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本文(IEC 61182-2-2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2 Generic requirements《印制电路板.恒产描述数据和转换方法.第2部分 一般要求》.pdf)为本站会员(appealoxygen216)主动上传,麦多课文库仅提供信息存储空间,仅对用户上传内容的表现方式做保护处理,对上载内容本身不做任何修改或编辑。 若此文所含内容侵犯了您的版权或隐私,请立即通知麦多课文库(发送邮件至master@mydoc123.com或直接QQ联系客服),我们立即给予删除!

IEC 61182-2-2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2 Generic requirements《印制电路板.恒产描述数据和转换方法.第2部分 一般要求》.pdf

1、 INTERNATIONAL STANDARD IEC 61182-2First edition 2006-09Printed board assembly products Manufacturing description data and transfer methodology Part 2: Generic requirements Reference number IEC 61182-2:2006(E) Publication numbering As from 1 January 1997 all IEC publications are issued with a design

2、ation in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incorporatin

3、g amendment 1 and the base publication incorporating amendments 1 and 2. Further information on IEC publications The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to this publication, i

4、ncluding its validity, is available in the IEC Catalogue of publications (see below) in addition to new editions, amendments and corrigenda. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the

5、list of publications issued, is also available from the following: IEC Web Site (www.iec.ch) Catalogue of IEC publications The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to search by a variety of criteria including text searches, technical committees and date of publica

6、tion. On-line information is also available on recently issued publications, withdrawn and replaced publications, as well as corrigenda. IEC Just Published This summary of recently issued publications (www.iec.ch/online_news/ justpub) is also available by email. Please contact the Customer Service C

7、entre (see below) for further information. Customer Service Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 INTERNATIONAL STANDARD IEC 61182-2First ed

8、ition 2006-09Printed board assembly products Manufacturing description data and transfer methodology Part 2: Generic requirements IEC 2006 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photoc

9、opying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch XH For price, see current catalog

10、ue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission 2 61182-2 IEC:2006(E) CONTENTS FOREWORD.7 1 Scope and object9 1.1 Focus and intent9 1.2 Notation 9 2 Normative references .10 3 Documentation conventions10 4 Requirements.12 4.1 Rules concerning the us

11、e of XML and XML Schema13 4.2 Data organization and identification rules 14 4.3 Transformation characteristics (Xform)19 4.4 Substitution groups .21 5 Content 32 5.1 Content: FunctionMode .33 5.2 Function levels 35 5.3 Content: StepListRef .47 5.4 Content: LayerDescRef .47 5.5 Content: BomRef.48 5.6

12、 Content: AvlRef.48 5.7 Content: DictionaryStandard49 5.8 Content: DictionaryUser 66 5.9 Content: DictionaryFont.74 5.10 Content: DictionaryLineDesc .77 5.11 Content: DictionaryColor .79 5.12 Content: DictionaryFirmware .80 6 Logistic header.82 6.1 LogisticHeader 82 6.2 Role 83 6.3 Enterprise .84 6.

13、4 Person 85 7 History record.86 7.1 HistoryRecord .86 7.2 FileRevision 87 7.3 SoftwarePackage 87 7.4 ChangeRec .88 8 BOM (Material List) 89 8.1 BOM Header .90 8.2 BomItem91 9 Electronic computer aided design (ecad) 96 9.1 CadHeader97 9.2 CadData/LayerDesc 100 9.3 CadData/StepList 109 10 Approved ven

14、dor list (AVL).150 10.1 AvlHeader .151 10.2 AvlItem152 11 Glossary.154 61182-2 IEC:2006(E) 3 Annexe A (informative) IPC-7351 Naming Convention for Land Patterns155 Annexe B Informative references 160 Figure 1 The IEC 61182-2 children element .13 Figure 2 Printed board viewing.18 Figure 3 Mirror and

15、rotation diagram21 Figure 4 Bounding rectangle to round end character relationships .72 Figure 5 Text transformation examples 73 Figure 6 Rotation Angle .73 Figure 7 Glyph bounding rectangles to Text bounding box relationships.77 Table 1 Graphical notation overview .11 Table 2 Governing template bas

16、ic types defined by W3C.16 Table 3 Governing template basic types defined by IEC 61182-2-X17 Table 4 Xform characteristics.19 Table 5 Substitution groups .22 Table 6 Attribute substitution group 23 Table 7 ColorGroup substitution group 25 Table 8 Feature substitution group 25 Table 9 Fiducial substi

17、tution group 26 Table 10 FirmwareGroup substitution group 26 Table 11 FontDef substitution group 27 Table 12 LineDescGroup substitution group 27 Table 13 Polystep substitution group 28 Table 14 Simple substitution group 28 Table 15 Standard primitive substitution group.29 Table 16 StandardShape subs

18、titution group.31 Table 17 UserPrimitive substitution group 31 Table 18 UserShape substitution group32 Table 19 Content sub-element.32 Table 20 File segmentation and function apportionment.34 Table 21 Content FunctionMode .36 Table 22 Content StepListRef .47 Table 23 Content LayerDescRef .48 Table 2

19、4 Content BomRef.48 Table 25 Content AvlRef .49 Table 26 Content DictionaryStandard.49 Table 27 StandardPrimitive Butterfly.50 Table 28 StandardPrimitive Circle.51 Table 29 StandardPrimitive Contour51 Table 30 StandardPrimitive Diamond 53 Table 31 StandardPrimitive Donut.54 4 61182-2 IEC:2006(E) Tab

20、le 32 StandardPrimitive Ellipse55 Table 33 StandardPrimitive Hexagon 56 Table 34 StandardPrimitive Moire .57 Table 35 StandardPrimitive Octagon.58 Table 36 StandardPrimitive Oval.58 Table 37 StandardPrimitive RectCenter 59 Table 38 StandardPrimitive RectCham.60 Table 39 StandardPrimitive RectCorner

21、61 Table 40 StandardPrimitive RectRound.62 Table 41 StandardPrimitive Thermal 63 Table 42 StandardPrimitive Triangle .65 Table 43 Content DictionaryUser 66 Table 44 UserPrimitive Simple 67 Table 45 UserPrimitive Simple: Arc.67 Table 46 UserPrimitive Simple: Line .68 Table 47 UserPrimitive Simple: Ou

22、tline.69 Table 48 UserPrimitive Simple: PolyLine.70 Table 49 UserPrimitive Text.71 Table 50 UserPrimitive UserSpecial74 Table 51 Content DictionaryFont.74 Table 52 FontDetEmbedded element .75 Table 53 FontDetExternal element.75 Table 54 FontDet Glyph 76 Table 55 Content DictionaryLineDesc .77 Table

23、56 LineDesc element78 Table 57 LineDescRef element 79 Table 58 Content DictionaryColor .79 Table 59 Color element80 Table 60 ColorRef element 80 Table 61 Content DictionaryFirmware .80 Table 62 CachedFirmware element81 Table 63 FirmwareRef element 82 Table 64 LogisticHeader element.82 Table 65 Role

24、element.83 Table 66 Enterprise element 84 Table 67 Person element .85 Table 68 HistoryRecord element86 Table 69 FileRevision element.87 Table 70 SoftwarePackage element.87 Table 71 ChangeRec element88 Table 72 Bom element .89 Table 73 BomHeader element90 Table 74 BomItem91 61182-2 IEC:2006(E) 5 Tabl

25、e 75 RefDes element.92 Table 76 Tuning element .93 Table 77 Firmware element93 Table 78 Characteristics element.94 Table 79 Measured element.94 Table 80 Ranged element 95 Table 81 Enumerated element .96 Table 82 Textual element.96 Table 83 Ecad96 Table 84 CadHeader element 97 Table 85 Spec element 9

26、8 Table 86 SurfaceFinish element.99 Table 87 ChangeRec element100 Table 88 CadData/LayerDesc elements .101 Table 89 Layer element .101 Table 90 Span element 103 Table 91 DrillTool element .104 Table 92 Stackup element .105 Table 93 StackupGroup .105 Table 94 StackupImpedance element.107 Table 95 Cad

27、Data StepList 109 Table 96 Step 110 Table 97 Attribute substitution group111 Table 98 PadStack element .112 Table 99 LayHole element .112 Table 100 LayerPad element .113 Table 101 Route element.114 Table 102 Set 115 Table 103 Datum element 116 Table 104 Profile element 117 Table 105 StepRepeat eleme

28、nt118 Table 106 Package element.120 Table 107 Outline element .121 Table 108 LandPattern element .122 Table 109 SilkScreen element123 Table 110 AssemblyDrawing element.125 Table 111 Pin element .127 Table 112 Component element 128 Table 113 VplPackage element130 Table 114 VplComponent element .132 T

29、able 115 LogicalNet elements133 Table 116 PhyNetGroup element .134 Table 117 PhyNet element.134 6 61182-2 IEC:2006(E) Table 118 LayerFeature element136 Table 119 Attribute element .139 Table 120 Pad element 139 Table 121 Fiducial .140 Table 122 BadBoardMark element .141 Table 123 GlobalFiducial elem

30、ent142 Table 124 GoodpanelMark element143 Table 125 LocalFiducial element145 Table 126 Hole element.146 Table 127 Slot element 147 Table 128 Features element 147 Table 129 ColorGroup substitution group.148 Table 130 LineDescGroup substitution group.149 Table 131 DfxMeasurementList element 149 Table

31、132 DfxMeasurement element150 Table 133 Avl element .150 Table 134 AvlHeader element 151 Table 135 AvlItem element 152 Table 136 AvlVmpn element 152 Table 137 AvlMpn element.153 Table 138 AvlVendor element 154 61182-2 IEC:2006(E) 7 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARD ASSEMBLY P

32、RODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY Part 2: Generic requirements FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IE

33、C is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS)

34、 and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with

35、 the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nea

36、rly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in tha

37、t sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committee

38、s undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking proce

39、dure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agen

40、ts including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of,

41、or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some o

42、f the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61182-2 has been prepared by IEC technical committee 93: Design automation. The text of this standard is based on th

43、e following documents: CDV Report on voting 93/211/CDV 93/231/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 8 61182-2 IEC:200

44、6(E) The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, repl

45、aced by a revised edition, or amended. A bilingual version of this standard may be issued at a later date. 61182-2 IEC:2006(E) 9 PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY Part 2: Generic requirements 1 Scope and object This part of IEC 61182 specifies th

46、e XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board des

47、igner and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer- aided processes and numerical control machines. The data can be defined in either English or International System of Units (SI) units. 1.1 Focus and intent The generic format requi

48、rements are provided in a series of standards focused on printed board manufacturing, assembly, and inspection testing. This standard series consists of a generic standard (IEC 61182-2) that contains all the general requirements. There are four sectional standards that are focused on the XML details necessary to accumulate information in the single file, that addresses the needs of the design, fabrication, assembly a

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