IEC 60191-6-8-2001 Mechanical standardization of semiconductor devices - Part 6-8 General rules for the preparation of outline drawings of surface mounted semiconductor device pack.pdf

1、 IEC 60191-6-8 Edition 1.0 2001-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-Q

2、FP) Normalisation mcanique des dispositifs semiconducteurs Partie 6-8: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Guide de conception pour les botiers plats quadrangulaires en cramique, scellement verre (G-QFP) IEC 60191-6-8:2001 THI

3、S PUBLICATION IS COPYRIGHT PROTECTED Copyright 2001 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in w

4、riting from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further i

5、nformation. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms, sans laccord crit de la CEI ou du Comit na

6、tional de la CEI du pays du demandeur. Si vous avez des questions sur le copyright de la CEI ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de la CEI de votre pays de rsidence. IEC Central Office Tel.: +41 22

7、919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related tec

8、hnologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Useful links: IEC publications search - www.iec.ch/searchpub The advanced s

9、earch enables you to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Publish

10、ed details all new publications released. Available on-line and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in ad

11、ditional languages. Also known as the International Electrotechnical Vocabulary (IEV) on-line. Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de la CEI

12、La Commission Electrotechnique Internationale (CEI) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications CEI Le contenu technique des publications de la CEI est

13、 constamment revu. Veuillez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Liens utiles: Recherche de publications CEI - www.iec.ch/searchpub La recherche avance vous permet de trouver des publications CEI en utilisant diffrents critres (numro

14、de rfrence, texte, comit dtudes,). Elle donne aussi des informations sur les projets et les publications remplaces ou retires. Just Published CEI - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications de la CEI. Just Published dtaille les nouvelles publications parues. Disponib

15、le en ligne et aussi une fois par mois par email. Electropedia - www.electropedia.org Le premier dictionnaire en ligne au monde de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnel

16、les. Egalement appel Vocabulaire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60191-6-8 Edition 1.0 2001-08 INTERNATIONAL STANDARD NO

17、RME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic quad flatpack (G-QFP) Normalisation mcanique des dispositifs semiconducteurs P

18、artie 6-8: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Guide de conception pour les botiers plats quadrangulaires en cramique, scellement verre (G-QFP) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONA

19、LE K ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-83220-589-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez

20、 vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 60191-6-8 IEC:2001 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device p

21、ackages Design guide for glass sealed ceramic quad flatpack (G-QFP) FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote inter

22、national co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the

23、subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with condit

24、ions determined by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested Natio

25、nal Committees. 3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unif

26、ication, IEC National Committees undertake to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.

27、 5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of pate

28、nt rights. The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60191-6-8 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This bilingual versio

29、n (2013-01) corresponds to the monolingual English version, published in 2001-08. The text of this standard is based on the following documents: FDIS Report on voting 47D/438/FDIS 47D/456/RVD Full information on the voting for the approval of this standard can be found in the report on voting indica

30、ted in the above table. The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directives, Part 3. The committee has decided that the contents of this publication will remain unchanged until 2005. At this date, the publication wi

31、ll be reconfirmed; withdrawn; replaced by a revised edition, or amended. 60191-6-8 IEC:2001 3 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for glass sealed ceramic qua

32、d flatpack (G-QFP) 1 Scope and object This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain

33、interchangeability of G- QFP. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For dated references, subsequent amend- ments to, or revisions of, any of these publications do not apply.

34、 However, parties to agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated references, the latest edition of the normative document referred to applies. Members of IEC and

35、ISO maintain registers of currently valid International Standards. IEC 60191 (all parts), Mechanical standardization of semiconductor devices 3 Definitions For the purpose of this part of IEC 60191, the following definition, as well as those given in the other parts of this standard, apply. 3.1 G-QF

36、P glass sealed package with gull-wing formed terminals which are led out in four directions to mount on PCB surface 4 Numbering of the pins The index area is positioned at the upper left corner of the package body when it is viewed from the seating plane. The terminal that is closest to the index co

37、rner is numbered 1, and continued terminals that count in counter-clockwise directions are numbered 2, 3. 4 60191-6-8 IEC:2001 E e Z E Z D H D Z F D Q e r e D l 2 e A b 2 A 2 A 1 L P L A 3 S Seating plane v M P S Figure 3 Figure 2 Terminal position area Figure 1b Figure 1a See figure 3 w M P S y S P

38、 Index corner Index corner Zone of a visible index on the top face c IEC 1361/01 IEC 1362/01 IEC 1363/01 IEC 1364/0160191-6-8 IEC:2001 5 Table 1 Group 1: Dimensions appropriate to mounting and interchangeability Ref. Limits to be observed Recommended values for the dimensions Note aMin. Nom. Max. mm

39、 n X 1 n DX 1 n EX 1 A X A max. = 0,5 m 2 m = 3, 4, 5, 6, 7, 8, 9, 10, 11 A1 X X X A1 min0,00 0,25 A1 nom0,10 0,40 A1 max0,25 0,50 A2 X X X A2 min0,51 1,01 1,51 2,01 2,51 A2 nom0,76 1,26 1,76 2,26 2,76 A2 max1,00 1,50 2,00 2,50 3,00 A2 min3,01 3,51 4,01 4,51 A2 nom3,26 3,76 4,26 4,76 A2 max3,50 4,00

40、 4,50 5,00 A 3 i X A 3 i = 0,25 b pX X X iei b p minb p nomb p max1,0 0,35 0,42 0,50 0,8 0,30 0,37 0,45 0,65 0,25 0,32 0,40 0,5 0,15 0,22 0,30 0,4 0,15 0,18 0,22 D X E nomD nom4 Regular square 5 K 0,8 K = 2, 4 E X 6 K 0,8 m = 3, 4, 5 7 K 0,8 20 + 4m 0,8 Rectangular 7 K 0,8 5 2K 0,8 E nom D nomSquare

41、 Rectangular 9,2 9,2 13,2 19,2 11,2 11,2 27,2 39,2 13,2 13,2 19,2 19,2 23,2 23,2 27,2 27,2 31,2 31,2 35,2 35,2 39,2 39,2 aSee notes on pages 9 and 10. 6 60191-6-8 IEC:2001 Table 1 (continued) Ref. Limits to be observed Recommended values for the dimensions Note aMin. Nom. Max. mm iei X iei nom. = 1,

42、0; 0,8; 0,65; 0,5; 0,4 5 H DX X X H D nom= D nom+ 2L nomH D min= D nom 0,2 H D max= D nom+ 0,2 H EX X X H E nom= E nom+ 2L nomH E min= H Enom 0,2 H E max= H Enom+ 0,2 L X Lnom= 1,8; 2,1; 2,4 L pX X X LnomL p minL p nomL p max1,8, 2,1 0,45 0,60 0,75 2,4 0,73 0,88 1,03 v X v max= 0,3 6 w X iei wmaxiei

43、 wmax6 1,0 0,20 0,5 0,10 0,8 0,16 0,4 0,10 0,65 0,13 y X y max= 0,10 X X X min= 0 nom= 3 max= 10 aSee notes on pages 9 and 10. 60191-6-8 IEC:2001 7 Table 2 Group 2: Dimensions appropriate to mounting and gauging Ref. Limits to be observed Recommended values for the dimensions Note aMin. Nom. Max. mm

44、 b 2X b 2 max= b p max+ W maxiei b 2 max1,00 0,70 0,80 0,61 0,65 0,53 0,50 0,40 0,40 0,32 iei X iei nom= 1,0; 0,8; 0,65; 0,5; 0,4 5 e D i X e D i = H Dnom L pnome E i X e E i = H Enom L pnomI 2X I 2 max= L p max+ V maxLnomI 2 max1,8; 2,1 1,05 2,4 1,33 aSee notes on pages 9 and 10 8 60191-6-8 IEC:200

45、1 Table 3 Group 3: Dimensions appropriate to automated handling Ref. Limits to be observed Recommended values for the dimensions Note Min. Nom. Max. mm A 2X X X A 2min0,51 1,01 1,51 2,01 2,51 A 2nom0,76 1,26 1,76 2,26 2,76 A 2max1,00 1,50 2,00 2,50 3,00 A 2min3,01 3,51 4,01 4,51 A 2nom3,26 3,76 4,26

46、 4,76 A 2max3,50 4,00 4,50 5,00 D X X D min= D nom 0,3 D max= D nom+ 0,3 E X X E min= E nom 0,3 E max= E nom+ 0,3 k X No definition Q X No definition X = 45 Table 4 Group 4: Dimensions for information only Ref. Limits to be observed Recommended values for the dimensions Note aMin. Nom. Max. mm c X X

47、 iei c minc max7 iei 0,65 0,12 0,23 iei 0,50 0,10 0,20 Z DX X Z Dnom= (D nom (n D 1) iei ) / 2 8 Z Dmax= (D max (n D 1) iei ) / 2 Z EX X Z Enom= (E nom (n E 1) iei ) / 2 8 Z Emax= (E max (n E 1) iei ) / 2 aSee notes on pages 9 and 10. 60191-6-8 IEC:2001 9 NOTE 1 The relation between the package body

48、 size and the maximum number of terminals will be as shown in the following table. a) Regular square shape series E D* n nom(n Dnom= n Enom= n nom/ 4) iei 1,00 0,80 0,65 0,50 0,40 10 10 36 44 52 64 80 12 12 48 64 80 100 14 14 52 64 80 100 120 20 20 76 88 112 144 176 24 24 176 216 28 28 128 160 208 256 32 32 184 240 296 36 36 272 336 40 40 232 304 376 b) Rectangular shape series E D an nom(n Dnom , n E nom ) iei 1,00 0,80 0,65 0,50 0,40 14 20 64 80 100 (13, 19) (16, 24) (20,30) 28 40 256 (52,76) aThe E, D values shown in this table ind