SAE J 1213-2-1988 Glossary of Reliability Terminology Associated with Automotive Electronics Information Report.pdf

1、SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirelyvoluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefro

2、m, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions.QUESTIONS REGARDING THIS DOCUMENT: (724) 772-8512 FAX: (724) 776-0243TO PLACE A DOCUMENT

3、 ORDER; (724) 776-4970 FAX: (724) 776-0790SAE WEB ADDRESS http:/www.sae.orgCopyright 1988 Society of Automotive Engineers, Inc.All rights reserved. Printed in U.S.A.SURFACEVEHICLE400 Commonwealth Drive, Warrendale, PA 15096-0001STANDARDSubmitted for recognition as an American National StandardJ1213/

4、2ISSUEDOCT88Issued 1988-10GLOSSARY OF RELIABILITY TERMINOLOGY ASSOCIATED WITH AUTOMOTIVE ELECTRONICSForewordThis Document has not changed other than to put it into the new SAE Technical Standards BoardFormat.This glossary has been compiled to assist, by serving as a reference, in the communication b

5、etween theautomotive electronics engineer and the reliability engineer.1. ScopeThis compilation of terms, acronyms and symbols was drawn from usage which should be familiar tothose working in automotive electronics reliability. Terms are included which are used to describe how items,materials and sy

6、stems are evaluated for reliability, how they fail, how failures are modeled and how failures areprevented. Terms are also included from the disciplines of designing for reliability, testing and failure analysisas well as the general disciplines of Quality and Reliability Engineering. This glossary

7、is intended to augmentSAE J1213, Glossary of Automotive Electronic Terms.2. References2.1 Applicable PublicationsThe following publications form a part of this specification to the extent specifiedherein. Unless otherwise indicated, the latest version of SAE publications shall apply.2.1.1 SAE PUBLIC

8、ATIONAvailable from SAE, 400 Commonwealth Drive, Warrendale, PA 15096-0001.SAE J1213Glossary of Automotive Electronic TermsSAE AE-9 1987Automotive Electronics Reliability Handbook2.2 Related PublicationsA listing of applicable military and other organizational reference documents, fromwhich many of

9、these terms and definitions were drawn, is provided as a source of alternate or relateddefinitions.MilitaryMIL-STD-105DSampling Procedures and Tables for Inspection by AttributesMIL-STD-202ETest Methods for Electronic and Electrical Component PartsMIL-HDBK-217DReliability Prediction of Electronic Eq

10、uipmentMIL-STD-280ADefinitions of Item Levels, Item Exchangeability, Models, and Related TermsMIL-STD-414Sampling Procedures and Tables for Inspection by Variables for Percent DefectiveMIL-STD-756BReliability Models and PredictionMIL-STD-781CReliability Design Qualification and Production Acceptance

11、 Tests ExperimentalSAE J1213/2 Issued OCT88-2-MIL-STD-790BReliability Assurance Program for Electronic Parts SpecificationMIL-STD-810CEnvironmental Test MethodsMIL-STD-883BTest Methods and Procedures for MicroelectronicsMIL-STD-1313Microelectronics Terms and DefinitionsMIL-Q-9858AQuality Program Req

12、uirementsAR-92Quality Program RequirementsMIL-S-195001Semiconductor Devices, General Specification forMIC M38510DMicrocircuits, General Specifications forMIL-STD-470Maintainability Program Requirements for Systems and EquipmentsMIL-STD-471AMaintainability Verification/Demonstration/EvaluationMIL-HDB

13、K-472Maintainability PredictionMIL-STD-891Contractor Parts Control and Standardization ProgramMIL-STD-701Preferred and Guidance List of Semiconductor DevicesMIL-STD-198ASelection and Use of CapacitorsMIL-STD-199BSelection and Use of ResistorsMIL-STD-1562List of Standard MicrocircuitsMIL-STD-976Certi

14、fication Requirements for JAN MicrocircuitsEIAReliability Bulletin No. IA General Guide for Technical Reporting of Electronic Reliability MeasurementReliability Bulletin No. 4AReliability QualificationsReliability Bulletin No. 5Equipment Reliability Specification GuidelineReliability Bulletin No. 10

15、Selection and Validation of Low Population and/or State of the Art PartsReliability Bulletin No. 9Failure Mode and Effects AnalysesReliability Bulletin No. 8Equipment Burn-InEngineering Bulletin No. 17User Guidelines for Quality and Reliability Assurance of LSI ComponentsEngineering Bulletin No. 11U

16、ser Guidelines for Microelectronic Reliability EstimationJEDEC Standard No. 22Test Methods and Procedures for Solid State Devices Used in Transportation/Automotive ApplicationsOtherASQC 1973Glossary and Tables for Statistical Quality ControlASQC Procurement Quality Control - 2nd EditionANSI/ASQC A3-

17、1978Quality Systems TerminologyANSI/ASQC A2-1978Terms, Symbols and Definitions for Acceptance SamplingANSI/ASQC A1-1978Definitions, Symbols, Formulas and Tables for Control ChartsHow to Speak Fluent Quality- National Semiconductor Co.RDH 376Reliability Design Handbook - Reliability Analysis CenterWP

18、S-1Analysis Techniques for Mechanical Reliability - Reliability Analysis Center1987 Desk Manual- Microelectronic Manufacturing and TestingThe American Heritage Dictionary- 2nd College Edn. 1982 Houghton Mifflin Co.3. Definitions3.1 Accelerated Life TestA life test under test conditions that are more

19、 severe than usual operating conditions.It is necessary that a relationship between test severity and the probability distribution of life be ascertainable.3.2 Acceleration Factora. The factor by which the failure rate can be increased by an increased environmental stress.b. The ratio between the ti

20、mes necessary to obtain the same portion of failure in two equal samplesunder two different sets of stress conditions, involving the same failure modes and mechanisms.SAE J1213/2 Issued OCT88-3-3.3 Accept/reject TestA test, the result of which will be the action to accept or reject something, for ex

21、ample, anhypothesis or a batch of incoming material.3.4 Acceptable Quality Level (AQL)The maximum percent defective which can be considered satisfactory as aprocess average, or the percent defect whose probability of rejection is designated by .3.5 Acceptance NumberThe largest number of defects that

22、 can occur in an acceptance sampling plan and stillhave the lot accepted.3.6 Acceptance Sampling PlanAn accept/reject test whose purpose is to accept or reject a lot of items ormaterial.3.7 AccessibilityA measure of the relative ease of admission to the various areas of an item.3.8 Achieved Reliabil

23、ityThe reliability demonstrated at a given point in time under specified conditions of useand environment.3.9 Activation Energya. The energy level at which a specific microelectronic failure mechanism becomes active (in electron volts).b. The slope of the time temperature regression line in the Arrh

24、enius equation (in electron volts).3.10 Active ElementA part that converts or controls energy, for example, transistor, diode, electron tube, relay.3.11 Active Element GroupAn active element and its associated supporting (passive) parts, for example, anamplifier circuit, a relay circuit, a pump and

25、its plumbing and fittings.3.12 AgingThe effect whereby the probability density function of strength is changed (strength is reduced) withtime.3.13 AllocationThe process of assigning reliability requirements to individual units to attain the desired systemreliability.3.14 Alpha Particle Induced Soft

26、ErrorsIntegrated circuit memory transient errors due to emission of alphaparticles during radioactive decay of uranium or thorium contamination in the IC packaging material.3.15 AmbientUsed to denote surrounding, encompassing, or local conditions. Usually applied to environments,for example, ambient

27、 temperature, ambient pressure.3.16 ApportionmentSynonym of Allocation.3.17 Arithmetic MeanThe arithmetic mean of n numbers is the sum of the n numbers, divided n.3.18 Arrhenius ModelA mathematical representation of the dependence of failure rate on absolute temperatureand activation energy. The mod

28、el assumes that degradation of a performance parameter is linear with time withthe failure rate a function of temperature stress. The temperature dependence is taken to be the exponentialfunction:SAE J1213/2 Issued OCT88-4-(Eq. 1)where:1= mean time to failure at T12= mean time to failure at T2T = ju

29、nction temperature in KE = activation energy in eVk = Boltzmans constant (8.617 105eV/K)3.19 Arrhenius Acceleration FactorThe acceleration factor F is the factor by which the time to fail can bereduced by increased temperature.(Eq. 2)3.20 Assessmenta. A critical appraisal, including qualitative judg

30、ments about an item, such as importance of analysisresults, design criticality and failure effect.b. The use of test data and/or operational service data to form estimates of population parameters and toevaluate the precision of these estimates.3.21 AttributeA term used to designate a method of meas

31、urement whereby units are examined by noting thepresence (or absence) of some characteristic or attribute in each of the units in the group under considerationand by counting how many units do (or do not) possess it. Inspection by attributes can be of two kinds eitherthe unit of product is classifie

32、d simply as defective or nondefective, or the number of defects in the unit ofproduct is counted, with respect to a given requirement or set of requirements.3.22 Attribute TestingTesting to evaluate whether or not an item possesses a specified attribute.3.23 Automatic Test Equipment (ATE)Test equipm

33、ent that contains provisions for automatically performing aseries of pre programmed tests.3.24 Availability (Operational Readiness)The probability that at any point in time the system is either operatingsatisfactorily or ready to be placed in operation on demand when used under stated conditions.3.2

34、5 AverageA general term. It often means arithmetic mean, but can refer to s-expected value, median, mode,or some other measure of the general location of the data values.3.26 Average Outgoing Quality (AOQ)The average quality of outgoing product after 100% inspection of rejectedlots, with replacement

35、 by good units of all defective units found in inspection.3.27 Average Outgoing Quality Limit (AOQL)The maximum average outgoing quality (AOQ) for a samplingplan.3.28 Bake-outTo subject an unsealed item to an elevated temperature to drive out moisture and unwanted gasesprior to other process or seal

36、ing.3.29 Bathtub CurveA plot of failure rate of an item (whether repairable or not) vs. time. The failure rate initiallydecreases, then stays reasonably constant, then begins to rise rather rapidly. It has the shape of a bathtub.Not all items have this behavior.12exp Ek()1T21T1()=F 12 Ek()1T21T2()ex

37、p=SAE J1213/2 Issued OCT88-5-3.30 Biasa. The difference between the s-expected value of an estimator and the value of the true parameter.b. Applied voltage.3.31 Binomial DistributionThe probability of r, or fewer successes in n independent trials, given a probability ofsuccess p in a single trial, i

38、s given by the cumulative binomial distribution:(Eq. 3)3.32 Binomial FunctionThe probability of exactly x successes in n independent trials, given a probability ofsuccess p in a single trial, is given by the binomial probability function:(Eq. 4)3.33 Bonda. An interconnection which performs a permane

39、nt electrical and/or mechanical function.b. To join with adhesives.3.34 Bond Lift OffThe failure mode whereby the bonded lead separates the surface to which it was attached.3.35 Bond StrengthIn wire bonding, the pull force at rupture of the bond interface.3.36 Breadboard ModelA preliminary assembly

40、of parts to test the feasibility of an item or principle withoutregard to eventual design or form. Usually refers to a small collection of electronic parts.3.37 Burn-inThe initial operation of an item to stabilize its characteristics, and to minimize infant mortality in thefield.3.38 Capabilitya. A

41、measure of the ability of an item to achieve mission objectives given the conditions during themission.b. The spread of performance of a process in a state of statistical control; the amount of variation fromcommon causes identified after all special causes of variation have been eliminated.3.39 C C

42、hartControl chart for number of nonconformities observed in some specified inspection. The unitsshould be alike in size and in the apparent likelihood of the existence of the nonconformity, in order that thearea of opportunity for nonconformity be constant from unit to unit.3.40 Central LineThe line

43、 on a control chart that represents the average or median value of the items beingplotted. It is shown as a solid line.3.41 CheckoutTests or observations on an item to determine its condition or status.3.42 Coefficient Of VariationThe standard deviation divided by the mean, multiplied by 100 and exp

44、ressed as apercentage.3.43 Complexity LevelA measure of the number of active elements required to perform a specific systemfunction.Pr x r()F (r; p, n)nxpx1p()nxx0=r=xp n,;()nxpx1p()nxx,=0, 1, 2, n0 p1=SAE J1213/2 Issued OCT88-6-3.44 ComponentA self-contained combination of parts, subassemblies, or

45、assemblies which perform a distinctivefunction in the overall operation of an equipment. Often used interchangeably with (electronic) part.3.45 ConfidenceA specialized statistical term referring to the reliance to be placed in an assertion about thevalue of a parameter of a probability distribution.

46、3.46 Confidence Coefficienta. A measure of assurance that a statement based upon statistical data is correct.b. The probability that an unknown parameter lies within a stated interval or is greater or less than somestated value.3.47 Confidence IntervalThe interval within which it is asserted that th

47、e parameter of a probability distributionlies.3.48 Confidence Level(Eq. 5)where:a = the risk (%)3.49 Confidence LimitA bound of a confidence interval.3.50 ConsistencyA statistical term relating to the behavior of an estimator as the sample size becomes verylarge. An estimator is consistent if it con

48、verges to the population value as the sample size becomes large.3.51 Constant Failure Ratea. A term characterizing the instantaneous failure rate in the middle, or “useful life“ period of the BathtubCurve model of item life.b. A term characterizing the hazard rate, h(t), of an item having an exponen

49、tial reliability function.3.52 ContaminationA general term used to describe an unwanted material that adversely affects the physical orelectrical characteristics of an item.3.53 Continuous Sampling PlanIn acceptance sampling, a plan intended for application to a continuous flow ofindividual units of product that involves acceptance or rejection on a unit-by-unit inspection and sampling.Continuous sampling plans are usually characterized by requiring that each period of 1