1、 NORME INTERNATIONALECEIIECINTERNATIONAL STANDARD 60664-4Deuxime ditionSecond edition2005-09Coordination de lisolement des matriels dans les systmes (rseaux) basse tension Partie 4: Considrations sur les contraintes de tension haute frquence Insulation coordination for equipment within low-voltage s
2、ystems Part 4: Consideration of high-frequency voltage stress Numro de rfrence Reference number CEI/IEC 60664-4:2005 PUBLICATION FONDAMENTALE DE SCURIT BASIC SAFETY PUBLICATION Numrotation des publications Depuis le 1er janvier 1997, les publications de la CEI sont numrotes partir de 60000. Ainsi, l
3、a CEI 34-1 devient la CEI 60034-1. Editions consolides Les versions consolides de certaines publications de la CEI incorporant les amendements sont disponibles. Par exemple, les numros ddition 1.0, 1.1 et 1.2 indiquent respectivement la publication de base, la publication de base incorporant lamende
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15、urther assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 . NORME INTERNATIONALECEIIECINTERNATIONAL STANDARD 60664-4Deuxime ditionSecond edition2005-09Coordination de lisolement des matriels dans les systmes (rseaux) basse tensio
16、n Partie 4: Considrations sur les contraintes de tension haute frquence Insulation coordination for equipment within low-voltage systems Part 4: Consideration of high-frequency voltage stress Pour prix, voir catalogue en vigueur For price, see current catalogue IEC 2005 Droits de reproduction rservs
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18、utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 9
19、19 03 00 E-mail: inmailiec.ch Web: www.iec.ch CODE PRIX PRICE CODE XB Commission Electrotechnique InternationaleInternational Electrotechnical Commission PUBLICATION FONDAMENTALE DE SCURIT BASIC SAFETY PUBLICATION 2 60664-4 CEI:2005 SOMMAIRE AVANT-PROPOS8 INTRODUCTION.12 1 Domaine dapplication et ob
20、jet14 2 Rfrences normatives.16 3 Termes et dfinitions 16 4 Distances disolement.18 4.1 Conditions gnrales.18 4.2 Informations de base.18 4.3 Champs homogne et approximativement homogne 18 4.4 Champs non homognes .20 5 Lignes de fuite26 5.1 Valeurs exprimentales .26 5.2 Dimensionnement des lignes de
21、fuite 26 6 Isolation solide .32 6.1 Considration gnrale .32 6.2 Facteurs dinfluence 32 6.3 Dimensionnement de lisolation solide .34 7 Essais haute frquence .36 7.1 Exigences fondamentales36 7.2 Source de tension dessai .38 7.3 Conditionnement .38 7.4 Essai de claquage haute frquence38 7.5 Essai de d
22、charges partielles haute frquence.38 7.6 Exemples des rsultats dessai .44 8 Tensions non sinusodales .44 8.1 Considrations gnrales44 8.2 Tension de chocs priodique.46 8.3 Analyse harmonique46 8.4 Procdure de dimensionnement et essais .46 Annexe A (informative) Caractristiques disolement des distance
23、s disolement sous des tensions haute frquence 50 Annexe B (informative) Caractristiques disolement des lignes de fuite sous des tensions haute frquence.64 Annexe C (informative) Caractristiques disolement de lisolation solide sous des tensions haute frquence.70 Annexe D (normative) Essais de lisolat
24、ion sous des tensions haute frquence 90 Annexe E (informative) Isolation subissant des contraintes avec des tensions haute frquence non sinusodales 118 Annexe F (informative) Schmas de dimensionnement 128 Bibliographie.132 60664-4 IEC:2005 3 CONTENTS FOREWORD.9 INTRODUCTION.13 1 Scope and object15 2
25、 Normative references .17 3 Terms and definitions .17 4 Clearances .19 4.1 General conditions 19 4.2 Basic information.19 4.3 Homogeneous and approximately homogeneous fields19 4.4 Inhomogeneous fields .21 5 Creepage distances27 5.1 Experimental data .27 5.2 Dimensioning of creepage distances .27 6
26、Solid insulation.33 6.1 General consideration .33 6.2 Influencing factors.33 6.3 Dimensioning of solid insulation 35 7 High-frequency testing37 7.1 Basic requirements37 7.2 Test voltage source.39 7.3 Conditioning 39 7.4 High-frequency breakdown test .39 7.5 High-frequency partial discharge test 39 7
27、.6 Examples of test results 45 8 Non sinusoidal voltages45 8.1 General considerations45 8.2 Periodic impulse voltage47 8.3 Harmonic analysis .47 8.4 Dimensioning procedure and testing47 Annex A (informative) Insulation characteristics of clearances at high-frequency voltages51 Annex B (informative)
28、Insulation characteristics of creepage distances at high-frequency voltages65 Annex C (informative) Insulation characteristics of solid insulation at high-frequency voltages71 Annex D (normative) Testing of insulation at high-frequency voltages91 Annex E (informative) Insulation stressed with non-si
29、nusoidal high-frequency voltages .119 Annex F (informative) Dimensioning diagrams .129 Bibliography133 4 60664-4 CEI:2005 Figure 1 Dimensionnement des distances disolement dans lair non homognes sous pression atmosphrique (lectrodes pointe-plan, rayon de 5 m), afin dviter les DP (distance disolement
30、 1 mm) ou le claquage (distance disolement 1 mm)24 Figure 2 Dimensionnement des lignes de fuite pour viter les dcharges partielles (ligne de fuite 1 mm) ou le claquage (ligne de fuite 1 mm) .30 Figure 3 Intensit de champ admissible pour le dimensionnement de lisolation solide conformment lEquation (
31、3) 36 Figure 4 Tension de chocs priodique (voir Partie 1) .46 Figure A.1 Claquage haute frquence dans lair sous pression atmosphrique, champ homogne, gamme de frquences 50 Hz 25 MHz 3 52 Figure A.2 Claquage haute frquence dans lair sous pression atmosphrique, champ homogne, gamme de frquences 50 Hz
32、2,5 MHz 4 .54 Figure A.3 Pointe de laiguille aprs claquage (en haut) et avant claquage (en bas) 56 Figure A.4 Tensions de seuil de DP dans lair sous pression atmosphrique pour f = 100 kHz, lectrodes pointe-plan avec un rayon de point diffrent 658 Figure A.5 Tensions dextinction de DP et tensions de
33、claquage dans lair sous pression atmosphrique pour f = 460 kHz, lectrodes pointe-plan avec des aiguilles BB 660 Figure A.6 Tensions dextinction de DP et tensions de claquage dans lair sous pression atmosphrique pour f = 1 MHz, lectrodes pointe-plan avec des aiguilles BB 662 Figure B.1 Eprouvette pou
34、r la mesure des tensions de DP et des tensions de tenue des lignes de fuite jusqu 6,3 mm 64 Figure B.2 Rsultats dessai de la tension dextinction de DP Uedes lignes de fuite jusqu 6,3 mm 6 68 Figure B.3 Rsultats dessai de la tension de claquage Ubdes lignes de fuite jusqu 6,3 mm 6 68 Figure C.1 Capac
35、it de tenue aux DP des revtements; tension dessai constante Ut(f = 50 Hz) 12 .72 Figure C.2 Capacit de tenue aux DP des revtements; tension dessai augmentation linaire Ut(f = 50 Hz) 12.72 Figure C.3 Claquage haute frquence, isolation solide; d = 0,75 mm 1578 Figure C.4 Claquage haute frquence, isola
36、tion solide, influence de lhumidit; conditionnement 50 C; #1: rsines phnoliques micaces, d = 0,75 mm; #2: stratifis silicone-verre, d = 1,5 mm 19 .80 Figure C.5 Claquage haute frquence, films isolants; #1: Cellulose-Actobutyrate, #2: Polycarbonate; #3: Cellulose-Triactate 20 .84 Figure C.6 Claquage
37、haute frquence, films isolants; #1: Polystyrne, d = 80 m, #2: Polythylne, d = 50 m 20.88 Figure D.1 Transformateur rsonance haute frquence; influence du nombre de spires de la bobine secondaire N2sur la tension de sortie U2; N1= 20; N2= 210/280/350/420/560 22.90 Figure D.2 Oscillateur puissance leve
38、 et haute frquence 5 et 6 92 Figure D.3 Circuit dessai de DP pour les essais de tension haute frquence 22.96 Figure D.4 Schma du circuit dessai 5 et 6 .98 Figure D.5 Rponse dimpulsion de DP pour une frquence dimpulsion de DP considre de 2 MHz pour diffrentes frquences de coupure suprieures fcdu circ
39、uit dessai; cela inclut un filtre coupe-bande de 3meordre avec fcentre= 1 MHz 5 et 6 .100 Figure D.6 Circuit quivalent dun circuit dessai de DP avec des constantes discrtes 5104 60664-4 IEC:2005 5 Figure 1 Dimensioning of inhomogeneous clearances in air at atmospheric pressure (point-plane-electrode
40、s, 5 m radius) to avoid PD (clearance 1 mm) or breakdown (clearance 1 mm) .25 Figure 2 Dimensioning of creepage distances to avoid partial discharge (creepage distance 1 mm) or breakdown (creepage distance 1 mm).31 Figure 3 Permissible field strength for dimensioning of solid insulation according to
41、 Equation (3)37 Figure 4 Periodic impulse voltage (see Part 1) .47 Figure A.1 Breakdown at high frequency in air at atmospheric pressure, homogeneous field, frequency range 50 Hz 25 MHz 353 Figure A.2 Breakdown at high frequency in air at atmospheric pressure, homogeneous field, frequency range 50 H
42、z 2,5 MHz 4.55 Figure A.3 Needle tip after (upper) and before (lower) breakdown57 Figure A.4 PD inception voltages in air at atmospheric pressure for f = 100 kHz, point-plane electrodes with different point radius 6 .59 Figure A.5 PD extinction voltages and breakdown voltages in air at atmospheric p
43、ressure for f = 460 kHz, point-plane electrodes with BB-needles 6 61 Figure A.6 PD extinction voltages and breakdown voltages in air at atmospheric pressure for f = 1 MHz, point-plane electrodes with BB-needles 6.63 Figure B.1 Test specimen for measuring the PD voltages and the withstand voltages of
44、 creepage distances up to 6,3 mm .65 Figure B.2 Test results of the PD extinction voltage Ueof creepage distances up to 6,3 mm 6 69 Figure B.3 Test results of the breakdown voltage Ubof creepage distances up to 6,3 mm 6 69 Figure C.1 PD withstand capability of coatings; constant test voltage Ut(f =
45、50 Hz) 12 73 Figure C.2 PD withstand capability of coatings; linearly increasing test voltage Ut(f = 50 Hz) 1273 Figure C.3 Breakdown at high frequency, solid insulation; d = 0,75 mm 15 79 Figure C.4 Breakdown at high frequency, solid insulation, influence of humidity; conditioning at 50 C; #1: mica
46、-filled phenolic, d = 0,75 mm; #2: glass-silicone laminate, d = 1,5 mm 19 .81 Figure C.5 Breakdown at high frequency, insulating films; #1: Cellulose-Acetobutyrate, #2: Polycarbonate; #3: Cellulose-Triacetate 20 .85 Figure C.6 Breakdown at high frequency, insulating films; #1: Polystyrene, d = 80 m,
47、 #2: Polyethylene, d = 50 m 20.89 Figure D.1 High-frequency resonance transformer; influence of the number of turns of the secondary coil N2on the output voltage U2; N1= 20; N2= 210/280/350/420/560 22 91 Figure D.2 High-frequency high power oscillator 5 and 6 .93 Figure D.3 PD test circuit for high-
48、frequency voltage tests 22 97 Figure D.4 Diagram of the test circuit 5 and 6 99 Figure D.5 PD impulse response for an assumed PD impulse frequency of 2 MHz for different upper cut-off frequencies fcof the test circuit; this includes a 3rdorder band-stop filter with fcentre= 1 MHz 5 and 6.101 Figure D.6 Equivalent circ
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