsThe following publications form a part of this document to the extent specified herein. The latest issue of SAE publications shall apply. The ap

20、plicable issue of other publications shall be the issue in effect on the date of the purchase order. In the event of conflict between the text of this document and references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and r

21、egulations unless a specific exemption has been obtained. 2.1.1 Military a. QPDSIS-38535 Qualified Products Database, Supplemental Information Sheet for Electronics b. MIL-HDBK-814 1994 Ionizing Dose and Neutron Hardness Assurance Guidelines for Microcircuit and Semiconductor Devices c. MIL-PRF-3853

22、5 Performance Specification, General Specification for Integrated Circuits (Microcircuits) Manufacturing d. MIL-STD-1580 Destructive Physical Analysis for Electronic, Electromagnetic, and Electromechanical Parts e. MIL-STD-883 Test Method Standard for Microcircuits 2.1.2 Industry a. JESD22-A101 Stea

23、dy State Temperature Humidity Bias Life Test b. JESD22-A102 Accelerated Moisture Resistance - Unbiased Autoclave c. JESD22-A110 Highly Accelerated Temperature and Humidity Stress Test (HAST) d. JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing e. JESD22-A1

24、18 Accelerated Moisture Resistance - Unbiased HAST f. JESD22-B106 Resistance to Solder Shock for Through-Hole Mounted Devices SAE INTERNATIONAL AS6294/1 Page 4 of 22 g. JESD234 Test Standard for the Measurement of Proton Radiation Single Event Effects in Electronic Devices h. JESD57 Test Procedures

25、for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy Ion Irradiation i. J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices j. J-STD-033 Handling, Packing, Shipping and use of Moisture/Reflow Sensitive Surface Mount Device

26、s k. J-STD-035 Acoustic Microscopy for Non-hermetic Encapsulated Electronic Components l. ASTM F1192 Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices m. ASTM F1892 Standard Guide for Ionizing Radiation (Total Dose) Effects T

27、esting of Semiconductor Devices n. ASTM E1640 Standard Test Method for Assignment of the Glass Transition Temperature By Dynamic Mechanical Analysis o. ASTM E595 Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment p. AEC Q006

28、Qualification Requirements for Components Using Copper (Cu) Wire Interconnections 2.1.3 NASA a. MSFC-STD-3012 Electrical, Electronic, and Electromechanical (EEE) Parts Management and Control Requirements for MSFC Space Flight Hardware b. NASA-STD-6001 Flammability, Out-gassing, and Compatibility Req

29、uirements and Test Procedures 2.1.4 Aerospace a. TOR-2006(8583)-5236 Technical Requirements for Electronic Part, Material, and Processes used in Space Vehicle 2.2 AcronymsAOQ Average Outgoing Quality BGA Ball Grid Array BI Burn-in BJT Bipolar Junction Transistor CA Construction Analysis CDM Charge D

30、evice Model COTS Commercial-off-the-shelf Cpk Process Capability Index CTE Coefficient of Thermal Expansion DDD Displacement Damage Degradation EEE Electrical, Electronic and Electromechanical LDRS Low Dose Rate Sensitivity EOS Electrical Overstressed ESD Electrostatic Discharge FA Failure Analysis

31、HAST Highly Accelerated Stress Test HBM Human Body Model HSL Higher specification limit HTOL High Temperature Operational Life test SAE INTERNATIONAL AS6294/1 Page 5 of 22 KTL One sided tolerance limit constant LAT Lot Acceptance Testing LSL Lower specification limit MSL Moisture Sensitivity Level P

32、EMs Plastic Encapsulated Microcircuits PETS Pre-irradiation elevated thermal stress PMPCB Parts, Material and Process Control Board QML Qualified Manufacturers List RLAT Radiation lot acceptance testing RMS Root Mean Square SEE Single-Event Effects SEM Scanning Electron Microscopy SMT Surface Mount

33、Technology SPC Statistical Process Control Tg Glass transition temperature TID Total Ionization Dose 3. GENERAL REQUIREMENTS3.1 PEMs intended for spaceflight applications should meet all of the requirements within this document including but notlimited to the following screening, and lot acceptance

34、requirements. 3.2 Qualification Devices subjected to characterization testing and evaluations of failure mechanisms of Section 5 or have data to show the technology meets or exceeds these requirements. The qualification shall comply with the requirements of Section 6 for screening and Section 8 for

35、lot acceptance requirements. 3.3 The lot acceptance testing in Table 6 is limited to the specific lot that is being subjected to screening. It is expected that the manufacturer of the component (OCM) has performed product qualification using industry acceptable standards such as JESD47 (Stress-Test-

36、Driven Qualification of Integrated Circuits) or AEC-Q100 (Automotive Electronic Council) documents. The product qualification is intended to qualify the product and process of the device being considered for screening and lot acceptance. The user of the lot being subjected to screening and lot accep

37、tance may consider additional testing to be added to lot acceptance tests based upon available data from OCM or as required by application for which the lot is being used. 3.4 Historical Project planning requires establishment of each end item to which EEE part Grade is required as described in NASA

38、 MSFC-STD-3012. However, this document will only contain requirements that will meet known highest reliability for Space application. The following sections will provide guidance for the screening, qualification and QCI testing of PEMs. 4. DEVICE CLASSIFICATION DETERMINATION4.1 Purpose of Determinin

39、g Device Classificationa. Product that may require further validation or if a product can be committed to proceed to the normal screening and lotacceptance requirements shall be determined by following the process as shown in Figure 1.4.2 Commercial-off-the-shelf (COTS) part is a part designed prima

40、rily for commercial applications for which the item manufacturer solely establishes and controls the specifications for performance, configuration and reliability, including design, materials, processes, testing and physical/failure analysis without communicating additional or custom requirements im

41、posed by users. For example, this would include any type of part from a catalog without any additional parts level testing. 4.3 Qualified manufacturers list (QML) refers to PEMs parts qualified by QML suppliers as defined by MIL-PRF-38535. Such parts may not need to go through the device characteriz

42、ation flow, because they have previously been through such a characterization as part of their initial space qualification. It is however recognized that PEMs do not currently meet all requirements of MIL-PRF-38535 for space applications. SAE INTERNATIONAL AS6294/1 Page 6 of 22 Applicable only for c

43、urrent or active products Figure 1 - Device classification determination 1/ - QML Class N is non-space, VID (vendor item drawing), EP (enhanced product) No Product Classification COTS QML or Vendor Hi-Rel 1/ Device Characterization Pass? Yes Commit to Screening verify moisture sensitivity level (MSL

44、) classification 4. Die-related characterization (materials anddesign)Passivation Interlayer dielectric system Metallization system such as thickness, composition, EM rules, Antenna rules 5. Electrical performance characterization Electrical at ambient, minimum, maximum temperature ranges (datasheet

45、 and the application specification range limits) to establish margins for utilization in Worst Case Analysis SAE INTERNATIONAL AS6294/1 Page 12 of 22 5.4.3 Customization of Tests The above sets of evaluations or tests may have to be customized including sample size depending on the CA result, applic

46、ation condition and known potential risks. It is important to understand the manufacturers lot control and homogeneity for traceability and these items must be considered as part of this evaluation activity. 5.4.4 Molding Material Glass Transition Temperature (Tg) a. Reliability of PEMs that are man

47、ufactured with low Tg molding compounds (Tg500Tests 2, 3, 4, and 5 (Pass/Fail only) 24(0) 32(0) 46(0) 64(0) 90(0) Test 6, 7 (Life and Temp Cycle) Subgroup 1 per Figure 5 12(0) 16(0) 23(0) 32(0) 45(0) Test 8 (HAST) 12(0) 16(0) 23(0) 32(0) 45(0) 1/ Minimum size of sample to be tested to assure that a

48、homogeneous lot, with a 90% confidence, that a lot having a PDA = 5% will not be accepted. Note that most PEMs lots are not homogeneous. SAE INTERNATIONAL AS6294/1 Page 19 of 22 Table 5B - Lot sampling plan 1/ Lot Acceptance Test(s) (Refer to Table B) Samples Required Based on Lot Size 4060 61120 12

49、1240 241500 500Tests 2, 3, 4, and 5 (Pass/Fail only) 36(0) 48(0) 69(0) 96(0) 135(0) Test 6 (Life) 12(0) 16(0) 23(0) 32(0) 45(0) Test 7 (Temp Cycle) Subgroup 1 optional per Figure 5 12(0) 16(0) 23(0) 32(0) 45(0) Test 8 (HAST) 12(0) 16(0) 23(0) 32(0) 45(0) 1/ Minimum size of sample to be tested to assure that a homogeneous lot, with a 90% confidence, that a lot having a PDA = 5% will not be accepted. Note that most PEMs lots are n