IEC 61191-4-2017 Printed board assemblies - Part 4 Sectional specification - Requirements for terminal soldered assemblies《印刷电路板组件 第4部分 分规范 端点焊接组件的要求》.pdf

1、 IEC 61191-4 Edition 3.0 2017-07 INTERNATIONAL STANDARD Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IEC 61191-4:2017-07(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise

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10、If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 61191-4 Edition 2.0 2017-07 INTERNATIONAL STANDARD Printed board assemblies Part 4: Sectional specification Requirements for terminal soldered assemblies IN

11、TERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.240 ISBN 978-2-8322-4657-3 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. 2 IEC 61191-4:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scope 6 2 Normativ

12、e references 6 3 Terms and definitions 6 4 General requirements 6 5 General terminal and part mounting requirements 6 5.1 General . 6 5.2 Wire and cable preparation . 7 5.2.1 General . 7 5.2.2 Tinning of stranded wire 7 5.3 Terminal installation 7 5.3.1 General . 7 5.3.2 Terminal mounting (mechanica

13、l) 7 5.3.3 Terminal shank discontinuities . 8 5.3.4 Flange discontinuities 8 5.3.5 Terminal mounting (electrical) 8 5.3.6 Flange angles 9 5.3.7 Shank discontinuities . 9 5.3.8 Flared flange discontinuities 9 5.4 Mounting to terminals 10 5.4.1 General . 10 5.4.2 Wire and lead wrap-around 10 5.4.3 Sid

14、e route connection 10 5.4.4 Top and bottom route connection . 11 5.4.5 Continuous runs 12 5.4.6 Service loops . 13 5.4.7 Insulation clearance . 13 5.4.8 Orientation of wire wrap . 14 5.4.9 Stress relief . 14 5.4.10 Pierced or perforated terminals 14 5.4.11 Cup and hollow cylindrical terminal solderi

15、ng . 15 6 Acceptance requirements 16 6.1 General . 16 6.2 Control and corrective actions . 16 6.3 Terminal soldering 16 6.3.1 General . 16 6.3.2 Wire-terminal attachment . 16 6.4 Part marking and reference designations 16 7 Rework of unsatisfactory soldered connections 16 Bibliography 18 Figure 1 Ro

16、lled flange terminal 8 Figure 2 Rolled flange discontinuities . 8 Figure 3 Flared flange terminals. 9 Figure 4 Flared angles . 9 IEC 61191-4:2017 IEC 2017 3 Figure 5 Wire and lead wrap around 10 Figure 6 Side route connections and wrap on bifurcated terminal . 11 Figure 7 Top and bottom route termin

17、al connection 12 Figure 8 Continuous run wire wraps . 13 Figure 9 Service loop for lead wiring 13 Figure 10 Insulation clearance measurement (c) 14 Figure 11 Stress relief examples 14 Figure 12 Pierced or perforated terminal wire wrap 15 Table 1 Nicked or broken strand limits . 7 Table 2 Plated thro

18、ugh-holes with terminals, minimum acceptance conditions . 16 Table 3 Defects for terminal attachment and soldering defects . 17 4 IEC 61191-4:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARD ASSEMBLIES Part 4: Sectional specification Requirements for terminal soldered assembli

19、es FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in

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29、ibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61191-4 has been prepared by IEC technical committee 91: Electronics assembly technology. This se

30、cond edition cancels and replaces the first edition published in 1998. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: The requirements have been updated to be compliant with the acceptance criteri

31、a in IPC-A-610F. IEC 61191-4:2017 IEC 2017 5 The text of this International Standard is based on the following documents: CDV Report on voting 91/1399/CDV 91/1434/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the

32、above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61191 series, published under the general title Printed board assemblies, can be found on the IEC website. The committee has decided that the contents of this document will r

33、emain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issue

34、d at a later date. 6 IEC 61191-4:2017 IEC 2017 PRINTED BOARD ASSEMBLIES Part 4: Sectional specification Requirements for terminal soldered assemblies 1 Scope This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirel

35、y terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting). 2 Normative references The following documents are referred to in the text in such a way that some or

36、 all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definit

37、ions IEC 61191-1:2013, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 a

38、pply. ISO and IEC maintain terminological databases for use in standardization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 General requirements Requirements of IEC 61191-1 are a mandatory pa

39、rt of this specification. Workmanship shall meet the requirements of IPC-A-610 in accordance with the classification requirements of this document. 5 General terminal and part mounting requirements 5.1 General The requirements of 5.2 are applicable to terminals and part mounting in all types of asse

40、mblies. IEC 61191-4:2017 IEC 2017 7 5.2 Wire and cable preparation 5.2.1 General Sufficient insulation cover shall be stripped from the wire or leads to provide for insulation clearances as specified. Chemical stripping agents shall be used for solid wire only and shall be neutralized or removed pri

41、or to soldering. In stripping insulation, care should be taken to avoid nicking or otherwise damaging the wire or the remaining insulation. For level A or B assemblies, the number of nicked or broken strands in a single wire shall not exceed the limits given in Table 1. For wires used at a potential

42、 of 6 kV or greater, or for level C assemblies, there shall be no broken strands. The number of nicked strands shall be in accordance with Table 1. Insulation discolouration resulting from thermal stripping is permissible. Table 1 Nicked or broken strand limits Number of strands Maximum allowable sc

43、raped, nicked or broken strands Level A and B Level C not tinned Level C pretinned 1 (solid) No damage in excess of 10 % conductor diameter 2 to 6 0 0 0 7 to 15 1 0 1 16 to 25 3 0 2 26 to 40 4 3 3 41 to 60 5 4 4 61 to 120 6 5 5 121 or more 6 % of strands 5 % of strands 5 % of strands 5.2.2 Tinning o

44、f stranded wire Portions of stranded wire to be soldered shall be tinned prior to mounting. The solder shall wet the stranded wire and penetrate to the inner strands of the wire. Wicking of solder under the insulation shall be minimized. 5.3 Terminal installation 5.3.1 General The detailed requireme

45、nts for installation of solder terminals are defined in 5.3.2 to 5.3.8. 5.3.2 Terminal mounting (mechanical) Terminals not connected to printed wiring or ground planes shall be of the rolled flange configuration (see Figure 1). A printed foil land may be used as a seating surface for a rolled flange

46、 provided that the land is isolated and not connected to active printed wiring or ground plane. 8 IEC 61191-4:2017 IEC 2017 Figure 1 Rolled flange terminal 5.3.3 Terminal shank discontinuities The shank of the terminal shall not be perforated, split, cracked, and there shall not be discontinuity to

47、the extent that oils, flux, inks, or other substances used for processing the printed board can be entrapped. Circumferential cracks or splits in the shank are not acceptable regardless of the extent. 5.3.4 Flange discontinuities The rolled flange shall not be split, cracked or otherwise discontinuo

48、us to the extent that flux, oils, inks, or other liquid substances used for processing the printed board can be entrapped within the mounting hole. After rolling, the rolled area shall be free of circumferential splits or cracks, but may have a maximum of three radial splits or cracks provided that

49、the splits or cracks are separated by at least 90 and do not extend into the barrel of the terminal (see Figure 2). a) Acceptable b) Not acceptable Figure 2 Rolled flange discontinuities 5.3.5 Terminal mounting (electrical) Flared flange terminals shall be mounted in non-interfacial plated through-holes provided the mounting is in conjunction with a land or ground plane on the flared side as shown in Figure 3a. They shall not be flared to the base mater