IEC 61784-1-2014 Industrial communication networks - Profiles - Part 1 Fieldbus profiles《工业通讯网络.配置文件.第1部分 现场总线配置文件》.pdf

1、 IEC 61784-1 Edition 4.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Industrial communication networks Profiles Part 1: Fieldbus profiles Rseaux de communication industriels Profils Partie 1: Profils de bus de terrain IEC 61784-1:2014-08(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PRO

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19、mentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61784-1 Edition 4.0 2014-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Industrial communication networks Profiles Part 1: Fieldbus profiles Rseaux de communication industriels Profils Partie 1: Profils de b

20、us de terrain INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XH ICS 35.100.20; 35.240.50 PRICE CODE CODE PRIX ISBN 978-2-8322-1706-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationa

21、le Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 61784-1:2014 IEC 2014 CONTENTS FOREWORD . 15 INTRODUCTION . 17 1 Scope 18 2 Normative referenc

22、es 19 3 Definitions . 23 3.1 Terms and definitions . 23 3.2 Abbreviations and symbols 23 IEC 61158 abbreviations and symbols 23 3.2.1Other abbreviations and symbols 24 3.2.2 3.3 Conventions . 24 Conventions common to all layers 24 3.3.1Physical layer . 26 3.3.2Data-link layer 26 3.3.3Application lay

23、er . 27 3.3.4 4 Conformance to communication profiles 27 5 Communication Profile Family 1 (FOUNDATION fieldbus) 28 5.1 General overview . 28 5.2 Profile 1/1 (FOUNDATION H1) . 29 Physical layer . 29 5.2.1Data-link layer 47 5.2.2Application layer . 118 5.2.3 5.3 Profile 1/2 (FOUNDATION HSE) . 120 Phys

24、ical layer . 120 5.3.1Data-link layer 120 5.3.2Network layer . 120 5.3.3Transport layer . 120 5.3.4Application layer . 120 5.3.5 5.4 Profile 1/3 (FOUNDATION H2) . 121 Physical layer . 121 5.4.1Data-link layer 124 5.4.2Application layer . 124 5.4.3 6 Communication Profile Family 2 (CIP) 124 6.1 Gener

25、al overview . 124 6.2 Profile 2/1 (ControlNet) 125 Physical layer . 125 6.2.1Data-link layer 126 6.2.2Application layer . 128 6.2.3 6.3 Profile 2/2 (EtherNet/IP) . 129 Physical layer . 129 6.3.1Data-link layer 130 6.3.2Application layer . 131 6.3.3 6.4 Profile 2/3 (DeviceNet) . 133 Physical layer .

26、133 6.4.1Data-link layer 133 6.4.2Application layer . 135 6.4.3 7 Communication Profile Family 3 (PROFIBUS & PROFINET) 136 IEC 61784-1:2014 IEC 2014 3 7.1 General overview . 136 7.2 Profile 3/1 (PROFIBUS DP) 138 Physical layer . 138 7.2.1Data-link layer 140 7.2.2Application layer . 164 7.2.3 7.3 Pro

27、file 3/2 (PROFIBUS PA) 223 Physical layer . 223 7.3.1Data-link layer 228 7.3.2Application layer . 240 7.3.3 7.4 Profile 3/3 (PROFINET CBA)-Void . 241 8 Communication Profile Family 4 (P-NET) 241 8.1 General overview . 241 8.2 Profile 4/1 (P-NET RS-485) 241 Physical layer . 241 8.2.1Data-link layer 2

28、42 8.2.2Application layer . 243 8.2.3 9 Communication Profile Family 5 (WorldFIP) 244 9.1 General overview . 244 9.2 Profile 5/1 (WorldFIP) 245 Physical layer . 245 9.2.1Data-link layer 247 9.2.2Application layer . 249 9.2.3 9.3 Profile 5/2 (WorldFIP) 255 Physical layer . 255 9.3.1Data-link layer 25

29、5 9.3.2Application layer . 255 9.3.3 9.4 Profile 5/3 (WorldFIP) 261 Physical layer . 261 9.4.1Data-link layer 261 9.4.2Application layer . 261 9.4.3 10 Communication Profile Family 6 (INTERBUS) . 262 10.1 General overview . 262 10.2 Profile 6/1 263 Physical layer . 263 10.2.1Data-link layer 265 10.2

30、2Application layer . 267 10.2.3 10.3 Profile 6/2 268 Physical layer . 268 10.3.1Data-link layer 269 10.3.2Application layer . 270 10.3.3 10.4 Profile 6/3 271 Physical layer . 271 10.4.1Data-link layer 271 10.4.2Application layer . 272 10.4.3 11 Communication Profile Family 7 Void. 273 12 Communicat

31、ion Profile Family 8 (CC-Link) . 274 12.1 General overview . 274 General 274 12.1.1 4 IEC 61784-1:2014 IEC 2014 Profile 8/1 . 274 12.1.2Profile 8/2 . 275 12.1.3Profile 8/3 . 275 12.1.4 12.2 Profile 8/1 275 Physical layer . 275 12.2.1Data-link layer 276 12.2.2Application layer . 279 12.2.3 12.3 Profi

32、le 8/2 282 Physical layer . 282 12.3.1Data-link layer 282 12.3.2Application layer . 282 12.3.3 12.4 Profile 8/3 282 Physical layer . 282 12.4.1Data-link layer 283 12.4.2Application layer . 286 12.4.3 13 Communication Profile Family 9 (HART ) 289 13.1 General Overview 289 13.2 Profile 9/1, HART . 289

33、 Physical layer . 289 13.2.1Data-link layer 290 13.2.2Application layer . 291 13.2.3 13.3 Profile 9/2, WirelessHART . 292 14 Communication Profile Family 16 (SERCOS) . 292 14.1 General overview . 292 14.2 Profile 16/1 (SERCOS I) 292 Physical layer selection 292 14.2.1Data-link layer 293 14.2.2Applic

34、ation layer . 294 14.2.3 14.3 Profile 16/2 (SERCOS II) . 294 Physical layer . 294 14.3.1Data-link layer 295 14.3.2Application layer . 296 14.3.3 15 Communication Profile Family 19 (MECHATRLINK) . 296 15.1 General overview . 296 15.2 Profile 19/1 (MECHATROLINK-II) 296 Physical layer selection 296 15.

35、2.1Data-link layer 298 15.2.2Application layer . 307 15.2.3 15.3 Profile 19/2 (M-III) 313 Physical layer . 313 15.3.1Data-link layer 313 15.3.2Application layer . 323 15.3.3(informative) Communication concepts . 328 Annex A A.1 CPF 1 (FOUNDATION Fieldbus) communication concepts . 328 A.1.1 Overview

36、328 A.1.2 Physical layer characteristics . 328 A.1.3 Data-link layer characteristics 328 A.1.4 Application layer characteristics . 329 IEC 61784-1:2014 IEC 2014 5 A.1.5 Management characteristics 329 A.2 CPF 2 (CIP) communication concepts 329 A.2.1 Overview 329 A.2.2 CIP common characteristics . 330

37、 A.2.3 ControlNet . 330 A.2.4 EtherNet/IP 331 A.2.5 DeviceNet 332 A.3 CPF 3 (PROFIBUS & PROFINET) communication concepts 332 A.3.1 Basic characteristics 332 A.3.2 Physical layer profiles 333 A.3.3 Communication feature list (GSD) 334 A.3.4 PROFINET-Void 334 A.4 CPF 4 (P-NET) communication concepts .

38、 334 A.5 CPF 5 (WorldFIP) communication concepts . 336 A.5.1 Physical layer characteristics . 336 A.5.2 Data-link layer characteristics 336 A.5.3 Application layer characteristics . 336 A.6 CPF 6 (INTERBUS) communication concepts 336 A.7 CPF 8 (CC-LINK) communication concepts . 338 A.7.1 Basic chara

39、cteristics 338 A.7.2 Variants . 338 A.8 CPF 9 (HART) communication concepts 339 A.9 CPF 16 (SERCOS) communication concepts . 339 (informative) Added value of IEC 61784-1. 341 Annex B Bibliography 342 Figure 1 Communication profile families and profiles . 18 Figure 2 Example optical power budget for

40、a 100/140 m fiber system with a 16/16 optical passive star coupler. 46 Figure 3 CP 3/2 Slave devices usable in applications. 138 Figure A.1 Ring structure . 339 Figure A.2 Topology example. 340 Table 1 Relations of Communication Profile Families to type numbers . 19 Table 2 Layout of profile (sub)cl

41、ause selection tables 24 Table 3 Contents of (sub)clause selection tables . 25 Table 4 Layout of service selection tables 25 Table 5 Contents of service selection tables 26 Table 6 Layout of parameter selection tables . 26 Table 7 Contents of parameter selection tables . 26 Table 8 Layout of class a

42、ttribute selection tables . 27 Table 9 Contents of class attribute selection tables 27 Table 10 CPF 1: overview of profile sets 29 Table 11 CP 1/1: PhL selection for communicating devices and their MAUs . 29 Table 12 CP 1/1: PhL classification of MAUs and attached devices 31 6 IEC 61784-1:2014 IEC 2

43、014 Table 13 CP 1/1: PhL selection of Clause 16 for devices and their MAUs 32 Table 14 CP 1/1: PhL selection of Clause 12 for devices and their MAUs 32 Table 15 Void 33 Table 16 CP 1/1: PhL selection of recommended IS parameters for MAU classes 111, 112, 121, 122, 511 and 512 34 Table 17 CP 1/1: PhL

44、 selection for media components. 35 Table 18 CP 1/1: PhL selection of imperative IS parameters for media in FISCO systems 36 Table 19 CP 1/1: PhL selection for power supplies 37 Table 20 CP 1/1: PhL selection of power supply types . 38 Table 21 CP 1/1: PhL selection of permissible output voltage and

45、 IS parameters for FISCO power supplies 38 Table 22 CP 1/1: PhL selection for terminators 39 Table 23 CP 1/1: PhL selection of IS parameters for terminators . 40 Table 24 CP 1/1: PhL selection of Clause 12 for intrinsic safety barriers 41 Table 25 CP 1/1: PhL selection of recommended IS parameters f

46、or intrinsic safety barriers and galvanic isolators (Entity model only) 42 Table 26 CP 1/1: PhL selection of Clause 12 for intrinsically safe galvanic isolators 43 Table 27 CP 1/1: PhL selection of Clause 15, recommended optical fiber types . 44 Table 28 CP 1/1: PhL selection of passive star coupler

47、s, recommended maximum insertion loss 44 Table 29 CP 1/1: PhL selection of active star couplers . 45 Table 30 CP 1/1: Optical power budget considerations 45 Table 31 CP 1/1: DLL service selection 47 Table 32 CP 1/1: DLL service selection of Clause 5 . 47 Table 33 CP 1/1: DLL service selection of 5.4

48、 47 Table 34 CP 1/1: DLL service selection of 5.4.1 . 48 Table 35 CP 1/1: DLL service selection of 5.4.3 . 48 Table 36 CP 1/1: DLL service selection of 5.4.6 . 49 Table 37 CP 1/1: DLL service selection of Clause 6 . 50 Table 38 CP 1/1: DLL service selection of the summary of 6.3, DL-connection QoS .

49、 51 Table 39 CP 1/1: DLL service selection of figures 9 to 14 of 6.4 . 51 Table 40 CP 1/1: DLL service selection of 6.5 52 Table 41 CP 1/1: DLL service selection: replacement for Table 13 of 6.5 . 53 Table 42 CP 1/1: DLL service selection of 6.5, replacement for Table 14 . 54 Table 43 CP 1/1: DLL service selection of 6.5 for use of addresses for