IEC 60748-22-1-1997 Semiconductor devices - Integrated circuits - Part 22-1 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis.pdf

1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 60748221 QC760201 Deuximedition Secondedition 199704 Numroderfrence Referencenumber CEI/IEC60748221:1997 Dispositifssemiconducteurs Circuitsintgrs Partie221: Spcificationparticulirecadrepour lescircuitsintgrscouchesetlescircuits intgrshybridescouch

2、essurlabase desprocduresdagrmentdesavoirfaire Semiconductordevices Integratedcircuits Part221: Blankdetailspecificationforfilm integratedcircuitsandhybridfilmintegratedcircuits onthebasisofthecapabilityapprovalproceduresValiditdelaprsentepublication LecontenutechniquedespublicationsdelaCEIestcons ta

3、mmentrevuparlaCEIafinquilreflteltatactuelde latechnique. Desrenseignementsrelatifsladatedereconfirmationde lapublicationsontdisponiblesauprsduBureauCentralde laCEI. Lesrenseignementsrelatifscesrvisions,ltablis sementdesditionsrvisesetauxamendementspeuvent treobtenusauprsdesComitsnationauxdelaCEIet d

4、anslesdocumentscidessous: BulletindelaCEI AnnuairedelaCEI Publiannuellement CataloguedespublicationsdelaCEI Publiannuellementetmisjourrgulirement Terminologie Encequiconcernelaterminologiegnrale,lelecteurse reporteralaCEI50:VocabulaireElectrotechniqueInter national(VEI),quiseprsentesousformedechapit

5、res sparstraitantchacundunsujetdfini.Desdtails completssurleVEIpeuventtreobtenussurdemande. VoirgalementledictionnairemultilinguedelaCEI. Lestermesetdfinitionsfigurantdanslaprsentepubli cationonttsoittirsduVEI,soitspcifiquement approuvsauxfinsdecettepublication. Symbolesgraphiquesetlittraux Pourless

6、ymbolesgraphiques,lessymboleslittrauxetles signesdusagegnralapprouvsparlaCEI,lelecteur consultera: laCEI27: Symboleslittrauxutiliseren lectrotechnique; laCEI417: Symbolesgraphiquesutilisables surlematriel.Index,relevetcompilationdes feuillesindividuelles; laCEI617: Symbolesgraphiquespourschmas; etpo

7、urlesappareilslectromdicaux, laCEI878: Symbolesgraphiquespour quipementslectriquesenpratiquemdicale. Lessymbolesetsignescontenusdanslaprsentepubli cationonttsoittirsdelaCEI27,delaCEI417,dela CEI617et/oudelaCEI878,soitspcifiquementapprouvs auxfinsdecettepublication. PublicationsdelaCEItabliesparle mm

8、ecomitdtudes Lattentiondulecteurestattiresurleslistesfigurantlafin decettepublication,quinumrentlespublicationsdela CEIprparesparlecomitdtudesquiatablila prsentepublication. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthecontent re

9、flectscurrenttechnology. Informationrelatingtothedateofthereconfirmationofthe publicationisavailablefromtheIECCentralOffice. Informationontherevisionwork,theissueofrevised editionsandamendmentsmaybeobtainedfromIEC NationalCommitteesandfromthefollowingIEC sources: IECBulletin IECYearbook Publishedyea

10、rly CatalogueofIECpublications Publishedyearlywithregularupdates Terminology Forgeneralterminology,readersarereferredtoIEC50: InternationalElectrotechnicalVocabulary (IEV),whichis issuedintheformofseparatechapterseachdealing withaspecificfield.FulldetailsoftheIEVwillbe suppliedonrequest.SeealsotheIE

11、CMultilingual Dictionary. Thetermsanddefinitionscontainedinthepresentpubli cationhaveeitherbeentakenfromtheIEVorhavebeen specificallyapprovedforthepurposeofthispublication. Graphicalandlettersymbols Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersarereferredto publi

12、cations: IEC27: Lettersymbolstobeusedinelectrical technology; IEC417: Graphicalsymbolsforuseon equipment.Index,surveyandcompilationofthe singlesheets; IEC617: Graphicalsymbolsfordiagrams; andformedicalelectricalequipment, IEC878:Graphicalsymbolsforelectromedical equipmentinmedicalpractice. Thesymbol

13、sandsignscontainedinthepresentpublication haveeitherbeentakenfromIEC27,IEC417,IEC617 and/orIEC878,orhavebeenspecificallyapprovedforthe purposeofthispublication. IECpublicationspreparedbythesame technicalcommittee Theattentionofreadersisdrawntotheendpagesofthis publicationwhichlisttheIECpublicationsi

14、ssuedbythe technicalcommitteewhichhaspreparedthepresent publication.NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 60748221 Deuximedition Secondedition 199704 Dispositifssemiconducteurs Circuitsintgrs Partie221: Spcificationparticulirecadrepour lescircuitsintgrscouchesetlescircuits intgrshybrid

15、escouchessurlabase desprocduresdagrmentdesavoirfaire Semiconductordevices Integratedcircuits Part221: Blankdetailspecificationforfilm integratedcircuitsandhybridfilmintegratedcircuits onthebasisofthecapabilityapprovalprocedures N Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue CODEPRIX

16、PRICECODE IEC1997Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteniut ilise sousquelqueformequecesoitetparaucunprocd,lectronique oumcanique,ycomprislaphotocopieetlesmicrofilms,sans laccordcritdelditeur. Nopartofthispublicationmaybereproducedorut

17、 ilizedin anyformorbyanymeans,electronicormechanical,including photocopyingandmicrofilm,withoutpermissioninwritingfrom thepublisher. InternationalElectrotechnicalCommission 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CommissionElectrotechniqueIn

18、ternationale InternationalElectrotechnicalCommission2 60748221CEI:1997 SOMMAIRE Pages AVANTPROPOS 4 INTRODUCTION . 6 Articles 1 Caractristiquesetconditionsdutilisation. 12 2 Mthodesdemontagerecommandes 12 3Marquage. 12 4 Renseignementsdonnerdanslescommandes . 12 5 Rapportscertifisdeslotsaccepts 14 6

19、Renseignements supplmentaires. 14 7 Exigencescomplmentairesouplussvresquecellesspcifiesdanslaspcification gnriqueet/ouintermdiaire 14 8 Exigencesdecontrle(voirtableaux2et3ou4et5) . 14 9 ComplmentTableauxdelaMthodeB . 22 Tableaux 1 Siunegammedecircuits. 10 2 MthodeAGroupesAetBLotparlot . 16 3a Mthode

20、AGroupeCEssaispriodiques. 18 3b MthodeAGroupeDEssaispriodiques. 20 4a MthodeBGroupeALotparlot 22 4b MthodeBGroupeBLotparlot 24 5a MthodeBGroupeCEssaispriodiques. 26 5b MthodeBGroupeDEssaispriodiques. 2860748221IEC:1997 3 CONTENTS Page FOREWORD . 5 INTRODUCTION . 7 Clause 1 Characteristicsandconditio

21、nsofuse 13 2 Recommendedmethodsofmounting 13 3Marking 13 4Ordering information. 13 5 Certifiedrecordsofreleasedlots 15 6Additional information. 15 7 Additionalorincreasedseveritiesorrequirementstothosespecifiedinthegeneric and/orsectionalspecification 15 8 Inspectionrequirements(seetables2and3or4and

22、5) 15 9 SupplementTablesofmethodB. 23 Tables 1 Wherearangeofcircuits. 11 2 MethodAGroupsAandBLotbylot . 17 3a MethodAGroupCPeriodictests. 19 3b MethodAGroupDPeriodictests. 21 4a MethodBGroupALotbylot . 23 4b MethodBGroupBLotbylot . 25 5a MethodBGroupCPeriodictests. 27 5b MethodBGroupDPeriodictests.

23、294 60748221CEI:1997 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ DISPOSITIFSSEMICONDUCTEURS CIRCUITSINTGRS Partie221:Spcificationparticulirecadrepourlescircuits intgrscouchesetlescircuitsintgrshybridescouches surlabasedesprocduresdagrmentdesavoirfaire AVANTPROPOS 1) LaCEI(CommissionElectrotechniqueInt

24、ernationale)estuneorganisationmondialedenormalisation composedelensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIa pourobjetdefavoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdansles domainesdellectricitetdellectronique.Aceteffet,laCEI,entreautresactivit

25、s,publiedesNormes Internationales.Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComit nationalintressparlesujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementaleset nongouvernementales,enliaisonaveclaCEI,participentgalementauxtravaux.LaCEIcollabore troitementaveclOrga

26、nisationInternationaledeNormalisation(ISO),selondesconditionsfixesparaccord entrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniques,reprsentent,dansla mesuredupossibleunaccordinternationalsurlessujetstudis,tantdonnquelesComitsnationaux intressssontreprsents

27、danschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationauxdelaCEIsengagentappliquer defaontranspare

28、nte,danstoutelamesurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernantlemarquagecommeindicationdapprobationetsa

29、 responsabilitnestpasengagequandunmatrielestdclarconformelunedesesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour responsabledenepasavoiridentifidetelsdroitsdepro

30、pritetdenepasavoirsignalleurexistence. LanormeinternationaleCEI60748221attablieparlesouscomit47A:Circuitsintgrs, ducomitdtudes47delaCEI:Dispositifssemiconducteurs. Cettedeuximeditionannuleetremplacelapremireditionparueen1991etconstitueune rvisiontechnique. Cettenormeestunespcificationparticulirecadr

31、epourlescircuitsintgrscouchesetles circuitsintgrshybridescouches. Letextedecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 47A/447/FDIS 47A/479/RVD Lerapportdevoteindiqudansletableaucidessusdonnetouteinformationsurlevoteayant aboutilapprobationdecettenorme. LenumroQCquifiguresurlapagedecou

32、verturedelaprsentepublicationestlenumrode laspcificationdanslesystmeCEIdassurancedelaqualitdescomposantslectroniques (IECQ).60748221IEC:1997 5 INTERNATIONALELECTROTECHNICALCOMMISSION _ SEMICONDUCTORDEVICES INTEGRATEDCIRCUITS Part221:Blankdetailspecificationfor filmintegratedcircuitsandhybridfilminte

33、gratedcircuits onthebasisofthecapabilityapprovalprocedures FOREWORD 1) TheIEC(InternationalElectrotechnicalCommission)isaworldwideorganizationforstandardization comprisingallnationalelectrotechnicalcommittees(IECNationalCommittees).TheobjectoftheIECisto promoteinternationalcooperationonallquestionsc

34、oncerningstandardizationintheelectricalandelectronic fields.Tothisendandinadditiontootheractivities,theIECpublishesInternationalStandards.Their preparationisentrustedtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealt withmayparticipateinthispreparatorywork.International,governm

35、entalandnongovernmentalorganizations liaisingwiththeIECalsoparticipateinthispreparation.TheIECcollaboratescloselywiththeInternational OrganizationforStandardization(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthe twoorganizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmat

36、tersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCommittees. 3) Thedocumentsproducedhavetheformofrecommendationsforinternationaluseandarepublishedinthe formofstandards,technicalreportsorguidesa

37、ndtheyareacceptedbytheNationalCommitteesinthat sense. 4) Inordertopromoteinternationalunification,IECNationalCommitteesundertaketoapplyIECInternational Standardstransparentlytothemaximumextentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalor

38、regionalstandardshallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingproceduretoindicateitsapprovalandcannotberenderedresponsibleforany equipmentdeclaredtobeinconformitywithoneofitsstandards. 6) AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethe subjec

39、tofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. InternationalStandardIEC60748221hasbeenpreparedbysubcommittee47A:Integrated circuits,ofIECtechnicalcommittee47:Semiconductordevices. Thissecondeditioncancelsandreplacesthefirsteditionpublishedin1991andconstitutesa

40、 technicalrevision. Thisstandardisablankdetailspecificationforfilmintegratedcircuitsandhybridfilm integratedcircuits. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 47A/447/FDIS 47A/479/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundinthereporton voting

41、indicatedintheabovetable. TheQCnumberthatappearsonthefrontcoverofthispublicationisthespecificationnumber intheIECQualityAssessmentSystemforElectronicComponents(IECQ).6 60748221CEI:1997 DISPOSITIFSSEMICONDUCTEURS CIRCUITSINTGRS Partie221:Spcificationparticulirecadrepourlescircuits intgrscouchesetlesc

42、ircuitsintgrshybridescouches surlabasedesprocduresdagrmentdesavoirfaire INTRODUCTION LesystmeCEIdassurancedelaqualitdescomposantslectroniquesfonctionne conformmentauxstatutsdelaCEIetsoussonautorit.Lebutdecesystmeestdedfinir lesprocduresdassurancedelaqualitdetellefaonquelescomposantslectroniqueslivrs parunpay