1、 IEC 62132-1 Edition 2.0 2015-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Integrated circuits Measurement of electromagnetic immunity Part 1: General conditions and definitions Circuits intgrs Mesure de limmunit lectromagntique Partie 1: Conditions gnrales et dfinitions IEC 62132-1:2015-10(en-fr)
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19、Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62132-1 Edition 2.0 2015-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Integrated circuits Measurement of electromagnetic immunity Part 1: General conditions and definition
20、s Circuits intgrs Mesure de limmunit lectromagntique Partie 1: Conditions gnrales et dfinitions INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.200 ISBN 978-2-8322-2968-2 Registered trademark of the International Electrotechnical Commission Marque dpose de
21、 la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 62132-1:2015 IEC 2015 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 S
22、cope 7 2 Normative references. 7 3 Terms and definitions 7 4 Test conditions 11 4.1 General . 11 4.2 Ambient conditions 11 4.2.1 Ambient temperature 11 4.2.2 RF ambient 11 4.2.3 RF-immunity of the test setup . 11 4.2.4 Other ambient conditions 11 4.3 Test generator 11 4.4 Frequency range . 11 5 Test
23、 equipment 12 5.1 General . 12 5.2 Shielding . 12 5.3 Test generator and power amplifier 12 5.4 Other components . 12 6 Test setup . 12 6.1 General . 12 6.2 Test circuit board 12 6.3 Pin selection scheme 12 6.4 IC pin loading/termination 13 6.5 Power supply requirements . 13 6.6 IC specific consider
24、ations 13 6.6.1 IC supply voltage . 13 6.6.2 IC decoupling . 14 6.6.3 Operation of IC 14 6.6.4 Guidelines for IC stimulation . 14 6.6.5 IC monitoring . 14 6.7 IC stability over time 14 7 Test procedure 14 7.1 Monitoring check . 14 7.2 Human exposure . 14 7.3 System verification 14 7.4 Specific proce
25、dures . 15 7.4.1 Frequency steps 15 7.4.2 Amplitude modulation . 15 7.4.3 Power levelling for modulation 15 7.4.4 Dwell time 16 7.4.5 Monitoring of the IC 16 8 Test report. 16 8.1 General . 16 IEC 62132-1:2015 IEC 2015 3 8.2 Immunity limits or levels 17 8.3 IC performance classes . 17 8.4 Interpreta
26、tion of results . 17 8.4.1 Comparison between IC(s) using the same test method 17 8.4.2 Comparison between different test methods 17 8.4.3 Correlation to module test methods 17 Annex A (informative) Test method comparison table 18 Annex B (informative) General test board description . 20 B.1 Overvie
27、w. 20 B.2 Board description Mechanical . 20 B.3 Board description Electrical 20 B.3.1 General . 20 B.3.2 Ground planes . 20 B.3.3 Package pins . 21 B.3.4 Via diameters . 21 B.3.5 Via distance . 21 B.3.6 Additional components . 21 B.3.7 Supply decoupling 21 B.3.8 I/O load . 22 Bibliography . 24 Figur
28、e 1 RF signal when RF peak power level is maintained . 16 Figure B.1 Example of an immunity test board 23 Table 1 IC pin loading default values 13 Table 2 Frequency step size versus frequency range 15 Table A.1 Conducted immunity . 18 Table A.2 Radiated immunity 19 Table B.1 Position of vias over th
29、e board 20 4 IEC 62132-1:2015 IEC 2015 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNETIC IMMUNITY Part 1: General conditions and definitions FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co
30、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St
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39、 Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held
40、responsible for identifying any or all such patent rights. International Standard IEC 62132-1 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2006 and constitutes
41、 a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) frequency range of 150 kHz to 1 GHz has been deleted from the title; b) frequency step above 1 GHz has been added in Table 2 in 7.4.1; c) IC performance classes in 8.3 ha
42、ve been modified; d) Table A.1 was divided into two tables, and references to IEC 62132-8 and IEC 62132-9 have been added in the new Table A.2 in Annex A. IEC 62132-1:2015 IEC 2015 5 The text of this standard is based on the following documents: FDIS Report on voting 47A/974/FDIS 47A/977/RVD Full in
43、formation on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 62132 series, published under the general title Integrated
44、circuits Measurement of electromagnetic immunity, can be found on the IEC website. Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the next edition. The committee has decided that the contents
45、 of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 IEC 62132-1:2015
46、IEC 2015 INTRODUCTION The IEC 62132 series is published in several parts, under the general title Integrated circuits Measurement of electromagnetic immunity: Part 1: General conditions and definitions Part 2: Measurement of radiated immunity TEM cell and wideband TEM cell method Part 3: Bulk curren
47、t injection (BCI) method Part 4: Direct RF power injection method Part 5: Workbench Faraday cage method Part 8: Measurement of radiated immunity IC stripline method Part 9: Measurement of radiated immunity Surface scan method IEC 62132-1:2015 IEC 2015 7 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGN
48、ETIC IMMUNITY Part 1: General conditions and definitions 1 Scope This part of IEC 62132 provides general information and definitions about measurement of electromagnetic immunity of integrated circuits (ICs) to conducted and radiated disturbances. It also defines general test conditions, test equipm
49、ent and setup, as well as the test procedures and content of the test reports for all parts of the IEC 62132 series. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable fo
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