IEC 60749-21-2011 Semiconductor devices - Mechanical and climatic test methods - Part 21 Solderability《半导体器件.机械和气候试验方法.第21部分 可焊性》.pdf

1、 IEC 60749-21 Edition 2.0 2011-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 21: Solderability Dispositifs semiconducteur Mthodes dessai mcaniques et climatiques Partie 21: Brasabilit IEC 60749-21:2011 THIS PUBLICATION IS COPYRIGHT PRO

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16、iec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60749-21 Edition 2.0 2011-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Mechanical and climatic test methods Part 21: Solderability Dispositifs semiconducteur Mthodes dessai mcaniques et climatiques Partie 21: Brasabilit I

17、NTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-433-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 60749-21 IEC:2011 CONT

18、ENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Test apparatus . 6 3.1 Solder bath 6 3.2 Dipping device. 6 3.3 Optical equipment . 7 3.4 Steam ageing equipment . 7 3.5 Lighting equipment 7 3.6 Materials . 7 3.6.1 Flux . 7 3.6.2 Solder . 7 3.7 SMD reflow equipment 8 3.7.1 Stencil or screen

19、 . 8 3.7.2 Rubber squeegee or metal spatula 8 3.7.3 Test substrate . 8 3.7.4 Solder paste 9 3.7.5 Reflow equipment 9 3.7.6 Flux removal solvent 9 4 Procedure 9 4.1 Lead-free backward compatibility 9 4.2 Preconditioning . 10 4.2.1 General . 10 4.2.2 Preconditioning by steam ageing . 10 4.2.3 Precondi

20、tioning by high temperature storage . 11 4.3 Procedure for dip and look solderability testing . 11 4.3.1 General . 11 4.3.2 Solder dip conditions . 11 4.3.3 Procedure 11 4.4 Procedure for simulated board mounting reflow solderability testing of SMDs 19 4.4.1 General . 19 4.4.2 Test equipment set-up

21、. 19 4.4.3 Specimen preparation and surface condition . 20 4.4.4 Visual inspection . 21 5 Summary 21 Bibliography 22 Figure 1 Areas to be inspected for gullwing packages 15 Figure 2 Areas to be inspected for J-lead packages . 16 Figure 3 Areas to be inspected in rectangular components (SMD method) 1

22、7 Figure 4 Areas to be inspected in SOIC and QFP packages (SMD method) . 18 Figure 5 Flat peak type reflow profile . 20 Table 1 Steam ageing conditions . 10 Table 2 Altitude versus steam temperature 10 60749-21 IEC:2011 3 Table 3 Solder dip test conditions 11 Table 4 Maximum limits of solder bath co

23、ntaminant . 13 4 60749-21 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 21: Solderability FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national ele

24、ctrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specif

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32、, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cit

33、ed in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifyi

34、ng any or all such patent rights. International Standard IEC 60749-21 has been prepared by IEC technical committee 47: Semiconductor devices. This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (le

35、ad)free backward compatibility. The text of this standard is based on the following documents: FDIS Report on voting 47/2082/FDIS 47/2089/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. 60749-21 IEC:2011 5 This p

36、ublication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 series, under the general title Semiconductor devices Mechanical and climatic test methods can be found on the IEC website. The committee has decided that the contents of this publicat

37、ion will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 60749-21 IEC:2011 SEMICONDUCTOR D

38、EVICES MECHANICAL AND CLIMATIC TEST METHODS Part 21: Solderability 1 Scope This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder fo

39、r the attachment. This test method provides a procedure for dip and look solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to

40、be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification. NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductor

41、s, the following text is applied. NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20. 2 Normative references The following referenced documents are indispensable for the applicatio

42、n of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61190-1-2:2007, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-qu

43、ality interconnects in electronics assembly IEC 61190-1-3:2007, Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications 3 Test apparatus This test method requires the followin

44、g equipment. 3.1 Solder bath The solder bath shall be not less than 40 mm in depth and not less than 300 ml in volume such that it can contain at least 1 kg of solder. The apparatus shall be capable of maintaining the solder at the specified temperature within 5 C. 3.2 Dipping device A mechanical di

45、pping device capable of controlling the rates of immersion and emersion of the terminations and providing a dwell time (time of total immersion to the required depth) in the solder bath as specified shall be used. 60749-21 IEC:2011 7 3.3 Optical equipment An optical microscope capable of providing m

46、agnification inspection from 10 to 20 shall be used. 3.4 Steam ageing equipment A non-corrodible container and cover of sufficient size to allow the placement of specimens inside the vessel shall be used. The specimens shall be placed such that the lowest portion of the specimen is a minimum of 40 m

47、m above the surface of the water. A suitable method of supporting the specimens shall be improvised using non-contaminating material. NOTE During steam ageing, the test devices should be located in a manner so as to prevent water (steam condensate) from dripping on them. 3.5 Lighting equipment A lig

48、hting system shall be used that will provide a uniform, non-glare, non-directional illumination of the specimen. 3.6 Materials 3.6.1 Flux Unless otherwise detailed in the relevant specification, the flux shall be a standard activated rosin flux (type ROL1 in accordance with IEC 61190-1-3 (2007), Tab

49、le 2, Flux type and designating symbols) having a composition of 25 % 0,5 % by weight of colophony and 0,15 % 0,01 % by weight diethylammonium hydrochloride, in 74,85 % 0,5 % by weight of in 2-propanol (isopropanol). The specific gravity of the standard activated rosin flux shall be 0,843 0,005 at 25 C 2 C. The specification shall be as follows: Colophony Colour To WW co