IEC 62047-4-2008 Semiconductor devices - Micro-electromechanical devices - Part 4 Generic specifications for MEMS《半导体装置.微电机装置.第4部分 MEMS用总规范》.pdf

1、 IEC 62047-4 Edition 1.0 2008-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 4: Generic specification for MEMS Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 4: Spcification gnrique pour les MEMS IEC 62047-4:2008 THIS PU

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16、contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62047-4 Edition 1.0 2008-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 4: Generic specification for MEMS Dispositifs semiconducteurs Dispositifs microlectromca

17、niques Partie 4: Spcification gnrique pour les MEMS INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.080.99 PRICE CODE CODE PRIX ISBN 2-8318-9968-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electro

18、technique Internationale 2 62047-4 IEC:2008 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms, definitions, units and symbols.6 4 Standard environmental conditions.7 5 Marking 7 5.1 Device identification 7 5.2 Device traceability.7 5.3 Packing .7 6 Quality assessment procedures7 6.1 Ge

19、neral .7 6.1.1 Eligibility for qualification and/or capability approval7 6.1.2 Primary stage of manufacture7 6.1.3 Formation of inspection lots.7 6.1.4 Structurally similar device7 6.1.5 Subcontracting 8 6.1.6 Incorporated components 8 6.1.7 Validity of release8 6.2 Qualification approval procedure

20、.8 6.2.1 Qualification approval testing.8 6.2.2 Environmental and climatic tests .8 6.2.3 Granting of qualification approval 8 6.2.4 Statistical sampling procedures .11 6.2.5 Endurance tests 11 6.2.6 Endurance tests where the failure rate is specified 11 6.2.7 Accelerated test procedures 12 7 Test a

21、nd measurement procedures.12 7.1 Standard conditions and general precautions 12 7.1.1 Standard conditions.12 7.1.2 General precautions 13 7.1.3 Precision of measurements .13 7.2 Physical examination.13 7.2.1 Visual examination 13 7.2.2 Dimensions .13 7.3 Climatic and mechanical tests .13 7.4 Alterna

22、tive test methods13 Annex A (normative) Sampling procedures 14 Annex B (informative) Classification for MEMS technologies and devices 15 Bibliography19 Table 1 MEMS categories and terms6 Table 2 Subgrouping for Group B and Group C10 62047-4 IEC:2008 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION SEMICO

23、NDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 4: Generic specification for MEMS FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is t

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32、iance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the

33、elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-4 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconduc

34、tor devices. The text of this standard is based on the following documents: FDIS Report on voting 47/1975/FDIS 47/1985/RVD Full information on the voting for the approval on this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordan

35、ce with the ISO/IEC Directives, Part 2. 4 62047-4 IEC:2008 A list of all the parts in the IEC 62047 series, under the general title Semiconductor devices Micro-electromechanical devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unch

36、anged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62047-4 IEC:2008 5 SEMICONDUCTOR DEVICES MICRO

37、-ELECTROMECHANICAL DEVICES Part 4: Generic specification for MEMS 1 Scope This part of IEC 62047 describes generic specifications for micro-electromechanical systems (MEMS) made by semiconductors, which are the basis for specifications given in other parts of this series for various types of MEMS ap

38、plications such as sensors, RF MEMS, excluding optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general procedures for quality assessment to be used in IECQ-CECC systems and establishes general principles for describing and testing of electrical, optical, mechanical and env

39、ironmental characteristics. This part of IEC 62047 aids in the preparation of standards that define devices and systems made by micromachining technology, including but not limited to, material characterization and handling, assembly and testing, process control and measuring methods. MEMS described

40、 in this standard are basically made of semiconductor material. However, the statements made in this standard are also applicable to MEMS using materials other than semiconductor, for example, polymers, glass, metals and ceramic materials. 2 Normative references The following referenced documents ar

41、e indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60027 (all parts), Letter symbols to be used in electrical technology IEC 60068-2

42、(all parts), Environmental testing Part 2: Tests IEC 60617, Graphical symbols for diagrams IEC 60747-1:2006, Semiconductor devices Part 1: General IEC 60749 (all parts), Semiconductor devices Mechanical and climatic test methods IEC 61193-2, Quality assessment systems Part 2: Selection and use of sa

43、mpling plans for inspection of electronic components and packages IEC 62047-1, Semiconductor devices Micro-electromechanical devices Part 1: Terms and definitions IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) Rules of Procedure Part 3: Approval procedures ISO 1

44、000, SI units and recommendations for the use of their multiples and of certain other units ISO 2859-1, Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by acceptance quality limit (AQL) for lot-by-lot inspection 6 62047-4 IEC:2008 3 Terms, definitions, units and sym

45、bols For the purposes of this document, terms shall, wherever possible, be taken from IEC 62047-1; units, and graphical and letter symbols shall, wherever possible, be taken from IEC 60027, IEC 60617 and ISO 1000. Any other units, symbols or terminology peculiar to one of the devices covered by this

46、 generic specification shall be taken from the relevant IEC or ISO standards (see Clause 2) or derived in accordance with the principles of the standards listed above. Table 1 shows the categories and terms on MEMS area. Table 1 MEMS categories and terms Category Sub-category Terms General MEMS, MST

47、, micromachine, micromachine technology Science and engineering Microscience and engineering, scale effect, mesotribology, microtribology, biomimetics, ciliary motion, self-organization Material science Shape memory polymer, modification Actuator Actuator, micro-actuator, electrostatic actuator, lig

48、ht driven actuator, piezoelectric actuator, shape memory alloy actuator, sol-gel conversion actuator, comb drive actuator, wobble motor Sensor Microsensor, biosensor, integrated microprobe, ion sensitive field effect transistor (ISFET), accelerometer, micro-gyroscope Functional element Other Diaphra

49、gm structure, microcantilever, microchannel, micromirror, scanning mirror, microswitch, optical switch, microgripper, micropump, microvalve, integrated mass flow controller, micro fuel cell, photoelectric transducer General Micromachining Silicon process Silicon process, thick film technology, thin film technology, bulk micro- machining, surface micromachining, photolithography, electron