IEC 61249-5-1-1995 Materials for interconnection structures - Part 5 Sectional specification set for conductive foils and films with and without coatings - Section 1 Copper foils (.pdf

1、 4844893 Ob05443 670 NORME CE1 INTERNATIONALE IEC INTERNATIONAL STANDARD 1249154 Premire dition First edition 1995-1 1 Matriaux pour les structures dinterconnexion - Partie 5: Collection de spcifications intermdiaires pour feuilles et films conducteurs avec ou sans revtement - Section 1 : Feuilles d

2、e cuivre (pour la fabrication de matriaux de base plaqus cuivre) Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1 : Copper foils (for the manufacture of copper-clad base materials) Numro de rfrence Ref

3、erence number CEVIEC 1249-5-1: 1995 4844691 Ob05444 507 I Validit de la prsente publication Validity of this publication Le contenu technique des publications de la CE1 est cons- tamment revu par la CE1 afin quil reflte ltat actuel de la technique. reflects current technology. Des renseignements rel

4、atifs la date de reconfirmation de la publication sont disponibles auprs du Bureau Central de ia CEI. Les renseignements relatifs B ces rvisions, ltablis- sement des ditions rvises et aux amendements peuvent editions and amendments may be obtained from IEC . tre obtenus auprs des Comits nationaux de

5、 la CE1 et dans les documents ci-dessous: The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content Information relating to the date of the reconfirmation of the publication is available from the IEC Central Office. Information on the revision

6、 work, the issue of revised National Committees and from the following IEC sources: Bulletin de la CE1 Annuairede la CE1 Publi annuellement Catalogue des publications de la CE1 Publi annuellement et mis jour rgulirement Terminologie En ce qui concerne la terminologie gnrale, le lecteur se reportera

7、la CE1 50 Vocabulaire Electrotechnique Inter- national (VEI), qui se prsente sous forme de chapitres spars traitant chacun dun sujet dfini. Des dtails complets sur le VE1 peuvent tre obtenus sur demande. Voir gaiement le dictionnaire multilingue de la CEI. Les termes et dfinitions figurant dans la p

8、rsente publi- cation ont t soit tirs du VEI. soit spcifiquement approuvs aux fins de cette publication. Symboles graphiques et littraux Pour les symboles graphiques. les symboles littraux et les signes dusage gnral approuvs par la CEI, le lecteur consultera: - la CE1 27: Symboles littraux utiliser e

9、n lectro- rechnique; - la CE1 417: Symboles graphiques utilisables sur le matriel. Index, relev et compilation des feuilles individuelles; - Ia CE1 617: Symboles graphiques pour schmas; et pour les appareils lectromdicaux, - la CE1 878: Symboles graphiques pour quipements lectriques en pratique mdic

10、ale. Les symboles et signes contenus dans la prsente publi- cation ont t soit tirs de la CE1 27, de la CE1 417, de la CE1 617 et/ou de ia CE1 878. soit spcifiquement approuvs aux fins de cette publication. Publications de la CE1 tablies par le mme comit dtudes Lattention du lecteur est attire sur le

11、s listes figurant la fin de cette publication, qui numrent les publications de la CE1 prpares par le comit dtudes qui a tabli la prsente publication. IEC Bulletin IEC Yearbook Catalogue of IEC publications Published yearly Published yearly with regular updates Terminology For general terminology, re

12、aders are referred to IEC 50: International Electrotehnical Vocabulary (IEV). which is issued in the form of separate chapters each dealing with a specific field. Full details of the IEV will be supplied on request. See also the IEC Multilinguai Dictionary. The terms and definitions contained in the

13、 present publi- cation have either been taken from the IEV or have been specifically approved for the purpose of this publication. Graphical and letter symbols For graphical symbols. and letter symbols and signs approved by the IEC for general use, readers are referred to publications: - IEC 27: Let

14、ter symbols to be used in electrical technology; - IEC 417: Graphical symbols for use on equip- ment. Index, survey and compilation of the single sheets: - IEC 617: Graphical symbols for diagrams; and for medical electrical equipment, - equipment in medical practice. IEC 878: Graphical symbols for e

15、lectromedical The symbols and signs contained in the present publi- cation have either been taken from IEC 27, IEC 417, IEC 617 and/or IEC 878, or have been specifically appro- ved for the purpose of this publication. IEC publications prepared by the same technical committee The attention of readers

16、 is drawn to the end pages of this publication which list the IEC publications issued by the technical committee which has prepared the present publication. _ 4844891 Ob05445 443 NORME INTERNATIONALE INTERNATIONAL STANDARD CE1 IEC 1249-511 Premire dition First edition 1995-1 1 Matriaux pour les stru

17、ctures dinterconnexion - Partie 5: Collection de spcifications intermdiaires pour feuilles et films conducteurs avec ou sans revtement - Section 1 : Feuilles de cuivre (pour la fabrication de matriaux de base plaqus cuivre) Materials for interconnection structures - Part 5: Sectional specification s

18、et for conductive foils and films with and without coatings - Section 1 : Copper foils (for the manufacture of copper-clad base materials) 0 CE1 1995 Droits de reproduction rsenrs - Copyright - all rights reserved Auaine par80 de cene flutm ne peut any IEC National Committee interested in the subjec

19、t dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions d

20、etermined by agreement between the two organizations. The formal decisions or agreements of the IEC on technical matters, express as nearly as possible, an international consansus of opinion on the relevant subjects since each technical committee has representation from all interested National Commi

21、ttees. The documents produced have the form of recommendations for intemational use and are published in the form of standards, technical reports or guides and they are accepted by the National Committees in that sense. In order to promote international unification, IEC National Committees undertake

22、 to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. The IEC provides no marking procedure to

23、indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. IEC shall not be held responsible for

24、 identifying any or all such patent rights. International Standard IEC 1249-5-1 has been prepared by IEC technical committee 52: Printed circuits . It cancels and replaces the IEC 249-3A, published in 1976. The IEC 1249 series will gradually replace the IEC 249 series, with the exception of IEC 249-

25、1, which will be replaced by the future IEC 1189-2. The text of this standard is based on the following documents: I DIS I Report on voting I I I 52/544/DlC 52/606/RVD I Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table

26、 Annex A forms an integral part of this standard. Annex B is for information only. Ef4 4844893 Ob05450 800 -6- 1249-5-1 O CEI:1995 MATRIAUX POUR LES STRUCTURES DINTERCONNEXION - Partie 5: Collection de spcifications intermdiaires pour feuilles et films conducteurs avec ou sans revtement - Section 1

27、 : Feuilles de cuivre (pour la fabrication de matriaux de base plaqus cuivre) 1 Domaine dapplication La prsente spcification numre les proprits exiges de la feuille de cuivre destine tre utilise pour la fabrication de feuilles lamines et de matriaux flexibles plaqus cuivre, utiliss pour la ralisatio

28、n des cartes imprimes. Elle sapplique aux feuilles de cuivre livres en rouleaux, aux feuilles coupes ou formats dcoups. 2 Reference normative Le document normatif suivant contient des dispositions qui, par suite de la rfrence qui y est faite, constituent des dispositions valables pour la prsente sec

29、tion de la CE1 1249-5. Au moment de la publication, ldition indique tait en vigueur. Tout document normatif est sujet rvision et les parties prenantes aux accords fonds sur la prsente section de la CE1 1249-5 sont invites rechercher la possibilit dappliquer ldition la plus rcente du document normati

30、f indiqu ci-aprs. Les membres de la CE1 et de IISO possdent le registre des Normes internationales en vigueur. IS0 4287-1: 1984, Rugosit de surface - Terminologie - Partie I: La surface et ses paramtres 3 Dsignation 3.1 Types de feuille de cuivre Une feuille de cuivre, pour les usages considrs dans cette spcification, peut tre de lun des deux grands types suivants : E = feuille de cuivre lectrodpos ; Fi = feuille de cuivre lamin, avec les qualits donnes dans le tableau 1.