IEC 62137-1-1-2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 Pull strength test《表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-1部分 拉拔强度试验》.pdf

1、 IEC 62137-1-1 Edition 1.0 2007-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-1: Pull strength test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints br

2、ass monts en surface Partie 1-1: Essai de rsistance la traction IEC 62137-1-1:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, e

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16、sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-1 Edition 1.0 2007-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance

17、 test methods for surface mount solder joint Part 1-1: Pull strength test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints brass monts en surface Partie 1-1: Essai de rsistance la traction INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE

18、INTERNATIONALE P ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-9782-3 2 62137-1-1 IEC:2007 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 General remarks.6 5 Test equipment and materials.7 5.1 Flow soldering equipment7 5.2 Reflow soldering equipment 7 5.3 Pull str

19、ength test equipment 7 5.4 Optical microscope7 5.5 Test substrate .7 5.6 Solder alloy .8 5.7 Flux for flow soldering .8 5.8 Solder paste8 6 Mounting method8 6.1 Flow soldering.8 6.2 Reflow soldering9 7 Test conditions.10 7.1 Test: Rapid change of temperature10 7.2 Pull strength test .10 8 Test proce

20、dure .10 8.1 Test sequence.10 8.2 Pre-conditioning 11 8.3 Initial pull strength measurement.11 8.4 Rapid change of temperature 11 8.5 Recovery.11 8.6 Intermediate/final pull strength measurement 11 9 Items to be included in the test report.11 10 Items to be given in the product specification .12 Ann

21、ex A (normative) Pull strength test Details 13 Bibliography15 Figure 1 Gull-wing leaded component 6 Figure 2 Area under evaluation in the pull strength test7 Figure 3 Example of a flow soldering profile (actual measurement for double-wave soldering) .9 Figure 4 Typical reflow profile 10 Figure 5 Tes

22、t procedure.11 Figure A.1 Pull strength test.14 Figure A.2 An example of the shape of the tip of the pulling jig 14 Figure A.3 Failure modes in pull strength test 14 62137-1-1 IEC:2007 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS

23、FOR SURFACE MOUNT SOLDER JOINT Part 1-1: Pull strength test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-

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32、ation or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Public

33、ation may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-1-1 has been prepared by IEC technical committee 91: Electronics assembly technology. This bilingual version, published in 2008-05, corresponds

34、 to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/681/FDIS 91/697/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard

35、 has not been voted upon. 4 62137-1-1 IEC:2007 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 62137 series, under the general title Surface mounting technology Environmental and endurance test methods for surface mount solder j

36、oint, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication wi

37、ll be reconfirmed; withdrawn; replaced by a revised edition; or amended. 62137-1-1 IEC:2007 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-1: Pull strength test 1 Scope The test method described in this part of IEC 62137 is applicable to

38、gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on th

39、e strength of the solder joint between component terminals and lands on a substrate. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of t

40、he referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60068-2-14, Environmental testing Part 2-14: Tests Test N: Change of temperature IEC 60194, Printed board design, manufacture and assembly Terms and definitions (only availa

41、ble in English) IEC 61188-5-5, Printed boards and printed board assemblies Design and use Part 5-5: Attachment (land/joint) considerations Components with gull-wing leads on four sides (only available in English) IEC 61190-1-1, Attachment materials for electronic assembly Part 1-1: Requirements for

42、soldering fluxes for high-quality interconnections in electronics assembly IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (only available in English) IEC 61190-1-3, Attachment materials fo

43、r electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (only available in English) IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materia

44、ls clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 6 62137-1-1 IEC:2007 NOTE Key terms used in this standard are taken mostly from

45、IEC 60194 and IEC 60068-1. 3.1 gull-wing lead lead stretching out from a surface mount component as illustrated in Figure 1 Gull-wing lead IEC 1173/07 Figure 1 Gull-wing leaded component 3.2 pull strength maximum force to break the joint of a lead to board when a gull-wing lead of a surface mount co

46、mponent is pulled using a pulling tool at an angle of 45 to the board surface 3.3 pull speed moving speed of the pulling tool holding a gull-wing lead of a component mounted on board in pull strength test 4 General remarks The mechanical properties of the joint between leads to lands on a printed wi

47、ring board using lead-free solder are not the same for the joint using tin-lead solder due to the difference in composing elements of the solders. Thus it becomes important to test the mechanical properties of solder joints, using different solder alloys, and after temperature cycling stress have be

48、en applied. In this test method, the test specimens are mounted on a substrate either by flow soldering or by reflow soldering. The durability of the solder joints is evaluated first by exposing the electronic components to rapid changes of temperature and after that applying pull strength to the so

49、ldered joint. Users of gull-wing components subjected to these tests should check that the results ensure an adequate margin of attachment strength bearing in mind the mass of the component, the number of leads and the specified mechanical environment of the electronic assembly for which the component is intended. NOTE 1 The exposure temperatures in this test may exc