IEC 61249-2-30-2012 Materials for printed boards and other interconnecting structures - Part 2-30 Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyana.pdf

1、 IEC 61249-2-30 Edition 1.0 2012-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Materials for printed boards and other interconnecting structures Part 2-30: Reinforced base materials clad and unclad Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical

2、 burning test), copper-clad Matriaux pour circuits imprims et autres structures dinterconnexion Partie 2-30: Matriaux de base renforcs, plaqus et non plaqus Feuille stratifie en tissu de verre poxyde non halogn modifi et ester de cyanate, dinflammabilit dfinie (essai de combustion verticale), plaque

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17、012-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Materials for printed boards and other interconnecting structures Part 2-30: Reinforced base materials clad and unclad Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad M

18、atriaux pour circuits imprims et autres structures dinterconnexion Partie 2-30: Matriaux de base renforcs, plaqus et non plaqus Feuille stratifie en tissu de verre poxyde non halogn modifi et ester de cyanate, dinflammabilit dfinie (essai de combustion verticale), plaque cuivre INTERNATIONAL ELECTRO

19、TECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE S ICS 31.180 PRICE CODE CODE PRIX ISBN 978-2-83220-496-2 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publi

20、cation from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61249-2-30 IEC:2012 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Materials and construction 6 3.1 General . 6 3.2 Resin system . 6 3.3 Reinforce

21、ment . 7 3.4 Metal foil . 7 4 Internal marking . 7 5 Electrical properties 7 6 Non-electrical properties of the copper-clad laminate . 7 6.1 Appearance of the copper-clad sheet 7 6.1.1 General . 7 6.1.2 Indentations (pits and dents) . 8 6.1.3 Wrinkles 8 6.1.4 Scratches 8 6.1.5 Raised areas . 8 6.1.6

22、 Surface waviness 9 6.2 Appearance of the unclad face 9 6.3 Laminate thickness 9 6.4 Bow and twist 10 6.5 Properties related to the copper foil bond 10 6.6 Punching and machining . 10 6.7 Dimensional stability . 11 6.8 Sheet sizes . 11 6.8.1 Typical sheet sizes 11 6.8.2 Tolerances for sheet sizes .

23、11 6.9 Cut panels . 11 6.9.1 Cut panel sizes 11 6.9.2 Size tolerances for cut panels 11 6.9.3 Rectangularity of cut panels 12 7 Non-electrical properties of the base material after complete removal of the copper foil 12 7.1 Appearance of the dielectric base material 12 7.2 Flexural strength . 13 7.3

24、 Flammability 13 7.4 Water absorption . 13 7.5 Measling 14 7.6 Glass transition temperature and cure factor . 14 8 Quality assurance . 14 8.1 Quality system . 14 8.2 Responsibility for inspection 15 8.3 Qualification inspection . 15 8.4 Quality conformance inspection . 15 8.5 Certificate of conforma

25、nce . 15 8.6 Safety data sheet 15 61249-2-30 IEC:2012 3 8.7 Packaging and marking . 15 9 Ordering information . 16 Annex A (informative) Engineering information 17 Annex B (informative) Common laminate constructions 19 Annex C (informative) Guideline for qualification and conformance inspection . 20

26、 Bibliography 21 Table 1 Electrical properties 7 Table 2 Indentations 8 Table 3 Nominal thickness and tolerance of metal-clad laminate 9 Table 4 Bow and twist 10 Table 5 Pull-off and peel strength 10 Table 6 Dimensional stability . 11 Table 7 Size tolerance for cut panels . 12 Table 8 Rectangularity

27、 of cut panels 12 Table 9 Flexural strength . 13 Table 10 Flammability 13 Table 11 Water absorption . 14 Table 12 Measling 14 Table 13 Glass transition temperature and cure factor . 14 Table B.1 Thickness 19 Table C.1 Qualification and conformance testing . 20 4 61249-2-30 IEC:2012 INTERNATIONAL ELE

28、CTROTECHNICAL COMMISSION _ MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES Part 2-30: Reinforced base materials clad and unclad Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad FOREWORD 1) The Internati

29、onal Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electroni

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38、ce upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the ele

39、ments of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61249-2-30 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is bas

40、ed on the following documents: FDIS Report on voting 91/1051/FDIS 91/1064/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 61249

41、2-30 IEC:2012 5 A list of all parts of the IEC 61249 series, under the general title Materials for printed boards and other interconnecting structures, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date ind

42、icated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 61249-2-30 IEC:2012 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES P

43、art 2-30: Reinforced base materials clad and unclad Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad 1 Scope This part of IEC 61249 gives requirements for properties of non-halogenated epoxide modified cyanate ester wove

44、n glass laminate of defined flammability (vertical burning test), copper-clad in thicknesses of 0,03 mm up to 1,60 mm. The flammability rating is achieved through the use of non-halogenated inorganic and/or organic compounds acting as fire retardants. These fire retardants are contained as part of p

45、olymeric structure or in addition to it. The glass transition temperature is defined to be 160 C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material may be supplied. 2 Normat

46、ive references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) a

47、pplies. IEC 61189-2:2006, Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials and other interconnection structures IEC 61249-5-1:1995, Materials for interconnection structures Part 5: Sectional specification set

48、 for conductive foils and films with or without coatings Section 1: Copper foils (for the manufacture of copper-clad base materials) IEC/PAS 61249-6-3:2011, Specification for finished fabric woven from E-glass for printed boards ISO 11014:2009, Safety data sheet for chemical products Content and ord

49、er of sections 3 Materials and construction 3.1 General The sheet consists of an insulating base with metal-foil bonded to one side or both. 3.2 Resin system Non-halogenated epoxide modified cyanate ester resulting in a laminate with a glass transition temperature of 160 C minimum. The maximum total halogens contained in the resin plus reinforcement matrix is 1 500 ppm, wit