IEC 60115-2-2014 Fixed resistors for use in electronic equipment - Part 2 Sectional specification Leaded fixed low power film resistors《电子设备用固定电阻器 第2部分 分规范 绕线固定低功率薄膜电阻器》.pdf

1、 IEC 60115-2 Edition 3.0 2014-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Fixed resistors for use in electronic equipment Part 2: Sectional specification: Leaded fixed low power film resistors Rsistances fixes utilises dans les quipements lectroniques Partie 2: Spcification intermdiaire: Rsistanc

2、es fixes broches couches, faible dissipation IEC 60115-2:2014-05(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic o

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20、ctronic equipment Part 2: Sectional specification: Leaded fixed low power film resistors Rsistances fixes utilises dans les quipements lectroniques Partie 2: Spcification intermdiaire: Rsistances fixes broches couches, faible dissipation INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTE

21、CHNIQUE INTERNATIONALE XB ICS 31.040.10 PRICE CODE CODE PRIX ISBN 978-2-8322-1584-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor

22、. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 60115-2:2014 IEC 2014 CONTENTS FOREWORD . 6 1 Scope 8 2 Normative references 8 3 Terms, definitions, product technologies and product classification . 9 3.1 Terms and definitions . 9 3.2 Product

23、technologies . 9 3.2.1 Metal film technology 9 3.2.2 Metal glaze technology . 9 3.2.3 Metal oxide technology . 10 3.2.4 Carbon film technology . 10 3.3 Product classification . 10 4 Preferred characteristics 11 4.1 General 11 4.2 Style and dimensions . 11 4.3 Preferred climatic categories 12 4.4 Res

24、istance . 13 4.5 Tolerances on resistance . 13 4.6 Rated dissipation P 70. 13 4.7 Limiting element voltage U max14 4.8 Insulation voltage U ins14 4.9 Insulation resistance R ins. 14 5 Tests and test severities 14 5.1 Preparation of specimen 14 5.1.1 Drying . 14 5.1.2 Mounting of components on a test

25、 rack . 14 5.1.3 Specification of test boards . 14 5.1.4 Mounting of components on test boards 16 5.2 Tests . 17 5.2.1 Dimensions . 17 5.2.2 Insulation resistance . 17 5.2.3 Voltage proof 17 5.2.4 Short time overload 18 5.2.5 Temperature rise 18 5.2.6 Robustness of terminations 18 5.2.7 Solderabilit

26、y 18 5.2.8 Resistance to soldering heat . 19 5.2.9 Rapid change of temperature 19 5.2.10 Rapid change of temperature, 100 cycles . 20 5.2.11 Vibration . 20 5.2.12 Climatic sequence 20 5.2.13 Damp heat, steady state . 21 5.2.14 Endurance at 70 C 21 5.2.15 Endurance at room temperature . 22 5.2.16 End

27、urance at the upper category temperature 22 5.2.17 Single pulse high voltage overload test . 23 IEC 60115-2:2014 IEC 2014 3 5.2.18 Component solvent resistance 23 5.2.19 Solvent resistance of marking . 23 5.2.20 Flammability test 24 5.2.21 Electrostatic discharge (ESD) test 24 5.2.22 Periodic pulse

28、overload test 24 6 Performance requirements 25 6.1 General 25 6.2 Limits for change of resistance 25 6.3 Insulation resistance 27 6.4 Variation of resistance with temperature 27 6.5 Temperature rise . 28 6.6 Solderability . 28 6.7 Flammability 28 7 Marking, packaging and ordering information . 28 7.

29、1 Marking of the component 28 7.2 Packaging 28 7.3 Marking of the packaging . 28 7.4 Ordering information 28 8 Detail specifications. 29 8.1 General 29 8.2 Information to be specified in a detail specification 29 8.2.1 Outline drawing or illustration . 29 8.2.2 Style and dimensions 29 8.2.3 Climatic

30、 category 29 8.2.4 Resistance range 29 8.2.5 Tolerances on resistance 30 8.2.6 Rated dissipation P 7030 8.2.7 Limiting element voltage U max30 8.2.8 Insulation voltage U ins30 8.2.9 Insulation resistance R ins30 8.2.10 Test severities 30 8.2.11 Limits of resistance change after testing . 30 8.2.12 T

31、emperature coefficient of resistance . 30 8.2.13 Marking 30 8.2.14 Ordering information . 30 8.2.15 Mounting 31 8.2.16 Storage. 31 8.2.17 Additional information . 31 8.2.18 Quality assessment procedures 31 8.2.19 0 resistors . 31 9 Quality assessment procedures . 31 9.1 General 31 9.2 Definitions 31

32、 9.2.1 Primary stage of manufacture . 31 9.2.2 Structurally similar components 31 9.2.3 Assessment level EZ 32 9.3 Formation of inspection lots . 32 9.4 Qualification approval (QA) procedures 33 4 IEC 60115-2:2014 IEC 2014 9.5 Quality conformance inspection . 33 9.6 Capability approval (CA) procedur

33、es 33 9.7 Technology approval (TA) procedures 34 9.8 Delayed delivery 34 9.9 Certified test records 34 9.10 Certificate of conformity (CoC) . 34 Annex A (normative) 0 Resistors (Jumper) . 45 A.1 General 45 A.2 Preferred characteristics 45 A.3 Tests and test severities 45 A.4 Performance requirements

34、 . 46 A.5 Marking, packaging and ordering information . 46 A.6 Detail specification . 46 A.7 Quality assessment procedures . 46 Annex B (informative) Radial formed styles 48 B.1 General 48 B.1.1 Scope of this annex 48 B.1.2 Denomination of radial formed styles 48 B.1.3 Coated lead wires . 49 B.1.4 M

35、eans for support of mounting height . 49 B.1.5 Means for retention . 49 B.2 Radial formed styles 50 B.2.1 Radial formed style with lateral body position . 50 B.2.2 Radial formed style with upright body position 51 B.3 Packaging 54 B.4 Quality assessment 55 B.4.1 General 55 B.4.2 Quality assessment o

36、f formed resistors 55 B.4.3 Forming of finished resistors of assessed quality 55 B.4.4 Special inspection requirements . 55 Annex C (normative) Endurance at room temperature 57 C.1 Remark on the temporary relevance of this annex 57 C.2 General 57 C.3 Test chamber and mounting of specimen . 57 C.4 In

37、itial measurement . 58 C.5 Temperature and load 58 C.6 Duration . 60 C.7 Intermediate measurements . 60 C.8 Final inspection, measurements and requirements . 60 Annex D (informative) Letter symbols and abbreviations 62 D.1 Letter symbols . 62 D.2 Abbreviations . 64 Annex X (informative) Cross refere

38、nce for references to the prior revision of this standard 66 Bibliography 68 Figure 1 Shape and dimensions of axial leaded resistors . 11 IEC 60115-2:2014 IEC 2014 5 Figure 2 Alternative methods for specification of the length of excessive protective coating on axial leaded resistors . 12 Figure 3 L

39、ead-wire spacing of axial leaded resistors with bent leads 12 Figure 4 Derating curve . 13 Figure 5 Basic layout for mechanical, environmental and electrical tests, Kelvin (4 point) connections 15 Figure 6 Basic layout for mechanical, environmental and electrical tests, standard connections 16 Figur

40、e 7 Assembly of specimen to the test board . 17 Figure B.1 Shape and dimensions of radial formed resistor for lateral body position 50 Figure B.2 Shape and dimensions of radial formed resistor for lateral body position with kinked lead wires . 50 Figure B.3 Shape and dimensions of a radial formed re

41、sistor for upright body position 52 Figure B.4 Shape and dimensions of a radial formed resistor for upright body position and wide spacing 52 Figure B.5 Shape and dimensions of a radial formed resistor for upright body position and wide spacing, with kinked lead wire 53 Figure C.1 Derating curve wit

42、h specification of a suitable test dissipation 59 Figure C.2 Derating curve without specification of a suitable test dissipation . 59 Table 1 Preferred styles of axial leaded resistors . 11 Table 2 Test board dimensions 15 Table 3 Limits for change of resistance at tests . 26 Table 4 Permitted chang

43、e of resistance due to variation of temperature . 27 Table 5 Test schedule for qualification approval. 35 Table 6 Test schedule for quality conformance inspection 40 Table B.1 Feasible lead-wire spacing of radial formed resistor for lateral body position 51 Table B.2 Feasible lead-wire spacing of a

44、radial formed resistor for upright body position. 54 6 IEC 60115-2:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT Part 2: Sectional specification: Leaded fixed low power film resistors FOREWORD 1) The International Electrotechnical Commissio

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