1、 IEC 62215-3 Edition 1.0 2013-07 INTERNATIONAL STANDARD NORME INTERNATIONALE Integrated circuits Measurement of impulse immunity Part 3: Non-synchronous transient injection method Circuits intgrs Mesure de limmunit aux impulsions Partie 3: Mthode dinjection de transitoires non synchrones IEC62215-3:
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16、ARD NORME INTERNATIONALE Integrated circuits Measurement of impulse immunity Part 3: Non-synchronous transient injection method Circuits intgrs Mesure de limmunit aux impulsions Partie 3: Mthode dinjection de transitoires non synchrones INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTEC
17、HNIQUE INTERNATIONALE V ICS 31.200 PRICE CODE CODE PRIX ISBN 978-2-8322-0994-3 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Att
18、ention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 62215-3 IEC:2013 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 General 8 5 Coupling networks 9 5.1 General on coupling networks . 9 5.2 Supply injection networ
19、k 9 5.2.1 Direct injection 9 5.2.2 Capacitive coupling . 10 5.3 Input injection 10 5.4 Output injection . 11 5.5 Simultaneous multiple pin injection 12 6 IC configuration and evaluation 12 6.1 IC configuration and operating modes . 12 6.2 IC monitoring . 13 6.3 IC performance classes . 13 7 Test con
20、ditions . 14 7.1 General . 14 7.2 Ambient electromagnetic environment . 14 7.3 Ambient temperature . 14 7.4 IC supply voltage . 14 8 Test equipment . 14 8.1 General requirements for test equipment . 14 8.2 Cables . 14 8.3 Shielding . 14 8.4 Transient generator . 14 8.5 Power supply . 14 8.6 Monitori
21、ng and stimulation equipment . 14 8.7 Control unit . 15 9 Test set up . 15 9.1 General . 15 9.2 EMC test board . 15 10 Test procedure . 17 10.1 Test plan . 17 10.2 Test preparation 17 10.3 Characterization of coupled impulses 17 10.4 Impulse immunity measurement 17 10.5 Interpretation and comparison
22、 of results 18 10.6 Transient immunity acceptance level . 18 11 Test report 18 Annex A (informative) Test board recommendations 19 Annex B (informative) Selection hints for coupling and decoupling network values . 24 Annex C (informative) Industrial and consumer applications 26 Annex D (informative)
23、 Vehicle applications 29 62215-3 IEC:2013 3 Figure 1 Typical pin injection test implementation 9 Figure 2 Supply pin direct injection test implementation . 10 Figure 3 Supply pin capacitive injection test implementation 10 Figure 4 Input pin injection test implementation . 11 Figure 5 Output pin inj
24、ection test implementation . 12 Figure 6 Multiple pin injection test implementation . 12 Figure 7 Test set-up diagram . 15 Figure 8 Example of the routing from the injection port to a pin of the DUT . 16 Figure A.1 Typical EMC test board topology. 22 Figure A.2 Example of implementation of multiple
25、injection structures . 23 Table A.1 Position of vias over the board . 19 Table C.1 Definition of pin types 26 Table C.2 Test circuit values 27 Table C.3 Example of IC impulse test level (IEC 61000-4-4) 28 Table D.1 IC pin type definition 29 Table D.2 Transient test level 12 V (ISO 7637-2) . 30 Table
26、 D.3 Transient test level 24 V (ISO 7637-2) . 31 Table D.4 Example of transient test specification . 32 4 62215-3 IEC:2013 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ INTEGRATED CIRCUITS MEASUREMENT OF IMPULSE IMMUNITY Part 3: Non-synchronous transient injection method FOREWORD 1) The International
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36、n, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements
37、of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62215-3 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical committee 47: Semiconductor devices. The text
38、of this standard is based on the following documents: CDV Report on voting 47A/881/CDV 47A/890/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Dire
39、ctives, Part 2. A list of all parts in the IEC 62215 series, published under the general title Integrated circuits Measurement of impulse immunity can be found on the IEC website. 62215-3 IEC:2013 5 The committee has decided that the contents of this publication will remain unchanged until the stabi
40、lity date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 62215-3 IEC:2013 INTEGRATED CIRCUITS MEASUREMENT OF IMPULSE IMMUNITY Part
41、3: Non-synchronous transient injection method 1 Scope This part of IEC 62215 specifies a method for measuring the immunity of an integrated circuit (IC) to standardized conducted electrical transient disturbances. The disturbances, not necessarily synchronized to the operation of the device under te
42、st (DUT), are applied to the IC pins via coupling networks. This method enables understanding and classification of interaction between conducted transient disturbances and performance degradation induced in ICs regardless of transients within or beyond the specified operating voltage range. 2 Norma
43、tive references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments)
44、applies. IEC 60050 (all parts), International Electrotechnical Vocabulary (IEV) (available at ) IEC 61000-4-4:2012, Electromagnetic compatibility (EMC) Part 4-4: Testing and measurement techniques Electrical fast transient/burst immunity test IEC 61000-4-5:2005, Electromagnetic compatibility (EMC) P
45、art 4-5: Testing and measurement techniques Surge immunity test IEC 62132-4:2006, Integrated circuits Measurement of electromagnetic immunity 150 kHz to 1 GHz Part 4: Direct RF power injection method ISO 7637-2:2011, Road vehicles Electrical disturbances from conduction and coupling Part 2: Electric
46、al transient conduction along supply lines only 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60050-131 and IEC 60050-161, some of which have been added for convenience, as well as the following apply. 3.1 auxiliary equipment equipment not under te
47、st but is indispensable for setting up all the functions and assessing the correct performance (operation) of the equipment under test (EUT) during its exposure to the disturbance 3.2 burst sequence of a limited number of distinct impulses or an oscillation of limited duration 62215-3 IEC:2013 7 3.3
48、 coupling network electrical circuit for transferring energy from one circuit to another with well-defined impedance and known transfer characteristics 3.4 performance degradation undesired departure in the operational performance of any device, equipment or system from its intended performance Note
49、 1 to entry: The term “degradation” can apply to temporary or permanent failure. 3.5 DUT device under test device, equipment or system being evaluated Note 1 to entry: In this part of IEC 62215, it refers to a semiconductor device being tested. Note 2 to entry: This note applies to the French language only. 3.6 EMC electromagnetic compatibility ability of an equipment or syste
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