IEC 60068-2-20-2008 Environmental testing - Part 2 Tests - Test T Test methods for soldeability and resistance to soldering heat of devices with leads《环境试验.第2部分 试验.试验T 带导线装置的可焊接性和焊接热抵抗性的试验方法》.pdf

1、 IEC 60068-2-20 Edition 5.0 2008-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads Essais denvironnement Partie 2-20: Essais Essai T: Mthodes dessai de la brasabilit et d

2、e la rsistance la chaleur de brasage des dispositifs broches IEC 60068-2-20:2008 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, ele

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16、r cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60068-2-20 Edition 5.0 2008-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-20: Tests Test T: Test meth

17、ods for solderability and resistance to soldering heat of devices with leads Essais denvironnement Partie 2-20: Essais Essai T: Mthodes dessai de la brasabilit et de la rsistance la chaleur de brasage des dispositifs broches INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTER

18、NATIONALE R ICS 19.040 PRICE CODE CODE PRIX ISBN 2-8318-1052-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 60068-2-20 IEC:2008 CONTENTS FOREWORD.4 1 Scope and object6 2 Normative references .6 3 Terms and defin

19、itions .7 4 Test Ta: Solderability of wire and tag terminations8 4.1 Object and general description of the test8 4.1.1 Test methods.8 4.1.2 Specimen preparation8 4.1.3 Initial measurements .9 4.1.4 Accelerated ageing9 4.2 Method 1: Solder bath .9 4.2.1 Description of the solder bath9 4.2.2 Flux.10 4

20、.2.3 Procedure10 4.2.4 Test conditions 10 4.2.5 Final measurements and requirements 11 4.3 Method 2: Soldering iron at 350 C11 4.3.1 Description of soldering irons 11 4.3.2 Solder and flux 12 4.3.3 Procedure12 4.3.4 Final measurements and requirements 13 4.4 Information to be given in the relevant s

21、pecification 13 5 Test Tb: Resistance to soldering heat.13 5.1 Object and general description of the test13 5.1.1 Test methods.13 5.1.2 Initial measurements .14 5.2 Method 1: Solder bath .14 5.2.1 Description of the solder bath14 5.2.2 Flux.14 5.2.3 Procedure14 5.2.4 Test conditions 14 5.2.5 De-wett

22、ing.15 5.3 Method 2: Soldering iron .15 5.3.1 Description of soldering iron 15 5.3.2 Solder and flux 15 5.3.3 Procedure15 5.4 Recovery.16 5.5 Final measurements and requirements 16 5.6 De-wetting (if applicable).16 5.7 Information to be given in the relevant specification 17 Annex A (informative) Ex

23、ample of apparatus for accelerated steam ageing process .18 Annex B (normative) Specification for flux constituents.19 Bibliography20 Figure 1 Diagram of contact angle .7 60068-2-20 IEC:2008 3 Figure 2 Position of soldering iron12 Figure A.1 Example of apparatus .18 Table 1 Solderability, Solder bat

24、h method: Test severities (duration and temperature).11 Table 2 Resistance to soldering heat, Solder bath method: Test severities (duration and temperature) 15 4 60068-2-20 IEC:2008 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 2-20: Tests Test T: Test methods for solderabil

25、ity and resistance to soldering heat of devices with leads FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-o

26、peration on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to

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32、cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts an

33、d members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publica

34、tion or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publica

35、tion may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60068-2-20 has been prepared by IEC technical committee 91: Electronics assembly technology. This fifth edition cancels and replaces the fourth editio

36、n, published in 1979 and its Amendment 2 (1987). Amendment 2 includes Amendment 1. This fifth edition constitutes a technical revision and includes test conditions and requirements for use of lead-free solder. The major technical changes with regard to the fourth edition are the following: the solde

37、r globule test is deleted; test conditions and requirements for lead-free solders are added. 60068-2-20 IEC:2008 5 This bilingual version, published in 2009-08, corresponds to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/764/FDIS 91/774

38、/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the

39、 parts in the IEC 60068 series, under the general title Environmental testing, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the d

40、ata related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 60068-2-20 IEC:2008 ENVIRONMENTAL TESTING Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads

41、 1 Scope and object This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applica

42、tions using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicab

43、le solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. NOTE Information about wetting time and wetting force can be obtained by test methods using

44、a wetting balance. See IEC 60068-2-54 (solder bath method) and IEC 60068-2-69 (solder bath and solder globule method for SMDs). 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For

45、undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60068-2-2, Environmental testing Part 2-2: Tests Test B: Dry heat IEC 60068-2-66, Environmental testing Part 2: Test methods Test

46、Cx: Damp heat, steady state (unsaturated pressurized vapour) IEC 60068-2-78, Environmental testing Part 2-78: Tests Test Cab: Damp heat, steady state IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-3, Printed board assemblies Part 3: Sectional specification

47、Requirements for through-hole mount soldered assemblies IEC 61191-4, Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies 60068-2-20 IEC:2008 7 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1

48、colophony natural resin obtained as the residue after removal of turpentine from the oleo-resin of the pine tree, consisting mainly of abietic acid and related resin acids, the remainder being resin acid esters NOTE “Rosin“ is a synonym for colophony, and is deprecated because of the common confusio

49、n with the generic term “resin“. 3.2 contact angle in general the angle enclosed between two planes, tangent to a liquid surface and a solid/liquid interface at their intersection (see Figure 1). In particular the contact angle of liquid solder in contact with a solid metal surface Contact angle Liquid Solid IEC 1234/08 Figure 1 Diagram of contact angle 3.3 wet