IEC 62258-6-2006 Semiconductor die products - Part 6 Requirements for information concerning thermal simulation《半导体压模产品.第6部分 关于热模拟的信息要求》.pdf

1、 INTERNATIONAL STANDARD IEC 62258-6First edition 2006-08Semiconductor die products Part 6: Requirements for information concerning thermal simulation Reference number IEC 62258-6:2006(E) Publication numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 seri

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7、urther information. Customer Service Centre If you have any questions regarding this publication or need further assistance, please contact the Customer Service Centre: Email: custserviec.ch Tel: +41 22 919 02 11 Fax: +41 22 919 03 00 INTERNATIONAL STANDARD IEC 62258-6First edition 2006-08Semiconduc

8、tor die products Part 6: Requirements for information concerning thermal simulation IEC 2006 Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in wr

9、iting from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch J For price, see current catalogue PRICE CODE Commission Electrotechnique Inter

10、nationale International Electrotechnical Commission 2 62258-6 IEC:2006(E) CONTENTS FOREWORD.3 INTRODUCTION.5 1 Scope.6 2 Normative references .6 3 Terms and definitions.6 4 General 6 5 Requirements for information for thermal simulation .7 5.1 Requirements for bare die with or without added connecti

11、on structures.7 5.2 Requirements for minimally-packaged die .7 5.3 Information on thermal simulation model .8 Bibliography9 62258-6 IEC:2006(E) 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DIE PRODUCTS Part 6: Requirements for information concerning thermal simulation FOREWORD 1) The

12、International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and

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18、onal publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformi

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20、ersonal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative

21、references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible

22、 for identifying any or all such patent rights. International Standard IEC 62258-6 has been prepared by IEC technical committee 47: Semiconductor devices. This standard should be read in conjunction with IEC 62258-1 and IEC 62258-2. The text of this standard is based on the following documents: FDIS

23、 Report on voting 47/1870/FDIS 47/1883/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62258-6 IEC:2006(E) The structure of I

24、EC 62258, as currently conceived, consists of the following parts under the general title Semiconductor die products: Part 1: Requirements for procurement and use Part 2: Exchange data formats Part 3: Recommendations for good practice in handling, packing and storage (Technical Report) Part 4: Quest

25、ionnaire for die users and suppliers (Technical Report) (in preparation) Part 5: Requirements for information concerning electrical simulation Part 6: Requirements for information concerning thermal simulation Part 7: XML schema for data exchange (Technical Report) (in preparation) Further parts may

26、 be added as required. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirme

27、d; withdrawn; replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. 62258-6 IEC:2006(E) 5 INTRODUCTION This standard is based on the work carried out in the ESPRIT 4 thFramework project GOODDIE which resulted in the publication of the ES 59

28、008 series of European specifications. Organisations that helped prepare this part to IEC 62258 included the ESPRIT ENCAST project, the Die Products Consortium, JEITA, JEDEC and ZVEI. 6 62258-6 IEC:2006(E) SEMICONDUCTOR DIE PRODUCTS Part 6: Requirements for information concerning thermal simulation

29、1 Scope This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This part of IEC 62258 determi

30、nes the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconducto

31、r die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edit

32、ion cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62258-1: Semiconductor die products Part 1: Requirements for procurement and use IEC 62258-2: Semiconductor die products Part 2: Exchange data formats 3 Terms and definiti

33、ons For the purposes of this document, the terms, definitions and acronyms as given in IEC 62258-1 apply. 4 General To comply with IEC 62258-1, suppliers of die devices shall furnish information, which is necessary and sufficient for users of the devices at all stages of design, procurement, manufac

34、ture and test of products containing them It is expected that much of the information supplied will be in the public domain and available from such sources as manufacturers data sheets. However, this standard does not place an obligation on a supplier to make information public. Any information that

35、 a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a non- disclosure agreement. 62258-6 IEC:2006(E) 7 Requirements and recommendations provided in this standard apply to thermal simulation models used to perform an analysis on how the thermal excursi

36、ons within the die affect the electrical performance of the die and system. 5 Requirements for information for thermal simulation 5.1 Requirements for bare die with or without added connection structures 5.1.1 General This clause covers the requirements for bare die with or without added connection

37、structures. The following information shall be given as a minimum together with any information needed to satisfy a specific thermal simulation model. 5.1.2 Operating temperature conditions The range of temperature under which the device operates shall be stated. 5.1.3 Maximum junction temperature T

38、he maximum allowable junction temperature shall be stated. 5.1.4 Extended junction temperature range Further allowed junction temperatures exceeding the maximum junction temperatures with reduced lifetimes for the conditions in 5.1.2 should be stated where appropriate. 5.1.5 Power dissipation Maximu

39、m power dissipation values under specified conditions shall be stated. Minimum and typical power dissipation values should also be given. 5.1.6 Distribution of heat sources When possible, a plot of the die surface indicating the position and area of heat sources should be given. 5.1.7 Type and power

40、 of each heat source The type and power of each heat source when possible, should be described, including whether the heat is generated in the die surface or the bulk substrate. 5.1.8 Thermal conductivity The thermal conductivity of all materials should be given. 5.1.9 Specific thermal capacity If a

41、 transient simulation is required, then the specific thermal capacity of all materials should be given. 5.2 Requirements for minimally-packaged die 5.2.1 General Information as described in the following subclauses should be supplied in addition to any relevant information as defined in 5.1 Modellin

42、g methods for packaged devices may be appropriate for this type of die device. 8 62258-6 IEC:2006(E) 5.2.2 Package thermal resistance The junction-to-ambient and/or junction-to-reference thermal resistance values of the package should be given. 5.2.3 Thermal resistance measurement test method and co

43、nditions A description of the test method and measurement test conditions including ambient temperature and airflow, reference temperature and reference location, under which thermal resistance measurements have been carried out, should be supplied. The power applied to the device under test during

44、the thermal resistance measurements should also be given. 5.2.4 Thermal properties of the encapsulation materials The thermal properties of all materials used for encapsulating the die (e.g. encapsulant, adhesive, substrate dielectric, etc.) used in the package should be stated. 5.3 Information on t

45、hermal simulation model 5.3.1 General Where a thermal simulation model is provided, for example a finite-element model, the information as defined in the following subclauses shall be given. 5.3.2 Model file name The name of the file containing the model shall be given. 5.3.3 Creation date The date

46、on which the model file was created shall be given. 5.3.4 Model description A description of the model shall be provided in sufficient detail for a user to understand its scope and apply the corresponding simulator correctly. 5.3.5 Model source The source and originator of the model shall be stated.

47、 5.3.6 Simulation program The name(s) of the simulation program(s) that will accept the model file as valid input shall be given. NOTE Examples of such simulators include ANSYS, FLOTHERM and ICEPAK. 5.3.7 Program version The version(s) of the simulation program(s) that are compatible with the given

48、file shall be given. 5.3.8 Compliance level The level(s) of the simulation program(s) with which the model file complies shall be given. 5.3.9 Model scope The scope of the model shall be given, including any limitations in its use. 62258-6 IEC:2006(E) 9 Bibliography EIA/JESD51, Methodology for the T

49、hermal Measurement of Component Packages (Single Semiconductor Device) EIA/JESD51-1, Integrated Circuit Thermal Measurement Method Electrical Test Method (Single Semiconductor Device) EIA/JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions Natural Convection (Still Air) EIA/JESD51-5, Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms EIA/JESD51-6, Thermal Test Method