1、 IEC 60115-1 Edition 4.0 2008-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Fixed resistors for use in electronic equipment Part 1: Generic specification Rsistances fixes utilises dans les quipements lectroniques Partie 1: Spcification gnrique IEC 60115-1:2008 THIS PUBLICATION IS COPYRIGHT PROTECTE
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16、r use in electronic equipment Part 1: Generic specification Rsistances fixes utilises dans les quipements lectroniques Partie 1: Spcification gnrique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XC ICS 31.040.10 PRICE CODE CODE PRIX ISBN 978-2-8322-0880-9 Regi
17、stered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distrib
18、uteur agr. 2 60115-1 IEC:2008 CONTENTS FOREWORD . 7 1 General 9 1.1 Scope 9 1.2 Normative references 9 2 Technical data 11 2.1 Units and symbols . 11 2.2 Terms and definitions 11 2.3 Preferred values 15 2.3.1 General . 15 2.3.2 Preferred values of nominal resistance . 15 2.4 Marking . 15 2.5 Coding
19、. 16 2.6 Packaging . 16 2.7 Storage . 16 2.8 Transportation . 16 3 Quality assessment procedures 16 4 Test and measurement procedures . 17 4.1 General . 17 4.2 Standard atmospheric conditions . 17 4.2.1 Standard atmospheric conditions for testing . 17 4.2.2 Recovery conditions . 17 4.2.3 Referee con
20、ditions . 17 4.2.4 Reference conditions . 18 4.3 Drying 18 4.4 Visual examination and checking of dimensions . 18 4.4.1 Visual examination . 18 4.4.2 Dimensions (gauging) 18 4.4.3 Dimensions (detail) 19 4.5 Resistance 19 4.5.1 Test methods . 19 4.5.2 Requirements 20 4.6 Insulation resistance 20 4.6.
21、1 Test methods . 20 4.6.2 Measuring conditions . 22 4.6.3 Requirements 23 4.7 Voltage proof . 23 4.7.1 Test methods . 23 4.7.2 Test conditions 23 4.7.3 Requirements 23 4.8 Variation of resistance with temperature 23 4.8.1 Preconditioning 23 4.8.2 Measuring temperatures 23 4.8.3 Measuring procedures
22、. 23 4.8.4 Calculation of temperature coefficient of resistance . 24 4.8.5 Requirements 24 4.9 Reactance . 25 4.9.1 Test procedures . 25 60115-1 IEC:2008 3 4.9.2 Pulse generator specification . 25 4.9.3 Oscilloscope specification 25 4.9.4 Measurements . 26 4.9.5 Impedance analyzer . 26 4.10 Non-line
23、ar properties . 26 4.11 Voltage coefficient . 26 4.11.1 Preconditioning 26 4.11.2 Measuring methods . 26 4.11.3 Calculation of voltage coefficient 27 4.11.4 Requirements 27 4.12 Noise . 27 4.13 Short time overload . 27 4.13.1 Initial measurements 27 4.13.2 Test procedures . 27 4.13.3 Final inspectio
24、n, measurements and requirements . 27 4.14 Temperature rise . 27 4.14.1 Object 27 4.14.2 Mounting 27 4.14.3 Test procedures . 28 4.14.4 Requirements 28 4.15 Robustness of the resistor body . 28 4.15.1 Object 28 4.15.2 Test procedure 28 4.15.3 Requirements 28 4.16 Robustness of terminations 29 4.16.1
25、 Test methods . 29 4.16.2 Test Ua 1 Tensile 29 4.16.3 Test Ub Bending . 30 4.16.4 Test Uc Torsion 30 4.16.5 Test Ud Torque . 30 4.16.6 Final measurements 30 4.17 Solderability . 30 4.17.1 Preconditioning 31 4.17.2 Test procedures . 31 4.17.3 Final inspection, measurements and requirements . 31 4.18
26、Resistance to soldering heat 31 4.18.1 Preconditioning 31 4.18.2 Test procedures . 32 4.18.3 Recovery . 32 4.18.4 Final inspection, measurements and requirements . 32 4.19 Rapid change of temperature . 32 4.19.1 Initial measurements 32 4.19.2 Test procedures . 32 4.19.3 Final inspection, measurement
27、s and requirements . 32 4.20 Bump 33 4.20.1 Mounting 33 4.20.2 Initial measurements 33 4.20.3 Test procedures . 33 4.20.4 Final inspection, measurements and requirements . 33 4 60115-1 IEC:2008 4.21 Shock 33 4.21.1 Mounting 33 4.21.2 Initial measurements 33 4.21.3 Test procedures . 33 4.21.4 Measure
28、ments under test . 33 4.21.5 Final inspection, measurements and requirements . 33 4.22 Vibration 33 4.22.1 Mounting 33 4.22.2 Initial measurements 34 4.22.3 Test procedures . 34 4.22.4 Final inspection, measurements and requirements . 34 4.23 Climatic sequence . 34 4.23.1 Initial measurements 34 4.2
29、3.2 Dry heat . 34 4.23.3 Damp heat, cyclic, test Db, first cycle . 34 4.23.4 Cold. 34 4.23.5 Low air pressure 34 4.23.6 Damp heat, cyclic, test Db, remaining cycles 35 4.23.7 DC load . 35 4.23.8 Final inspection, measurements and requirements . 35 4.24 Damp heat, steady state 35 4.24.1 Initial measu
30、rements 35 4.24.2 Test procedures . 35 4.24.3 DC load . 36 4.24.4 Final inspection, measurements and requirements . 36 4.25 Endurance . 36 4.25.1 Endurance at 70 C 36 4.25.2 Endurance at room temperature . 38 4.25.3 Endurance at upper category temperature 39 4.26 Accidental overload test . 40 4.26.1
31、 Object 40 4.26.2 Gauze cylinder test method 40 4.26.3 Conditions of test . 41 4.26.4 Test procedure 42 4.26.5 Requirement 42 4.27 Single-pulse high-voltage overload test 42 4.27.1 Object 42 4.27.2 Terminology . 42 4.27.3 Test procedure 42 4.28 Periodic-pulse high-voltage overload test . 45 4.28.1 O
32、bject 45 4.28.2 Terminology . 45 4.28.3 Test procedure 45 4.29 Component solvent resistance . 47 4.29.1 Initial measurement . 47 4.29.2 Test conditions 47 4.29.3 Requirements 47 4.30 Solvent resistance of marking 48 4.30.1 Test conditions 48 60115-1 IEC:2008 5 4.30.2 Requirements 48 4.31 Mounting of
33、 surface mount resistors 48 4.31.1 Substrate . 48 4.31.2 Wave soldering 48 4.31.3 Reflow soldering 49 4.32 Shear test 51 4.32.1 Mounting 51 4.32.2 Severities 51 4.32.3 Requirements 51 4.33 Substrate bending test . 51 4.33.1 Preparation 51 4.33.2 Initial measurements 51 4.33.3 Test procedures . 51 4.
34、33.4 Final inspection and requirements 51 4.34 Corrosion 52 4.34.1 Test method 52 4.34.2 Requirements 52 4.35 Flammability 52 4.35.1 Test conditions 52 4.35.2 Requirements 52 4.36 Operation at low temperature . 52 4.36.1 Initial measurements 52 4.36.2 Test procedures . 52 4.36.3 Final inspection, me
35、asurements and requirements . 52 4.37 Damp heat, steady state, accelerated 52 4.37.1 Initial measurements 52 4.37.2 Test methods . 52 4.37.3 Test procedures . 53 4.37.4 Final inspection, measurements and requirements . 53 4.38 Electrostatic discharge . 53 4.38.1 Test methods . 53 4.38.2 Initial meas
36、urements 53 4.38.3 Test procedures . 53 4.38.4 Final inspection, measurements and requirements . 53 4.39 Periodic-pulse overload test . 53 4.39.1 Preconditioning 53 4.39.2 Mounting 53 4.39.3 Initial measurements 54 4.39.4 Severities 54 4.39.5 Recovery . 54 4.39.6 Final inspection, measurements and r
37、equirements . 54 4.40 Whisker growth test . 54 4.40.1 General . 54 4.40.2 Preparation of specimen 54 4.40.3 Initial measurement . 54 4.40.4 Test procedures . 55 4.40.5 Test severities . 55 4.40.6 Final inspection, measurements and requirements . 55 4.41 Hydrogen sulphide test 55 6 60115-1 IEC:2008 A
38、nnex A (normative) Interpretation of sampling plans and procedures as described in IEC 60410 for use within the IECQ system 56 Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors for electronic equipment for use within the IECQ system . 57 Annex C (inf
39、ormative) Example of test equipment for the periodic-pulse high-voltage overload test . 58 Annex D (normative) Layout of the first page of a PCP/CQC specification . 60 Annex E (normative) Requirements for capability approval test report . 61 Annex F (informative) Letter symbols and abbreviations . 6
40、2 Annex G (informative) Index table for test and measurement procedures 64 Annex Q (normative) Quality assessment procedures . 66 Figure 1 Insulation resistance and voltage proof test jig for rectangular surface mount resistors 21 Figure 2 Insulation resistance and voltage proof test jig for cylindr
41、ical surface mount resistors 22 Figure 3 Test circuit . 25 Figure 4 Oscilloscope trace 26 Figure 5 Testing of resistor body robustness . 29 Figure 6 Gauze cylinder fixture . 41 Figure 7 Pulse generator 1,2/50 43 Figure 8 Pulse generator 10/700 . 43 Figure 9 Suitable substrate for mechanical and elec
42、trical tests (may not be suitable for impedance measurements) . 50 Figure 10 Suitable substrate for electrical tests . 50 Figure C.1 Block diagram of test equipment 58 Figure C.2 Tolerances on the pulse shape 59 Figure Q.1 General scheme for capability approval . 69 Table 1 Referee conditions . 18 T
43、able 2 Measuring voltages 19 Table 3 Calculation of resistance value (R) and change in resistance ( R) 24 Table 4 Calculation of temperature differences ( T) . 24 Table 5 Tensile force for wire terminations . 30 Table 6 Torque . 30 Table 7 Number of cycles . 35 Table 8 Severities (see Note 2) 44 Tab
44、le 9 List of preferred severities . 46 Table 10 Periodic-pulse overload test condition 54 60115-1 IEC:2008 7 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT Part 1: Generic specification FOREWORD 1) The International Electrotechnical Commission (IEC) is a
45、worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to oth
46、er activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the
47、subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with condition
48、s determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
49、 Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote inte
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