1、UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL UL 1557 Electrically Isolated Semiconductor DevicesUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM ULUL COPYRIGHTED MATERIAL NOT AUTHORIZ
2、ED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL UL Standard for Safety for Electrically Isolated Semiconductor Devices, UL 1557 Fifth Edition, Dated December 29, 2011 SUMMARY OF TOPICS: This revision to ANSI/UL 1557 added Semiconductor Devices Incorporating Thermistor Type Dev
3、ices as New Supplement SA. Text that has been changed in any manner or impacted by ULs electronic publishing system is marked with a vertical line in the margin. Changes in requirements are marked with a vertical line in the margin and are followed by an effective date note indicating the date of pu
4、blication or the date on which the changed requirement becomes effective. The revised requirements are substantially in accordance with Proposal(s) on this subject dated August 29, 2014. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted
5、in any form by any means, electronic, mechanical photocopying, recording, or otherwise without prior permission of UL. UL provides this Standard as is without warranty of any kind, either expressed or implied, including but not limited to, the implied warranties of merchantability or tness for any p
6、urpose. In no event will UL be liable for any special, incidental, consequential, indirect or similar damages, including loss of prots, lost savings, loss of data, or any other damages arising out of the use of or the inability to use this Standard, even if UL or an authorized UL representative has
7、been advised of the possibility of such damage. In no event shall ULs liability for any damage ever exceed the price paid for this Standard, regardless of the form of the claim. Users of the electronic versions of ULs Standards for Safety agree to defend, indemnify, and hold UL harmless from and aga
8、inst any loss, expense, liability, damage, claim, or judgment (including reasonable attorneys fees) resulting from any error or deviation introduced while purchaser is storing an electronic Standard on the purchasers computer system. The requirements in this Standard are now in effect, except for th
9、ose paragraphs, sections, tables, gures, and/or other elements of the Standard having future effective dates as indicated in the note following the affected item. The prior text for requirements that have been revised and that have a future effective date are located after the Standard, and are prec
10、eded by a SUPERSEDED REQUIREMENTS notice. NOVEMBER 7, 2014 UL 1557 tr1UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL NOVEMBER 7, 2014 UL 1557 tr2 No Text on This PageUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIB
11、UTION WITHOUT PERMISSION FROM UL DECEMBER 29, 2011 (Title Page Reprinted: November 7, 2014) 1 UL 1557 Standard for Electrically Isolated Semiconductor Devices First Edition May, 1984 Second Edition May, 1993 Third Edition May, 1997 Fourth Edition June, 2006 Fifth Edition December 29, 2011 This ANSI/
12、UL Standard for Safety consists of the Fifth Edition including revisions through November 7, 2014. The most recent designation of ANSI/UL 1557 as an American National Standard (ANSI) occurred on November 7, 2014. ANSI approval for a standard does not include the Cover Page, Transmittal Pages, Title
13、Page, or effective date information. Comments or proposals for revisions on any part of the Standard may be submitted to UL at any time. Proposals should be submitted via a Proposal Request in ULs On-Line Collaborative Standards Development System (CSDS) at http:/. ULs Standards for Safety are copyr
14、ighted by UL. Neither a printed nor electronic copy of a Standard should be altered in any way. All of ULs Standards and all copyrights, ownerships, and rights regarding those Standards shall remain the sole and exclusive property of UL. COPYRIGHT 2014 UNDERWRITERS LABORATORIES INC. ANSI/UL 1557-201
15、4UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL NOVEMBER 7, 2014 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 2 No Text on This PageUL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION
16、FROM UL CONTENTS INTRODUCTION 1 Scope .4 2 Components 4 3 Units of Measurement .5 4 Undated References 5 5 Glossary .5 CONSTRUCTION 6 General 6 7 Insulating Materials 6 8 Live Parts 6 9 Wiring Terminals 6 10 Spacings 7 PERFORMANCE 11 General .7 12 Dielectric Voltage-Withstand Test 8 13 Limited Therm
17、al Aging Test .8 MANUFACTURING AND PRODUCTION-LINE TEST 14 Dielectric Voltage-Withstand Test .10 RATING 15 General 11 MARKING 16 General 11 SUPPLEMENT SA - SEMICONDUCTOR DEVICES INCORPORATING THERMISTOR TYPE DEVICES SA1 Scope SA1 SA2 Glossary SA1 SA3 Termistor Type Devices SA4 SA4 Rating SA4 SA5 Mar
18、king SA5 APPENDIX A Standards for ComponentsA1 NOVEMBER 7, 2014 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 3UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL INTRODUCTION 1 Scope 1.1 These requirements apply to semiconductor devices
19、 of the isolated-mounting type thyristors, transistors, diodes, and the like, and hybrid modules consisting of combinations of these devices. 1.2 These requirements do not apply to snubber and commutation circuits associated with thyristors, transistors or other analog semiconductor devices. 1.3 The
20、se requirements cover the isolation performance of thyristors, transistors, diodes, and the like, and their combination in module packages and constructional features that are pertinent to that performance. 1.4 These requirements apply to isolated semiconductors for use as components in products. Co
21、mpliance of an isolated semiconductor with these requirements does not determine that the semiconductor is acceptable for use as a component of an end product without further investigation. The acceptability of a semiconductor in any particular product depends upon its acceptability for continued us
22、e under the conditions that prevail in actual service. 2 Components 2.1 Except as indicated in 2.2, a component of a product covered by this Standard shall comply with the requirements for that component. See Appendix A, for a list of standards covering components generally used in the products cove
23、red by this Standard. 2.2 A component is not required to comply with a specic requirement that: a) Involves a feature or characteristic not required in the application of the component in the product covered by this standard, or b) Is superseded by a requirement in this standard. 2.3 A component sha
24、ll be used in accordance with its rating established for the intended conditions of use. 2.4 Specic components are incomplete in construction features or restricted in performance capabilities. Such components are intended for use only under limited conditions, such as certain temperatures not excee
25、ding specied limits, and shall be used only under those specic conditions. DECEMBER 29, 2011 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 4UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 3 Units of Measurement 3.1 Values stated with
26、out parentheses are the requirement. Values in parentheses are explanatory or approximate information. 4 Undated References 4.1 Any undated reference to a code or standard appearing in the requirements of this standard shall be interpreted as referring to the latest edition of that code or standard.
27、 5 Glossary 5.1 For the purposes of this Standard, the following denitions apply. 5.2 CASE TEMPERATURE External location on the semiconductor device or module package where temperatures are specied (and measured) in accordance with the manufacturers rating curve. 5.3 HERMETICAL SEAL Any material or
28、cover employed to prevent air inltration, that is, encapsulant. 5.4 INSULATING MATERIAL OPERATING TEMPERATURE The maximum temperature of the insulating material for either the semiconductor device or module when operating in accordance with the manufacturers specications, usually the maximum junctio
29、n temperature. 5.6 INSULATING MATERIALS Any material providing insulation between live parts, between the live parts and the metal heat-sink, or in direct contact with the live parts. Case material, that provides insulation between live parts and the metal heat-sink (usually over the surface of the
30、material) would be included. 5.7 ISOLATION VOLTAGE The maximum withstand potential at 60 Hz between live parts and metal mounting surface of the semiconductor. 5.8 JUNCTION TEMPERATURE The maximum allowable temperature of the semiconductor junction specied by the manufacturer. 5.9 MODULE PACKAGE An
31、assembly consisting of two or more semiconductor devices. 5.10 ON-STATE CURRENT The principle current when the semiconductor is in the ON-state. 5.11 SEMICONDUCTOR DEVICE Discrete isolated-mounting type electronic device in which the characteristic distinguishing electronic conduction takes place wi
32、thin a semiconductor, examples include thyristors, transistors, and diodes. 5.12 STORAGE TEMPERATURE Acceptable temperature range at which the semiconductor can be stored, without any power applied, as specied by the manufacturer. DECEMBER 29, 2011 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 15
33、57 5UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL CONSTRUCTION 6 General 6.1 A semiconductor shall be constructed in compliance with Sections71 0 . 7 Insulating Materials 7.1 Insulating materials shall be evaluated in accordance with the a
34、pplicable requirements for Polymeric Materials Use in Electrical Equipment Evaluations, UL 746C, and shall have a thermal index at least equal to the insulating material operating temperature. Exception: Insulating material that are encapsulated or hermetically sealed need only be subjected to the D
35、ielectric Voltage-Withstand Test, Section 12, and if the generic temperature rating of the material is exceeded, the Limited Thermal Aging Test, Section 13. 7.2 Insulating materials used to encapsulate devices shall: a) Have a minimum thickness of 1/32 inch (0.8 mm) and b) Operate within the generic
36、 temperature limitations as specied in the Standard for Polymeric Materials Long Term Property Evaluations, UL 746B, and may be applied independently onto a cured insulating material employed beneath it. Exception: Encapsulating material subjected to a single point, hot spot temperature, such as the
37、 junction temperature, that exceeds the thermal index shall be tested as outlined in the Limited Thermal Aging Test, Section 13. 8 Live Parts 8.1 Metal employed for current-carrying parts shall be of stainless steel, silver, gold, copper, nickel, aluminum, an alloy of the same, or an equivalent mate
38、rial. 9 Wiring Terminals 9.1 A semiconductor shall be provided with a means for factory wiring for circuit wiring connections such as wire binding screws, pressure connectors, stud and nut-type connectors, solder connections, quick-connectors, wire leads, or the like. 9.2 A quick-connect terminal sh
39、all be evaluated as described in the Standard for Electrical Quick-Connect Terminals, UL 310. DECEMBER 29, 2011 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVICES - UL 1557 6UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 10 Spacings 10.1 The spaci
40、ngs through air and over surface of an electrically isolated semiconductor device, a) Between uninsulated live parts of opposite polarity; and b) Between uninsulated live parts and any other uninsulated metal parts, shall be based on the end-product spacing requirements. Exception No. 1: The spacing
41、 requirements do not apply to internal parts that are encapsulated or hermetically sealed. Exception No. 2: The spacing requirements of (a), above, do not apply between terminals of discrete semiconductor devices. For example, among collector, emitter, and base of a transistor or among anode, cathod
42、e, and gate of an SCR, and the like. 10.2 An insulating barrier or liner employed to provide the required spacings between uninsulated live parts of opposite polarity and between such parts and any other uninsulated metal parts shall: a) Comply with the requirements for internal barriers contained i
43、n the Standard forPolymeric Materials Use in Electrical Equipment Evaluations, UL 746C; and b) Not be less than 0.028 inch (0.71 mm) thick. Exception: A barrier or liner used to maintain spacings between uninsulated live parts or any uninsulated metal parts may be less than 0.028 inch (0.71 mm) thic
44、k if the device is encapsulated or hermetically sealed. PERFORMANCE 11 General 11.1 Samples of semiconductors shall be tested as described in the Dielectric Voltage-Withstand Test, Section 12, and the Limited Thermal Aging Test, Section 13. DECEMBER 29, 2011 ELECTRICALLY ISOLATED SEMICONDUCTOR DEVIC
45、ES - UL 1557 7UL COPYRIGHTED MATERIAL NOT AUTHORIZED FOR FURTHER REPRODUCTION OR DISTRIBUTION WITHOUT PERMISSION FROM UL 12 Dielectric Voltage-Withstand Test 12.1 Immediately following each of the conditionings indicated in 12.3 12.5, a semiconductor device shall be capable of withstanding without b
46、reakdown for 60 seconds a 48 62 Hz essentially sinusoidal potential equal to the rated isolation rms voltage applied between metal mounting surface and all of the device terminals. For this test, all of the terminals are to be connected together. 12.2 The test potential is to be obtained from any co
47、nvenient source having either a capacity of at least 500 VA or a lower capacity source with the meter connected in the output circuit. The voltage is to be gradually increased until the required test level is reached and is to be held at that value for one minute. The increase in the applied potenti
48、al is to be at a uniform rate and as rapid as is consistent with its value being correctly indicated by a voltmeter. 12.3 Six samples are to be subjected to the dielectric test procedure in the as-received condition. 12.4 Six samples are to be exposed to the maximum rated junction temperature for 7
49、hours. 12.5 Six samples are to be exposed to 0.0 2.0C (32.0 3.6F) for 7 hours. 13 Limited Thermal Aging Test 13.1 Material, as described in 7.1 and 7.2, shall not crack or warp in any of three samples of the device when the samples are aged in a full-draft circulating-air oven at a temperature and time chosen from the graph in Figure 13.1, using the index line that corresponds to the maximum operating temperature of the insulating material or the maximum storage temperature of
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