IEC 60191-6-21-2010 Mechanical standardization of semiconductor devices - Part 6-21 General rules for the preparation of outline drawings of surface mounted semiconductor device pa.pdf

1、 IEC 60191-6-21 Edition 1.0 2010-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small outl

2、ine packages (SOP) Normalisation mcanique des dispositifs semiconducteurs Partie 6-21: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semiconducteurs pour montage en surface Mthodes de mesure pour les dimensions des botiers de faible encombrement (SOP) IEC 60

3、191-6-21:2010 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2010 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, withou

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17、u Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60191-6-21 Edition 1.0 2010-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-21: General rules for the preparation of outline drawings of sur

18、face mounted semiconductor device packages Measuring methods for package dimensions of small outline packages (SOP) Normalisation mcanique des dispositifs semiconducteurs Partie 6-21: Rgles gnrales pour la prparation des dessins dencombrement des botiers pour dispositifs semiconducteurs pour montage

19、 en surface Mthodes de mesure pour les dimensions des botiers de faible encombrement (SOP) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE N ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-168-7 Registered trademark of the International Electrotechnical Commi

20、ssion Marque dpose de la Commission Electrotechnique Internationale 2 60191-6-21 IEC:2010 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

21、Measuring methods for package dimensions of small outline packages (SOP) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote inte

22、rnational co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereaft

23、er referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also partic

24、ipate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an

25、international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all r

26、easonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply

27、 IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of co

28、nformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publi

29、cation. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect,

30、or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the corr

31、ect application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-21 has been prepare

32、d by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47D/772/FDIS 47D/776/RVD Full information on the voting for the approval of this stan

33、dard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 60191-6-21 IEC:2010 3 A list of all the parts in the IEC 60191 series, under the general title Mechanical standardization of semiconductor devi

34、ces, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reco

35、nfirmed, withdrawn, replaced by a revised edition, or amended. 4 60191-6-21 IEC:2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of small

36、 outline packages (SOP) 1 Scope This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4. 2 Normative references The following referenced documents are indispensable for the application of this documen

37、t. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60191-4, Mechanical standardization of semiconductor devices Part 4: Coding system and classification into forms of package outlines

38、for semiconductor device packages IEC 60191-6, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages 3 Terms and definitions For the purposes of this document the terms and definitions given

39、in IEC 60191-6 apply. 4 Measuring methods 4.1 Description of measuring method The measuring methods described in this standard are for dimension values guaranteed to users on the basis of the following items. a) In general, measuring the dimensions shall be made with the semiconductor packages mount

40、ed on printed circuit-board as the guarantee is made to the user. b) In general, measurement may be made either by hand or automatically. c) The dimensions that cannot be measured unless the package is destroyed may be calculated from other dimensions or replaced by representative values. See 4.6.2.

41、3. 60191-6-21 IEC:2010 5 4.2 Reference characters and drawing Thin small outline package TSOP (1) An outline drawing is given in Figure 1. Terminal 1 index area 2 1 n/2 n B n-1 n/2+1 D HD A IEC 2248/09 Figure 1a Top view y Seating plane ZE e bp M x P S E S A-B S IEC 2249/09 Figure 1b Side view c c1

42、b1 bp IEC 2250/09 G1D L Lp L1 A3 P A1 A2 A IEC 2251/09 Figure 1c Lead section Figure 1d Lead side view e b3 l1 HDmin-2Lpmax HDmax IEC 2252/09 Figure 1e Pattern of terminal position areas Figure 1 TSOP(1) outline drawings 6 60191-6-21 IEC:2010 Shrink small outline package SSOP, TSOP(2) An outline dra

43、wing is given in Figure 2. Terminal 1 index area 2 1 n1 n/2 B n2 n4 n n-1 n/2-1 n3 E HE A IEC 2243/09 Figure 2a Top view ZD e P Seating plane S bp D M y A-B S S x IEC 2244/09 Figure 2b Side view c c1 b1 bp IEC 2245/09 L1 G1E P A3 L Lp A A2 A1 IEC 2246/09 Figure 2c Lead section Figure 2d Lead side vi

44、ew e b3 l1 HEmin -2LpmaxHEmaxIEC 2247/09 Figure 2e Pattern of terminal position areas Figure 2 SSOP, TSOP(2) outline drawings 60191-6-21 IEC:2010 7 4.3 Mounting height A 4.3.1 Description Let the height of a package from the seating plane to the top of the package be denoted as the mounting height.

45、See Figure 3. A S S A IEC 2032/10 Figure 3 Mounting height 4.3.2 Measuring method The measuring method shall be as follows. a) Put the package on the surface plate to establish the seating plane. b) From the side or top, measure the distance to a highest point. Let the distance be denoted as the mou

46、nting height A. 4.4 Stand-off A1 4.4.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off. See Figure 4. 8 60191-6-21 IEC:2010 S A1 A1 S IEC 2033/10 Figure 4 Stand-off 4.4.2 Measuring method The measuring method shall be as follows. a) Put

47、the package on the surface plate to establish the reference surface (seating plane). b) Measure a distance from the reference surface (surface plate) to the lowest point of the package. 4.5 Body thickness A2 4.5.1 Description The body thickness is defined as a distance between planes, parallel to th

48、e reference surface, tangent to the highest and lowest points of the body. See Figure 5. A2 A2 IEC 2034/10 Figure 5 Body thickness A2 4.5.2 Measuring method The measuring method shall be as follows. a) Put the package which is accurately dimensioned between surface plates which are larger than the p

49、ackage vertically in parallel. Never touch the leads. 60191-6-21 IEC:2010 9 b) Measure the total thickness including the surface plates with a micrometer and subtract the thickness of surface plates from the total thickness so as to obtain the thickness of package. 4.6 Lead widths bp and b1, lead thickness c and c1 4.6.1 Description The outmost