1、 IEC 62258-5 Edition 1.0 2006-08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor die products Part 5: Requirements for information concerning electrical simulation Produits de puce de semiconducteurs Partie 5: Exigences pour les informations concernant la simulation lectrique IEC 62258-5:2
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16、RD NORME INTERNATIONALE Semiconductor die products Part 5: Requirements for information concerning electrical simulation Produits de puce de semiconducteurs Partie 5: Exigences pour les informations concernant la simulation lectrique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNI
17、QUE INTERNATIONALE M ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-83220-232-6 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Att
18、ention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 62258-5 IEC:2006 CONTENTS FOREWORD . 3 INTRODUCTION . 5 1 Scope . 6 2 Normative references 6 3 Terms and definitions . 6 4 General 6 5 Requirements for information on electrical simulation models 7 5.1 In
19、formation on the electrical simulation model 7 5.2 Information on device connectivity . 8 5.3 Information on the timing simulation model 8 5.4 Information on connection redistribution . 8 5.5 Information on package terminals 9 Annex A (informative) Supporting information . 10 Bibliography 12 62258-5
20、 IEC:2006 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 5: Requirements for information concerning electrical simulation FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotech
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29、 fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publi
30、cation. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62258-5 has been prepared by IEC technical committee 47:
31、 Semiconductor devices. This standard should be read in conjunction with IEC 62258-1 and IEC 62258-2. This bilingual version (2012-07) corresponds to the monolingual English version, published in 2006-08. The text of this standard is based on the following documents: FDIS Report on voting 47/1869/FD
32、IS 47/1882/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. 4 62258-5 IEC:2006 The French version of this standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directiv
33、es, Part 2. The structure of IEC 62258, as currently conceived, consists of the following parts under the general title Semiconductor die products: Part 1: Requirements for procurement and use Part 2: Exchange data formats Part 3: Recommendations for good practice in handling, packing and storage (T
34、echnical Report) Part 4: Questionnaire for die users and suppliers (Technical Report) (in preparation) Part 5: Requirements for information concerning electrical simulation Part 6: Requirements for information concerning thermal simulation Part 7: XML schema for data exchange (Technical Report) (in
35、preparation) Further parts may be added as required. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the
36、publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 62258-5 IEC:2006 5 INTRODUCTION This standard is based on the work carried out in the ESPRIT 4 thFramework project GOODDIE which resulted in the publication of the ES 59008 series of European specifications. Organ
37、isations that helped prepare this part of IEC 62258 includes the ESPRIT ENCAST project, the Die Products Consortium, JEITA, JEDEC and ZVEI. 6 62258-5 IEC:2006 SEMICONDUCTOR DIE PRODUCTS Part 5: Requirements for information concerning electrical simulation 1 Scope This part of IEC 62258 has been deve
38、loped to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 specifies the information required to facilitate th
39、e use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all tho
40、se involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated referenc
41、es, the latest edition of the referenced document (including any amendments) applies. IEC 62258-1, Semiconductor die products Part 1: Requirements for procurement and use IEC 62258-2, Semiconductor die products Part 2: Exchange data formats 3 Terms and definitions For the purposes of this document,
42、the terms, definitions and acronyms as given in IEC 62258- 1 apply. 4 General To comply with IEC 62258-1, suppliers of die devices shall furnish information, which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of products containing t
43、hem. Whilst it is expected that much of the information supplied will be in the public domain and available from such sources as manufacturers data sheets, this standard does not place an obligation on a supplier to make information public. Any information that a supplier considers to be proprietary
44、 or commercially sensitive may be supplied under the terms of a non-disclosure agreement. 62258-5 IEC:2006 7 Requirements and recommendations provided in this standard apply to electrical simulation models used to perform the following simulations: analysis of the signal propagation within the elect
45、ronic system; verification of the correct functionality of the electronic system; verification of the timing requirements; verification of the testability. Supporting information on the use of electrical simulation models is provided in Annex A. 5 Requirements for information on electrical simulatio
46、n models 5.1 Information on the electrical simulation model 5.1.1 General Where a simulation model is provided, the information as defined in the following subclauses shall be given. 5.1.2 Model file name The name of the file containing the model shall be given. 5.1.3 Creation date The date on which
47、 the model file was created shall be given. 5.1.4 Model description A description of the model shall be provided in sufficient detail for a user to understand its scope and apply the corresponding simulator correctly. 5.1.5 Model source The source and originator of the model shall be stated. 5.1.6 S
48、imulation program The name(s) of the simulation program(s) that will accept the model file as valid input shall be given. 5.1.7 Program version The version(s) of the simulation program(s) that are compatible with the given file shall be given. 5.1.8 Compliance level The level(s) of the simulation pr
49、ogram(s) with which the model file complies shall be given (for example SPICE level 3). 5.1.9 Model scope The scope of the model shall be given, including any limitations in its use (for example VHDL behavioural model). 8 62258-5 IEC:2006 5.2 Information on device connectivity 5.2.1 General The appropriate information, as data and/or model(s), describing the components connectivity features or characteristics should be sta
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