IEC 61188-1-2-1998 Printed boards and printed boards assemblies - Design and use - Part 1-2 Generic requirements - Controlled impedance《印制电路板和印制电路板组件 设计和使用 第1-2部分 一般要求 控制阻抗》.pdf

1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 6118812 Premiredition Firstedition 199804 Cartesimprimesetcartesimprimesquipes Conceptionetutilisation Partie12: Prescriptionsgnriques Impdancecontrle Printedboardsandprintedboardassemblies Designanduse Part12: Genericrequirements Controlledimpedan

2、ce Numroderfrence Referencenumber CEI/IEC6118812:1998Numrosdespublications Depuisle1erjanvier1997,lespublicationsdelaCEI sontnumrotespartirde60000. Publicationsconsolides Lesversionsconsolidesdecertainespublicationsde laCEIincorporantlesamendementssontdisponibles. Parexemple,lesnumrosddition1.0,1.1e

3、t1.2 indiquentrespectivementlapublicationdebase,la publicationdebaseincorporantlamendement1,etla publicationdebaseincorporantlesamendements1 et2. Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIest constammentrevuparlaCEIafinquilreflteltat actueldelatechnique. Desrenseignements

4、relatifsladatede reconfirmationdelapublicationsontdisponiblesdans leCataloguedelaCEI. Lesrenseignementsrelatifsdesquestionsltudeet destravauxencoursentreprisparlecomittechnique quiatablicettepublication,ainsiquelalistedes publicationstablies,setrouventdanslesdocumentsci dessous: SitewebdelaCEI* Cata

5、loguedespublicationsdelaCEI Publiannuellementetmisjourrgulirement (Catalogueenligne)* BulletindelaCEI DisponiblelafoisausitewebdelaCEI*et commepriodiqueimprim Terminologie,symbolesgraphiques etlittraux Encequiconcernelaterminologiegnrale,lelecteur sereporteralaCEI60050: VocabulaireElectro techniqueI

6、nternational (VEI). Pourlessymbolesgraphiques,lessymboleslittraux etlessignesdusagegnralapprouvsparlaCEI,le lecteurconsulteralaCEI60027: Symboleslittraux utiliserenlectrotechnique,laCEI60417:Symboles graphiquesutilisablessurlematriel.Index,relevet compilationdesfeuillesindividuelles, etlaCEI60617: S

7、ymbolesgraphiquespourschmas. * Voiradressesitewebsurlapagedetitre. Numbering Asfrom1January1997allIECpublicationsare issuedwithadesignationinthe60000series. Consolidatedpublications ConsolidatedversionsofsomeIECpublications includingamendmentsareavailable.Forexample, editionnumbers1.0,1.1and1.2refer

8、respectively,to thebasepublication,thebasepublication incorporatingamendment1andthebasepublication incorporatingamendments1and2. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthe contentreflectscurrenttechnology. Informationrelating

9、tothedateofthereconfirmationof thepublicationisavailableintheIECcatalogue. Informationonthesubjectsunderconsiderationand workinprogressundertakenbythetechnical committeewhichhaspreparedthispublication,aswell asthelistofpublicationsissued,istobefoundatthe followingIECsources: IECwebsite* CatalogueofI

10、ECpublications Publishedyearlywithregularupdates (Onlinecatalogue)* IECBulletin AvailablebothattheIECwebsite*andasa printedperiodical Terminology,graphicalandletter symbols Forgeneralterminology,readersarereferredto IEC60050:InternationalElectrotechnicalVocabulary (IEV). Forgraphicalsymbols,andlette

11、rsymbolsandsigns approvedbytheIECforgeneraluse,readersare referredtopublicationsIEC60027: Lettersymbolsto beusedinelectricaltechnology ,IEC60417: Graphical symbolsforuseonequipment.Index,surveyand compilationofthesinglesheets andIEC60617: Graphicalsymbolsfordiagrams. * Seewebsiteaddressontitlepage.N

12、ORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 6118812 Premiredition Firstedition 199804 Cartesimprimesetcartesimprimesquipes Conceptionetutilisation Partie12: Prescriptionsgnriques Impdancecontrle Printedboardsandprintedboardsassemblies Designanduse Part12: Genericrequirements Controlledimpedan

13、ce CommissionElectrotechniqueInternationale InternationalElectrotechnicalCommission Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue IEC1998Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteni utilisesous quelqueformequecesoitetparaucu

14、n procd,lectroniqueoumcanique,ycomprislaphoto copieetlesmicrofilms,sanslaccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilizedin anyformorbyanymeans,electronicormechanical, includingphotocopyingandmicrofilm,withoutpermissionin writingfromthepublisher. InternationalElectrotechnicalCom

15、mission 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CODEPRIX PRICECODE X2 6118812CEI:1998 SOMMAIRE Pages AVANTPROPOS 4 INTRODUCTION . 6 Articles 1 Domainedapplication. 8 2 Rfrencesnormatives . 8 3 Vuedensembledelaconceptiontechnique 8 3.1 Slecti

16、ondudispositif 8 3.2 Intraconnexion . 10 3.3 Cartesimprimesetcartesimprimesquipes. 12 3.4 Prescriptionsdeperformance. 16 3.5 Rpartitiondelapuissance 36 4 Conceptiondescircuitsdimpdancecontrle . 38 4.1 Configurations . 38 4.2 Equations 40 4.3 Rglesdeconceptiondimpdancecontrle . 46 4.4 Rglesdediaphoni

17、e 48 4.5 Rglesdeconceptiondecoupon 50 4.6 Rglesrelativesaudcouplage/condensateur 54 5 Conceptionrelativelafabrication . 58 5.1 RglesdeprocessusenCAO(conceptionassisteparordinateur) 58 5.2 Complexitdelaconceptionetcorrlationaveclecot 58 6 Descriptiondesdonnes. 58 6.1 Dtailsdeconstruction. 60 6.2 Isol

18、ationdesdonnesparclassedefilet(bruit,cadencement,capacit etimpdance) 60 6.3 Performanceslectriques. 62 7 Matriau . 62 7.1 Systmesrsineux. 62 7.2 Renforts. 62 7.3 Feuillesprimprgnes,couchesdeliaisonetadhsifs 64 7.4 Dpendancevisvisdelafrquence 64 8 Fabrication . 64 8.1 Gnralits 64 8.2 Processusdeprpro

19、duction. 66 8.3 Processusdeproduction 70 8.4 Impactdesdfautshautefrquence 74 8.5 Descriptiondedonnes 78 9 Essaiderflectomtrietemporelle(TDR) 78 9.1 Justification . 78 AnnexeAUnits,symbolesetterminologie. 826118812IEC:1998 3 CONTENTS Page FOREWORD . 5 INTRODUCTION . 7 Clause 1 Scope. 9 2 Normativeref

20、erences 9 3 Engineeringdesignoverview. 9 3.1 Deviceselection. 9 3.2 Intraconnection 11 3.3 Printedboardandprintedboardassemblies. 13 3.4 Performancerequirements. 17 3.5 Powerdistribution 37 4 Designofcontrolledimpedancecircuits 39 4.1 Configurations . 39 4.2 Equations 41 4.3 Controlledimpedancedesig

21、nrules. 47 4.4 Crosstalkrules . 49 4.5 Coupondesignrules 51 4.6 Decoupling/capacitorrules . 55 5 Designformanufacturing 59 5.1 ProcessrulesinCAD. 59 5.2 Designcomplexityandcorrelationtocost. 59 6 Datadescription 59 6.1 Detailsofconstruction 61 6.2 Isolationofdatabynetclass(noise,timing,capacitancean

22、dimpedance). 61 6.3 Electricalperformance . 63 7 Material 63 7.1 Resinsystems . 63 7.2 Reinforcements 63 7.3 Prepregs,bondinglayersandadhesives 65 7.4 Frequencydependence 65 8 Fabrication . 65 8.1 General . 65 8.2 Preproductionprocesses 67 8.3 Productionprocesses. 71 8.4 Impactofdefectsathighfrequen

23、cies . 75 8.5 Datadescription. 79 9 Timedomainreflectometry(TDR)testing 79 9.1Rationale.79 AnnexAUnits,symbols,andterminology 834 6118812CEI:1998 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ CARTESIMPRIMESETCARTESIMPRIMESQUIPES CONCEPTIONETUTILISATION Partie12:Prescriptionsgnriques Impdancecontrle AVAN

24、TPROPOS 1) LaCEI(CommissionElectrotechniqueInternationale)estuneorganisationmondialedenormalisationcompose delensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIapourobjetde favoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdanslesdomainesde llectricitetdel

25、lectronique.Aceteffet,laCEI,entreautresactivits,publiedesNormesInternationales. Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComitnationalintressparle sujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementalesetnongouvernementales,en liaisonaveclaCEI,participentgalemen

26、tauxtravaux.LaCEIcollaboretroitementaveclOrganisation InternationaledeNormalisation(ISO),selondesconditionsfixesparaccordentrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniques,reprsentent,danslamesure dupossibleunaccordinternationalsurlessujetstudis,tantdo

27、nnquelesComitsnationauxintresss sontreprsentsdanschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnatio

28、nauxdelaCEIsengagentappliquerde faontransparente,danstoutelamesurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcer

29、nantlemarquagecommeindicationdapprobationetsaresponsabilit nestpasengagequandunmatrielestdclarconformelunedesesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour res

30、ponsabledenepasavoiridentifidetelsdroitsdepropritetdenepasavoirsignalleurexistence. LaNormeinternationaleCEI6118812attablieparlecomitdtudes52delaCEI: Circuitsimprims. Letextedecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 52/758/FDIS 52/762/RVD Lerapportdevoteindiqudansletableaucidessusd

31、onnetouteinformationsurlevoteayant aboutilapprobationdecettenorme. LannexeAestdonneuniquementtitredinformation.6118812IEC:1998 5 INTERNATIONALELECTROTECHNICALCOMMISSION _ PRINTEDBOARDSANDPRINTEDBOARDASSEMBLIES DESIGNANDUSE Part12:Genericrequirements Controlledimpedance FOREWORD 1) TheIEC(Internation

32、alElectrotechnicalCommission)isaworldwideorganizationforstandardizationcomprising allnationalelectrotechnicalcommittees(IECNationalCommittees).TheobjectoftheIECistopromote internationalcooperationonallquestionsconcerningstandardizationintheelectricalandelectronicfields.To thisendandinadditiontoother

33、activities,theIECpublishesInternationalStandards.Theirpreparationis entrustedtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealtwithmay participateinthispreparatorywork.International,governmentalandnongovernmentalorganizationsliaising withtheIECalsoparticipateinthispreparation.T

34、heIECcollaboratescloselywiththeInternationalOrganization forStandardization(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthetwo organizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssin

35、ceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCommittees. 3) Thedocumentsproducedhavetheformofrecommendationsforinternationaluseandarepublishedintheform ofstandards,technicalreportsorguidesandtheyareacceptedbytheNationalCommitteesinthatsense. 4) Inordertopromoteinternationalunif

36、ication,IECNationalCommitteesundertaketoapplyIECInternational Standardstransparentlytothemaximumextentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandardshallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingprocedureto

37、indicateitsapprovalandcannotberenderedresponsibleforany equipmentdeclaredtobeinconformitywithoneofitsstandards. 6) AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethesubject ofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. Int

38、ernationalStandardIEC6118812hasbeenpreparedbyIECtechnicalcommittee52: Printedcircuits. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 52/758/FDIS 52/762/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundinthereporton votingindicatedintheabovetable. AnnexAi

39、sforinformationonly.6 6118812CEI:1998 INTRODUCTION Lencapsulationdumatriellectroniqueatraditionnellementfaitlobjetdeconsidrations mcaniques.Laconceptiondelencapsulationprsenteunecomplexitcroissantetandisque lestechniqueslectroniquesactuellesoffrentunevitessedecommutationetunedensit dintgrationplusle

40、ves.Lespucesindividuellespossdentunplusgrandnombrede connexionspourdestaillesdebotierdepuceplusrduites.Afindetirerlemeilleuravantage deladensitetdelavitessedudispositif,ilfautquelesconcepteursaccordentbeaucoupplus dattentionauxproblmespossparlesphnomnesdepropagationdondes lectromagntiquesassocislatr

41、ansmissiondesignauxdecommutationauseindu systme.Denouvellesdisciplinesetstratgiesdeconceptionsontncessaires.Lescartesde circuitimpdancecontrlesinscriventdanslecadredecettestratgie. Linterconnexionetlencapsulationdecomposantslectroniquesrelevaientprincipalementdu domainedesconcepteursenmcaniquequisep

42、roccupaientdefacteurstelsquelepoids,le volume,lapuissanceetlefacteurdeforme,lesinterconnexionstantspcifiesdansdes listesdecblageoulistesdefilet.Leroutagedessignauxpourconducteurslectriquestait ralissansautresproccupationsquecelledumaintiendelacontinuitentrelespoints,dela prsencedecuivreenquantitsuffisantedanslesconducteurspourlepassageducourantet durespectdudgagementafindempcherunerupturedetension.Lesperformances lectriquesdusignaldevaientgarantirlaqualitdutrajetlectrique,maisneconstituaientpas uneproccupationmajeure. Lespro