IEC 61191-3-2017 Printed board assemblies - Part 3 Sectional specification - Requirements for through-hole mount soldered assemblies《印刷电路板组件 第3部分 分规范 通孔安装焊接组件的要求》.pdf

1、 IEC 61191-3 Edition 2.0 2017-05 INTERNATIONAL STANDARD Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount soldered assemblies IEC 61191-3:2017-05(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserved. Unless

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10、ec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 61191-3 Edition 2.0 2017-05 INTERNATIONAL STANDARD Printed board assemblies Part 3: Sectional specification Requirements for through-hole mount so

11、ldered assemblies INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.240 ISBN 978-2-8322-4397-8 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. 2 IEC 61191-3:2017 IEC 2017 CONTENTS FOREWORD . 4

12、1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 General requirements 6 5 Through-hole mounting of components 7 5.1 General . 7 5.2 Placement accuracy 7 5.3 Through-hole component requirements . 7 5.3.1 Lead preforming 7 5.3.2 Tempered leads . 7 5.3.3 Lead forming requirements 7 5.3.4

13、Stress relief requirements 8 5.3.5 Lead termination requirements 8 6 Acceptance requirements 10 6.1 General . 10 6.2 Control and corrective actions . 10 6.2.1 General . 10 6.2.2 Interfacial connections (vias) . 10 6.3 Through-hole component lead soldering . 11 6.3.1 General . 11 6.3.2 Clinched leads

14、 . 12 6.3.3 Exposed basis metal 13 7 Rework of unsatisfactory solder connections . 13 (normative) Placement requirements for through-hole mount devices . 14 Annex A A.1 General . 14 A.2 Horizontal mounting, free-standing 14 A.3 Axial lead components 14 A.4 Radial lead components 14 A.5 Perpendicular

15、 mounting, free-standing 14 A.5.1 General . 14 A.5.2 Mounting of components 14 A.5.3 Radial lead components 15 A.6 Side- and end-mounting 15 A.7 Supported component mounting 16 A.7.1 General . 16 A.7.2 Stand-off positioning 16 A.7.3 Non-resilient footed stand-offs . 17 A.8 Stress relief lead configu

16、ration 17 A.9 Flat pack lead configuration 17 Bibliography 19 Figure 1 Lead bends 8 Figure 2 Hole obstruction . 10 Figure 3 Through-hole component lead soldering . 11 IEC 61191-3:2017 IEC 2017 3 Figure 4 Lead-to-land fillet requirements for clinched leads and wires in non-plated through-holes 11 Fig

17、ure 5 Lead-to-land fillet requirements for clinched leads and wires in plated through-holes 12 Figure A.1 Mounting of free-standing components . 14 Figure A.2 Typical configuration of components with dual non-axial leads 15 Figure A.3 Mounting of components with dual non-axial leads 15 Figure A.4 Si

18、de mounting . 15 Figure A.5 End mounting 16 Figure A.6 Mounting with footed stand-offs 16 Figure A.7 Non-resilient footed stand-offs 17 Figure A.8 Acceptable lead configurations . 17 Figure A.9 Configuration of ribbon leads for through-hole mounting . 18 Table 1 Plated through-holes with component l

19、eads, minimum acceptable conditions 1). 12 Table 2 Through-hole solder joint defects 13 4 IEC 61191-3:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARD ASSEMBLIES Part 3: Sectional specification Requirements for through-hole mount soldered assemblies FOREWORD 1) The Internation

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29、 upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the eleme

30、nts of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61191-3 has been prepared by WG 2: Requirements for electronics assemblies, of IEC technical committee 91: Electronics assembly

31、 technology. This second edition cancels and replaces the first edition published in 1998. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant with

32、 the acceptance criteria in IPC-A-610F. IEC 61191-3:2017 IEC 2017 5 The text of this standard is based on the following documents: CDV Report on voting 91/1375/CDV 91/1435/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicate

33、d in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61191 series, published under the general title Printed board assemblies, can be found on the IEC website. The committee has decided that the contents of this docume

34、nt will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 IEC 61191-3:2017 IEC 2017 PRINTED BOARD A

35、SSEMBLIES Part 3: Sectional specification Requirements for through-hole mount soldered assemblies 1 Scope This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the T

36、HT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting). 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For da

37、ted references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1:2013, Printed board assemblies Part 1: Generic specifi

38、cation Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies IPC-A-610, Acceptability of Electronic Assemblies 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 apply. ISO and IEC mai

39、ntain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 3.1 THT through-hole technology technology that permits an electrical connection of compon

40、ents to a conductive pattern by the use of plated or non-plated holes with annular rings in the mounting substrate 4 General requirements Requirements of IEC 61191-1 are a mandatory part of this specification. Workmanship shall meet the requirements of IPC-A-610 in accordance with the classification

41、 requirements of this document. IEC 61191-3:2017 IEC 2017 7 5 Through-hole mounting of components 5.1 General This clause covers the assembly of components with leads inserted into through-holes and soldered by machine and/or manual processes. 5.2 Placement accuracy Placement accuracy for components

42、 inserted either manually or by machine methods shall be sufficient to insure that components are properly positioned after soldering. If suitable process controls are not in place to ensure compliance with this requirement and the intent of Annex A, the detailed requirements of Annex A shall be app

43、licable. 5.3 Through-hole component requirements 5.3.1 Lead preforming Part and component leads shall be pre-formed to the final configuration, excluding the final clinch or retention bend, before assembly or installation. 5.3.2 Tempered leads When it is necessary to cut tempered leads, the governin

44、g work instructions shall specify cutting tools that do not impart detrimental shocks to internal connections of the components. 5.3.3 Lead forming requirements Leads shall be formed in such a manner that the lead-to-body seal is not damaged or degraded. Leads shall extend at least one lead diameter

45、 or thickness but not less than 0,8 mm from the body or weld before the start of the bend radius (see Figure 1). Exposed core metal is acceptable if reduction in the cross-sectional area does not exceed 10 % of the diameter of the lead. Occurrence of exposed core metal in the formed area of the lead

46、 shall be treated as a process indicator. Measurement shall be made from the end of the part. The end of the part is defined to include any coating meniscus, solder seal, solder or weld bead, or any other extension. The span for components mounted with a conventional lead form is 7,6 mm minimum, and

47、 33 mm maximum. 8 IEC 61191-3:2017 IEC 2017 a) Standard bend b) Welded bend Maximum lead diameter mm Minimum bend radius R Up to 0,8 0,8 to 1,2 Larger than 1,2 1 diameter/thickness 1,5 diameters/thicknesses 2 diameters/thicknesses Figure 1 Lead bends 5.3.4 Stress relief requirements Component leads

48、shall be formed in such a manner that the lead compliancy is not restricted in providing the natural stress relief of the lead material. Special lead formations are permitted to enhance stress relief properties. 5.3.5 Lead termination requirements 5.3.5.1 General To ensure part retention during sold

49、ering operations, lead terminations in printed board plated through-holes shall be one of the following configurations: full clinch, partially clinched, or straight-through lead termination, as specified on the assembly drawing. In the event that nothing is specified, the manufacturer shall conform to the requirements in 5.3.5.2 to 5.3.5.10 as appropriate. 5.3.5.2 Clinched lead termination Leads in unsupported holes and class C shall be clinched a minimum of