1、 IEC 61375-3-1 Edition 1.0 2012-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic railway equipment Train communication network (TCN) Part 3-1: Multifunction Vehicle Bus (MVB) Matriel lectronique ferroviaire Rseau embarqu de train (TCN) Partie 3-1: Bus de Vhicule Multifonctions (MVB) IEC 613
2、75-3-1:2012 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without
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16、NAL STANDARD NORME INTERNATIONALE Electronic railway equipment Train communication network (TCN) Part 3-1: Multifunction Vehicle Bus (MVB) Matriel lectronique ferroviaire Rseau embarqu de train (TCN) Partie 3-1: Bus de Vhicule Multifonctions (MVB) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION
17、 ELECTROTECHNIQUE INTERNATIONALE XF ICS 45.060 PRICE CODE CODE PRIX ISBN 978-2-88912-070-3 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized dist
18、ributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 61375-3-1 IEC:2012 CONTENTS FOREW ORD . 8 INTRODUCTION . 10 1 Scope . 12 2 Normative references 12 3 Terms and definitions, abbreviations and conventions . 13 3.1 Terms and definitions 13 3.2
19、Abbreviations . 30 3.3 Conventions 31 3.3.1 Base of numeric values 31 3.3.2 Naming conventions. 32 3.3.3 Time naming conventions 32 3.3.4 Procedural interface conventions . 32 3.3.5 Specification of transmitted data 35 3.3.6 State diagram conventions . 37 4 Physical Layer 38 4.1 Topology . 38 4.1.1
20、Segments 38 4.1.2 Couplers 38 4.1.3 Double-line segments 39 4.2 Device classes 39 4.2.1 Capabilities 39 4.2.2 Class 0 devices . 40 4.2.3 Class 1 devices . 40 4.2.4 Class 2 devices . 40 4.2.5 Class 3 devices . 40 4.2.6 Class 4 devices . 40 4.2.7 Class 5 devices . 40 4.2.8 Device Attachment . 41 4.3 S
21、pecifications common to all media . 41 4.3.1 Signalling speed 41 4.3.2 Propagation delays 41 4.3.3 Transceiver interface . 41 4.3.4 Redundant medium (option) . 42 4.4 Electrical Short Distance medium (choice) . 43 4.4.1 ESD topology . 43 4.4.2 ESD configuration rules . 44 4.4.3 ESD section specifica
22、tions . 45 4.4.4 ESD shielding 45 4.4.5 ESD medium-dependent interface 46 4.4.6 ESD Line_Unit specifications . 48 4.4.7 ESD signal wave form 48 4.4.8 ESD transmitter . 49 4.4.9 ESD receiver . 50 4.5 Electrical Middle Distance medium (choice) . 51 4.5.1 EMD topology 51 4.5.2 EMD configuration rules .
23、 51 61375-3-1 IEC:2012 3 4.5.3 EMD terminator 52 4.5.4 Cable section . 52 4.5.5 EMD shielding 53 4.5.6 EMD medium-dependent interface . 54 4.5.7 EMD Line_Unit specifications . 57 4.5.8 EMD signal waveform 58 4.5.9 EMD transmitter specifications . 58 4.5.10 EMD receiver specifications . 62 4.6 Optica
24、l Glass Fibre medium (choice) 63 4.6.1 OGF topology 64 4.6.2 OGF optical cable and fibre 64 4.6.3 OGF medium-dependent interface . 64 4.6.4 OGF test signal (guideline) 65 4.6.5 OGF transmitter specifications . 66 4.6.6 OGF receiver specifications . 66 4.6.7 OGF active star coupler . 67 4.6.8 OGF dou
25、ble-line layout (option) 68 5 Medium-dependent signalling 68 5.1 Frame encoding and decoding . 68 5.1.1 Conventions . 68 5.1.2 Bit encoding . 69 5.1.3 Non-data symbols 69 5.1.4 Start Bit . 69 5.1.5 Start Delimiter 69 5.1.6 End Delimiter . 70 5.1.7 Valid frame (definition) . 71 5.1.8 Detection of lin
26、e idle 71 5.1.9 Detection of collision 71 5.1.10 Receiver behaviour in case of error 71 5.1.11 Jabber halt 71 5.2 Line redundancy (option) . 72 5.2.1 Principle 72 5.2.2 Redundant transmission. 72 5.2.3 Redundant reception 72 5.2.4 Switchover . 72 5.2.5 Redundancy status report 73 5.3 Repeater . 73 5
27、.3.1 Repeater between single-line segments . 74 5.3.2 Repeater for redundant medium (option) 74 6 Frames and telegrams 75 6.1 Frame format . 75 6.1.1 Master Frame format . 75 6.1.2 Slave Frame format . 75 6.1.3 Check Sequence 76 6.2 Telegram timing . 77 6.2.1 Conventions . 77 6.2.2 Reply delay (defi
28、nition) . 77 6.2.3 Frame spacing at the source 79 6.2.4 Frame spacing at the destination 79 4 61375-3-1 IEC:2012 6.2.5 Frame spacing at the master 80 6.3 Detection of correct frames, collision and silence by the master . 81 6.3.1 Correct frame (definition) . 81 6.3.2 Detection of collision by the ma
29、ster 81 6.3.3 Detection of silence by the master 81 7 Link Layer Control . 81 7.1 Addressing 81 7.1.1 Device Address 81 7.1.2 Logical_Address 81 7.1.3 Group_Address 82 7.2 Master Frames contents 82 7.2.1 Master Frame format . 82 7.2.2 F_code encoding . 82 7.3 Slave Frame contents 83 7.3.1 Slave Fram
30、e format . 83 7.3.2 Size error . 84 7.4 Telegram types 84 7.4.1 Process Data telegram . 84 7.4.2 Message Data 85 7.4.3 Supervisory Data telegrams . 86 8 Medium allocation . 87 8.1 Organisation 87 8.1.1 Turn 87 8.1.2 Basic Period 87 8.1.3 Padding . 88 8.2 Periodic Polling 88 8.2.1 Periodic List . 88
31、8.2.2 Individual Period 88 8.2.3 Periodic Phase construction . 89 8.3 Event Polling . 90 8.3.1 Group_Address 90 8.3.2 Event_Round . 91 8.3.3 Recommended event search algorithm . 93 8.3.4 Supervisory Data frames for Event_Arbitration . 94 8.4 Devices_Scan 96 8.4.1 Device_Status . 96 8.4.2 Device_Stat
32、us protocol 98 8.4.3 Devices_Scan protocol 99 9 Mastership transfer . 99 9.1 Mastership transfer operation 99 9.1.1 Bus administrator configuration 99 9.2 Mastership transfer specifications 100 9.2.1 States 100 9.2.2 Time-outs for mastership transfer 103 9.3 Supervisory data frames for mastership tr
33、ansfer 103 9.3.1 Device_Status telegram . 103 9.3.2 Mastership transfer telegram 104 10 Link Layer Interface 104 10.1 Link Layer layering . 104 61375-3-1 IEC:2012 5 10.2 Link Process Data interface . 105 10.3 Link Message Data interface 105 10.3.1 General . 105 10.3.2 Priority . 106 10.3.3 Packet si
34、ze 106 10.3.4 Protocol_Type 106 10.3.5 Message Transport Protocol 106 10.4 Link Supervision Interface 106 10.4.1 General . 106 10.4.2 Link Supervision Interface procedures 106 10.4.3 MVB_Status . 107 10.4.4 MVB_Control . 107 10.4.5 MVB_Devices 108 10.4.6 MVB_Administrator 108 10.4.7 MVB_Report 110 1
35、1 Real-Time Protocols . 111 12 Gateway Function . 111 13 Network Management . 111 13.1 Contents of this clause 111 13.2 MVB Managed objects . 111 13.2.1 MVB link objects 111 13.3 MVB Services and management messages 112 13.3.1 MVB link services 112 Bibliography 126 Figure 1 Reference device and stru
36、cture of the document . 11 Figure 2 State transition example . 37 Figure 3 MVB configuration 39 Figure 4 Transceiver interface 42 Figure 5 Example of ESD segment . 43 Figure 6 Example of terminator. 44 Figure 7 ESD backplane section (double-line) . 46 Figure 8 ESD connector arrangement . 47 Figure 9
37、 ESD terminator connector arrangement 48 Figure 10 Example of start of frame (ESD) . 49 Figure 11 End of an ESD frame (both cases) 50 Figure 12 EMD medium 51 Figure 13 Shielding (single-line segment) . 53 Figure 14 Single-line device attachment . 54 Figure 15 Double-line device attachment to EMD 55
38、Figure 16 EMD connectors arrangement . 56 Figure 17 EMD terminator strapping . 57 Figure 18 Example of start of an EMD frame 58 Figure 19 Example of pulse waveform at EMD transmitter 60 Figure 20 Example of end of EMD frame 61 Figure 21 EMD receiver test signal . 62 6 61375-3-1 IEC:2012 Figure 22 Op
39、tical link . 64 Figure 23 Optical connector (dimensions in millimeters) 65 Figure 24 Example of start of OGF frame . 66 Figure 25 Edge jitter . 67 Figure 26 Example of active star coupler 67 Figure 27 Example of a duplicated star coupler . 68 Figure 28 “0“ and “1“ data encoding 69 Figure 29 Non_Data
40、 symbols encoding . 69 Figure 30 Master Start Delimiter . 70 Figure 31 Slave Start Delimiter . 70 Figure 32 Example of End Delimiter for EMD medium . 70 Figure 33 Example of a valid frame (OGF medium) . 71 Figure 34 Signal skew 72 Figure 35 Example of repeater for single-line attachment 74 Figure 36
41、 Example of repeater connecting a double-line to a single line segment 75 Figure 37 Master Frame Format . 75 Figure 38 Slave Frames . 76 Figure 39 Telegram timing 77 Figure 40 Example of Reply delay. 78 Figure 41 Frame spacing at the source side . 79 Figure 42 Frame spacing at the destination(s) 79
42、Figure 43 Frame spacing at the master side . 80 Figure 44 Master Frame contents . 82 Figure 45 Word ordering in a Slave Frame 84 Figure 46 Process Data telegram . 84 Figure 47 Message Data telegram 85 Figure 48 Supervisory Data telegram 86 Figure 49 Basic Periods . 87 Figure 50 Example of constructi
43、on of the Macro_Cycle . 90 Figure 51 General_Event_Request frame format 94 Figure 52 Group_Event_Request frame (M = 6, C = ABCDEF) 94 Figure 53 Single_Event_Request frame 95 Figure 54 Event_Identifier_Response frame . 95 Figure 55 Device_Status_Request 96 Figure 56 Device_Status_Response . 96 Figure
44、 57 Device_Status of Class 1 device . 97 Figure 58 Device_Status of Class 2/3/4/5 device 97 Figure 59 Device_Status of a device with Bus Administrator capability 97 Figure 60 Device_Status of a device with Gateway capability 98 Figure 61 Mastership Transfer states . 102 Figure 62 Device_Status_Reque
45、st (sent by current master) 103 Figure 63 Device_Status_Response (sent by proposed master) 103 Figure 64 Mastership_Transfer_Request (sent by current master) . 104 61375-3-1 IEC:2012 7 Figure 65 Mastership_Transfer_Response (sent by proposed next master) . 104 Figure 66 Link Layer Layering . 105 Tab
46、le 1 Template for the specification of an interface procedure . 34 Table 2 Example of message structure . 35 Table 3 Example of textual message form (corresponding to Table 2) . 36 Table 4 State transitions table 37 Table 5 MVB devices capabilities . 40 Table 6 Pin assignment for the ESD connector .
47、 47 Table 7 Pin assignment for the EMD connector . 56 Table 8 Master Frame types and F_code 83 Table 9 LS_RESULT encoding . 107 Table 10 MVB_Status object 107 Table 11 MVB_Control object . 108 Table 12 MVB_Devices object 108 Table 13 MVB_Administrator object 109 Table 14 LS_V_REPORT encoding . 111 T
48、able 15 Example of mvb_administrator_list . 123 8 61375-3-1 IEC:2012 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTRONIC RAILWAY EQUIPMENT TRAIN COMMUNICATION NETWORK (TCN) Part 3-1: Multifunction Vehicle Bus (MVB) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
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