TIA EIA-455-4C-2002 FOTP-4 Fiber Optic Component Temperature Life Test《FOTP-4 光纤元部件的温度寿命试验》.pdf

1、 TIA/EIA-455-4C (Revision of TIA/EIA-455-4B) June 2002FOTP-4 Fiber Optic Component Temperature Life Test TIA/EIA-455-4C-2002 APPROVED: JUNE 6, 2002 REAFFIRMED: JANUARY 29, 2014 NOTICE TIA Engineering Standards and Publications are designed to serve the public interest through eliminating misundersta

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6、t No. 3-4467-RV3-RF1, formulated under the cognizance of the TIA TR-42 Telecommunications Cabling Systems, TR-42.13 Subcommittee on Passive Optical Devices and Fiber Optic Metrology). Published by TELECOMMUNICATIONS INDUSTRY ASSOCIATION Technology (b) there is no assurance that the Document will be

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19、USE OF THE CONTENTS HEREOF, AND THESE CONTENTS WOULD NOT BE PUBLISHED BY TIA WITHOUT SUCH LIMITATIONS. TIA/EIA-455-4C iFOTP-4 Fiber Optic Component Temperature Life Test Contents Foreword iii 1 Introduction .1 2 Applicable documents.1 3 Apparatus .2 4 Sampling and specimens3 5 Procedure .4 6 Calcula

20、tions or interpretation of results.8 7 Documentation8 8 Specification information.9 Annex A (informative) Comparison between FOTP-4 and IEC, ISO, and CCIT requirements.11 TIA/EIA-455-4C iiThis page left blank. TIA/EIA-455-4C iiiFOTP-4 Fiber Optic Component Temperature Life Test Foreword (This forewo

21、rd is informative and is not part of this standard.) From TIA Standards Proposal No. 4467-RV3, formulated under the cognizance of TIA FO-6.3, Subcommittee on Fiber Optic Interconnecting Devices. This FOTP is part of the series of test procedures included within Recommended Standard TIA/EIA-455. NOTE

22、 This FOTP was previously published in TIA/EIA-455-4B as FOTP-4. TIA/EIA-455-4C ivThis page left blank. TIA/EIA-455-4C 11 Introduction 1.1 Intent The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an

23、elevated temperature for a specific length of time.1The procedure is applicable to all types of fiber optic devices including connectors, splices, passive branching devices (couplers), etc. 1.2 Failure Modes Potential failure modes for this test include, but are not limited to: a. Loss of optical co

24、ntinuity, either during or at the end of the test, b. Fiber breakage or damage, c. Breakage of other components, d. Loss of component integrity, e. Degradation of optical transmission and/or reflection characteristics. 2 Applicable documents The following documents form a part of this FOTP to the ex

25、tent specified herein: TIA/EIA-455-B Standard Test Procedure for Fiber Optic Fibers, Cables, Transducers, Sensors, Connecting and Terminating Devices, and Other Fiber Optic Components FOTP-6 (EIA/TIA-455-6B) Cable Retention Test Procedure for Fiber Optic Cable Interconnecting Devices 1This method is

26、 similar to method 1005.1 of MIL-STD-1344A, except that this procedure includes supplementary measurements. TIA/EIA-455-4C 2FOTP-13 (TIA/EIA-455-13A) Visual and Mechanical Inspection of Fiber Optic Components, Devices, and Assemblies FOTP-20 (TIA/EIA-455-20A) Measurement of Change in Optical Transmi

27、ttance FOTP-34 (TIA/EIA-455-34A) Interconnection Device Insertion Loss Test FOTP-107 (TIA/EIA-455-107A) Determination of Component Reflectance or Link/System Return Loss Using a Loss Test Set MIL-STD-1344A Test Methods for Electrical Connectors IEC 60068-2-2 Environmental testing Part 2: Tests. Test

28、s B: Dry heat IEC 61300-2-18 Fibre optic interconnecting devices and passive components Basic test and measurement procedures Part 2-18: Tests - Dry heat High temperature endurance 3 Apparatus The following apparatus and equipment are required to perform this test: 3.1 Chamber and Associated Equipme

29、nt Use a suitable chamber and associated equipment capable of maintaining, monitoring, and recording the test temperature to the tolerance specified and for the duration specified (Tables 1 and 2). Temperature measurements shall be made in a manner that will indicate the component exposure temperatu

30、re rather than the chamber source temperature. The chamber size or capacity shall be such that when components are under test, the chamber is capable of dissipating any internally generated heat (such heat can arise in a connector, for example, from power contact millivolt drop losses or from system

31、 power, in the case of active devices). Use thermocouples for monitoring internal temperature when necessary. Heat sinks may be required. TIA/EIA-455-4C 33.2 Other Equipment Optical and other test and inspection equipment shall be available as required by FOTPs -13, -20, -34, or -107, as appropriate

32、. Refer to the required FOTP for details. 4 Sampling and specimens 4.1 Samples Select samples randomly from production lots of the component to be tested as defined by the Detail Specification. 4.2 Specimen Preparation Sampled components shall be fully assembled as intended for use in accordance wit

33、h the manufacturers instruction. If the component is a connector, it shall be mated, and with the specified number of contacts and termini. Sealing plugs, optical fiber cables, strain relief attachments and other hardware, and other end preparation requirements shall be as specified in the Detail Sp

34、ecification. 4.3 Specimen Placement and Hookup After 5.1 is completed, and unless otherwise specified, the specimens and any attached optical, electrical, or composite cables, together with associated test fixtures, shall be normally positioned in the chamber so that there will be no restriction of

35、the air flow. if required, for composite components containing both optical and electrical transmission members, the monitoring and wiring of electrical channels shall be specified in the Detail Specification. All optical channels shall each be monitored separately. If optical or electrical measurem

36、ents are to be made at elevated temperatures (5.6), extend necessary cables and leads out of the chamber through access ports. Splices and connectors used for optical connection to the specimen shall be outside the temperature chamber. TIA/EIA-455-4C 45 Procedure 5.1 Pre-Exposure Inspection Before i

37、nstalling specimens in the test chamber, make a visual and physical examination of each specimen in accordance with FOTP-13 to assure that specimens have not been obviously damaged before test. 5.2 Installation in Chamber In turn, install each specimen to be tested in the test chamber (see 4.3). and

38、 test in accordance with 5.3 through 5.8. 5.3 Pre-Exposure Testing Perform any pre-exposure optical and electrical tests required by the Detail Specification. Unless otherwise required by the Detail Specification, measure the optical transmittance of all fibers in accordance with the requirements of

39、 FOTP-20. (Use of FOTP-34 to measure insertion loss may be specified by the Detail Specification as an alternative to FOTP-20. Additionally, the Detail Specification may require FOTP-107 be used to measure return loss.) Record results. Seal the test chamber. 5.4 Severity The severity of the test is

40、determined by the combination of the temperature and the duration of exposure. Tables 1 and 2 list nonmandatory preferred temperatures and test durations that may be specified by the Detail Specification. When the component to be tested is a composite device (optical and electrical), having provisio

41、ns for electrical contacts, the internal temperature of the component shall not exceed that specified in Table 1, or as specified in the Detail Specification, when the test is performed under electrical load conditions. TIA/EIA-455-4C 5Table 1 Preferred Temperature Exposures Exposure Temperature and

42、 Tolerance Device Internal Temperature Maximum C Former Codes Designation Number230 2 C 36 - 40 2 C 48 - 49 2 C 59 - 55 2 C 65 1 70 2 C 84 2 85 2 C 102 3 100 2 C 120 - 105 2 C 125 4 125 2 C 150 5 155 2 C 185 - 175 5 C 206 6 200 5 C 238 7 250 as specified3288 - 315 as specified3 363 -350 as specified

43、3 400 8 400 as specified3 460 -500 as specified3 575 9 The continuous or duty cycle dc current shall be regulated and recorded, and the current shall not exceed the rated current for the electrical contacts in the composite device. NOTE Prior to specifying the test temperature, a user should conside

44、r factors, such as, the component application and the melting temperatures of any materials that are included in the component to be tested (e.g., plastics). 2Test condition code number appearing in prior editions of FOTP-4. 3Tolerance as specified by the Detail Specification; if not specified, use

45、2% of the value given (from IEC 60068-2-2). TIA/EIA-455-4C 6Table 2 Preferred Temperature Exposure Durations Duration (hours) Former Code Letter45 - 25 - 50 - 72 - 96 A 100 - 250 B 336 - 500 C 1000 D 1500 E 2000 F 3000 G 5000 H 5.5 Temperature-Exposure Test 5.5.1 Gradually increase the chamber tempe

46、rature from room ambient to the temperature specified by the Detail Specification. Preferred exposure temperatures are shown in Table 1. 5.5.2 Maintain the specified temperature level for the period of time specified in the Detail Specification. Preferred exposure durations are shown in Table 2. 5.6

47、 High Temperature Exposure Test Measurements If specified by the Detail Specification, repeat the optical and electrical measurements made in 5.3 upon completion of the required temperature exposure time, and while the specimen(s) continues to be maintained at the specified temperature. Compare the

48、results of these measurements with those established in 5.3. Acceptance criteria for such measurements shall be as specified by the Detail Specification. NOTE Although “no measurable change in optical performance“ may be the goal, measurement inaccuracies would normally make this an impracticable li

49、mit; so some tolerance is needed. 5.7 Temperature Recovery Allow the chamber temperature to gradually return to room ambient. 4Test time condition code letter appearing in prior editions of FOTP-4. TIA/EIA-455-4C 75.8 Post-Exposure Test Measurements After temperature has returned to room ambient (EIA/TIA-455-B), unseal the test chamber. Unless otherwise specified in the Detail Specification, allow the specimen(s) to remain in the chamber under standard atmospheric conditions for a period of not less than 1 hour, no