1、 IEC 62496-2-2 Edition 1.0 2011-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Optical circuit boards Part 2-2: Measurements Dimensions of optical circuit boards Cartes circuits optiques Partie 2-2: Mesures Dimensions des cartes circuits optiques IEC62496-2-2:2011 colourinsideTHIS PUBLICATION IS COP
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16、Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62496-2-2 Edition 1.0 2011-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Optical circuit boards Part 2-2: Measurements Dimensions of optical circuit boards Cartes circuits optiques Partie 2-2: Mesures Dimensions des cartes circuits op
17、tiques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE U ICS 33.180.01 PRICE CODE CODE PRIX ISBN 978-2-88912-316-2 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale colourinside 2 6
18、2496-2-2 IEC:2011 CONTENTS FOREWORD . 4 1 Scope . 6 2 Normative references . 6 3 Terms and definitions . 6 4 Measurement condition 7 5 Objects to be measured and their procedures . 7 6 Measurement procedures for dimensions . 7 6.1 Core shape . 7 6.1.1 Measuring equipment 7 6.1.2 Procedure 9 6.2 Coor
19、dinates of I/O ports 9 6.2.1 Measurement procedure for end face I/O type OCB . 9 6.2.2 Measurement procedure for surface I/O port type OCB 11 6.3 Outer shape of optical circuit board . 14 6.3.1 Method 1 (reference) Use of observation system 14 6.3.2 Method 2 (alternative) Use of dimensional drawing
20、. 15 6.4 Misalignment angle of I/O ports . 16 6.4.1 Observation of cross section . 16 6.5 Mirror angle . 19 6.5.1 Method 1 (reference) Use of observation system 19 6.5.2 Method 2 (alternative) Use of confocal microscope . 20 6.6 Hole 21 6.6.1 Method 1 (reference) Use of observation system 21 6.6.2 M
21、ethod 2 (alternative) Use of laser scanning 22 Annex A (informative) Pattern pitch 24 Bibliography 27 Figure 1 Example of measuring equipment capable of observing core shape . 8 Figure 2 Example of sample set-up for observation of core shape (end face I/O type OCB or a sliced sample) 8 Figure 3 Exam
22、ple of sample set-up using a halogen lamp house with light-guide fibre for observation of core shape (surface I/O type OCB) . 9 Figure 4 Example of optical position adjustment system for end face I/O type OCB . 10 Figure 5 Example of optical position adjustment system for surface I/O type OCB . 13 F
23、igure 6 Example of verification with a dimensional drawing for a fibre flexible OCB . 16 Figure 7 Misalignment angle of I/O ports in end face I/O type OCB 17 Figure 8 Misalignment angle of I/O ports in surface I/O type OCB 17 Figure 9 Parameters for misalignment angle in end face I/O type OCB 18 Fig
24、ure 10 Parameters for misalignment angle in surface I/O type OCB 18 Figure 11 Schematic diagram of the mirror angle measurement using a confocal microscope . 21 Figure 12 Example of the profile at a mirror portion using a confocal microscope . 21 Figure A.1 Pattern pitch and objects of measurement (
25、an example of single layer) 24 Figure A.2 Pattern pitch and objects of measurement (an example of multi-layer) 25 62496-2-2 IEC:2011 3 Table 1 Objects to be measured and their methods 7 4 62496-2-2 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ OPTICAL CIRCUIT BOARDS Part 2-2: Measurements Dim
26、ensions of optical circuit boards FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions
27、 concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”)
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29、tes closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on th
30、e relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure tha
31、t the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the m
32、aximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodi
33、es provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to
34、IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
35、expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9)
36、Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62496-2-2 has been prepared by IEC technical committee 86: Fibre op
37、tics. The text of this standard is based on the following documents: FDIS Report on voting 86/378/FDIS 86/385/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with t
38、he ISO/IEC Directives, Part 2. A list of all parts of the IEC 62496 series, published under the general title Optical circuit boards, can be found on the IEC website. 62496-2-2 IEC:2011 5 The committee has decided that the contents of this publication will remain unchanged until the stability date i
39、ndicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that i
40、t contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 62496-2-2 IEC:2011 OPTICAL CIRCUIT BOARDS Part 2-2: Measurements Dimensions of optical circuit boards 1 Scope This part of IEC 6249
41、6 specifies the measurement procedures for dimensions related to interface information of optical circuit boards (OCB), defined in IEC 62496-4. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cit
42、ed applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60793-1-45, Optical fibres Part 1-45: Measurement methods and test procedures Mode field diameter IEC 61189-2, Tes
43、t methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 62496-2-1, Optical circuit boards Part 2-1: Measurements Optical attenuation and isolation1IEC 62496-4, Optical circuit boards
44、Part 4: Interface standards General and guidance ISO 10360-2, Geometrical product specifications (GPS) Acceptance and reverification tests for coordinate measuring machines (CMM) Part 2: CMMs used for measuring linear dimensions 3 Terms and definitions For the purposes of this document, the followin
45、g terms and definitions apply. 3.1 optical position adjusting system consists of a light source, fibre position adjustment stage, OCB holder, input/output fibre and a power meter. The optimum fibre launch position, at which the optical output power is maximised, is determined through alignment of th
46、e input/output fibres to the OCB and monitoring the output power from the OCB 3.2 dimensional drawing illustration, including dashed lines, which defines classified OCB or OCB body shape accuracy using the origin point or alignment mark as the standard point _ 1To be published. 62496-2-2 IEC:2011 7
47、4 Measurement condition All the measurements are made under the conditions specified in IEC 60068-1, unless otherwise specified. Measurements may be made under different conditions to the standard conditions if the standard conditions are difficult to achieve, as long as the actual measurement condi
48、tion does not give rise to any doubt as to the result of the measurement. 5 Objects to be measured and their procedures Objects to be measured as dimensions of OCB are stated in IEC 62496-4. The objects and their methods are summarized in Table 1. This standard specifies mainly mechanical procedures
49、 using observation systems for dimensions of OCBs. Table 1 Objects to be measured and their methods Method 1 (reference) Method 2 (alternative) Observation system Optical position adjustment Dimensional drawing Confocal microscope Laser scanning Core shape O Coordinates of I/O port O O Outer shape of OCB O O Misalignment angles of I/O O
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