1、 IEC 60269-4 Edition 5.1 2012-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Low-voltage fuses Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices Fusibles basse tension Partie 4: Exigences supplmentaires concernant les lments de remplacement utiliss pour la
2、 protection des dispositifs semiconducteurs IEC 60269-4:2009+A1:2012 colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, e
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16、contactez-nous: csciec.ch. IEC 60269-4 Edition 5.1 2012-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Low-voltage fuses Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices Fusibles basse tension Partie 4: Exigences supplmentaires concernant les lments de re
17、mplacement utiliss pour la protection des dispositifs semiconducteurs INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE CP ICS 29.120.50 PRICE CODE CODE PRIX ISBN 978-2-8322-0112-1 Registered trademark of the International Electrotechnical Commission Marque dpose d
18、e la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 60269-4 IEC:2009+A1:2012 CONTENTS FOREWORD . 4 1 Gene
19、ral 6 1.1 Scope and object. 6 1.2 Normative references 7 2 Terms and definitions . 7 3 Conditions for operation in service 8 4 Classification 9 5 Characteristics of fuses 9 6 Markings 14 7 Standard conditions for construction . 14 8 Tests 15 Annex AA (informative) Guidance for the coordination of fu
20、se-links with semiconductor devices . 28 Annex BB (normative) Survey on information to be supplied by the manufacturer in his literature (catalogue) for a fuse designed for the protection of semiconductor devices . 34 Annex CC (normative) Examples of standardized fuse-links for the protection of sem
21、iconductor devices . 35 Bibliography 53 Figure 101 Conventional overload curve (example) (X and Y are points of verified overload capability) . 24 Figure 102 Example of a conventional test arrangement for bolted fuse-links . 25 Figure 103 Example of a conventional test arrangement for blade contact
22、fuse-links . 27 Figure CC.1 Single body fuse-links 36 Figure CC.2 Double body fuse-links . 37 Figure CC.3 Twin body fuse-links . 38 Figure CC.4 Striker fuse-links 38 Figure CC.5 Fuse-links with bolted connections, type B, body sizes 000 and 00 40 Figure CC.6 Fuse-links with bolted connections, type
23、B, body sizes 0, 1, 2 and 3 41 Figure CC.7 Bolted fuse-links, type C 43 Figure CC.8 Flush end fuse-links, type A . 45 Figure CC.9 Flush end fuse-links, type B . 47 Figure CC.10 Fuse-links with cylindrical contact caps, type A 48 Figure CC.11 Fuse-links with cylindrical contact caps, type B 51 Figure
24、 CC.12 Fuse-links with cylindrical contact caps with striker, type B (additional dimensions for all sizes except 10 38) 52 60269-4 IEC:2009+A1:2012 3 Table 101 Conventional times and currents for “gR” and “gS” fuse-links 11 Table 102 List of complete tests. 16 Table 103 Survey of tests on fuse-links
25、 of the smallest rated current of a homogeneous series . 16 Table 104 Values for breaking-capacity tests on a.c. fuses 21 Table 105 Values for breaking-capacity tests on d.c. fuses 22 Table 106 Values for breaking-capacity tests on VSI fuse-links 23 Table CC.1 Conventional time and current for “gR“
26、and “gS“ fuse-links 39 Table CC.2 Conventional time and current for “gR“ and “gS“ fuse-links 44 Table CC.3 Preferred Typical rated voltages and preferred maximum rated currents . 49 Table CC.4 Conventional time and current for “gR“ and “gS“ fuse-links 49 4 60269-4 IEC:2009+A1:2012 INTERNATIONAL ELEC
27、TROTECHNICAL COMMISSION _ LOW-VOLTAGE FUSES Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committee
28、s (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Rep
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32、re accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote int
33、ernational uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
34、 the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All us
35、ers should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or ot
36、her damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication.
37、 Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such pate
38、nt rights. This consolidated version of IEC 60269-4 consists of the fifth edition (2009) documents 32B/535/FDIS and 32B/541/RVD and its amendment 1 (2012) documents 32B/579/CDV and 32B/586A/RVC. It bears the edition number 5.1. The technical content is therefore identical to the base edition and its
39、 amendment and has been prepared for user convenience. A vertical line in the margin shows where the base publication has been modified by amendment 1. Additions and deletions are displayed in red, with deletions being struck through. 60269-4 IEC:2009+A1:2012 5 International Standard IEC 60269-4 has
40、 been prepared by subcommittee 32B: Low-voltage fuses, of IEC technical committee 32: Fuses. This fifth edition cancels and replaces the fourth edition published in 2006. It constitutes a technical revision. The significant technical changes to the fourth edition are: the introduction of voltage sou
41、rce inverter fuse-links, including test requirements; coverage of the tests on operating characteristics for a.c. by the breaking capacity tests; the updating of examples of standardised fuse-links for the protection of semiconductor devices. This part is to be used in conjunction with IEC 60269-1:2
42、006, Low-voltage fuses Part 1: General requirements. This Part 4 supplements or modifies the corresponding clauses or subclauses of Part 1. Where no change is necessary, this Part 4 indicates that the relevant clause or subclause applies. Tables and figures which are additional to those in Part 1 ar
43、e numbered starting from 101. Additional annexes are lettered AA, BB, etc. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of the IEC 60269 series, under the general title: Low-voltage fuses, can be found on the IEC website. The committee has
44、decided that the contents of the base publication and its amendments will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a
45、 revised edition, or amended. IMPORTANT The “colour inside” logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this publication using a colour printer. 6 60269-4 I
46、EC:2009+A1:2012 LOW-VOLTAGE FUSES Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 1 General IEC 60269-1 applies with the following supplementary requirements. Fuse-links for the protection of semiconductor devices shall comply with aIl requirements of IE
47、C 60269-1, if not otherwise indicated hereinafter, and shall also comply with the supplementary requirements laid down below. 1.1 Scope and object These supplementary requirements apply to fuse-links for application in equipment containing semiconductor devices for circuits of nominal voltages up to
48、 1 000 V a.c. or 1 500 V d.c. and also, in so far as they are applicable, for circuits of higher nominal voltages. NOTE 1 Such fuse-Iinks are commonly referred to as “semiconductor fuse-links”. NOTE 2 In most cases, a part of the associated equipment serves the purpose of a fuse-base. Owing to the g
49、reat variety of equipment, no general rules can be given; the suitability of the associated equipment to serve as a fuse- base should be subject to agreement between the manufacturer and the user. However, if separate fuse-bases or fuse-holders are used, they should comply with the appropriate requirements of IEC 60269-1. NOTE 3 IEC 60269-6 (Low-voltage fuses Part 6: Supplementar
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