IEC 60068-2-69-2017 Environmental testing - Part 2-69 Tests - Test Te Tc Solderability testing of electronic components and printed boards by the wetting balanc.pdf

1、 IEC 60068-2-69 Edition 3.0 2017-03 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-69: Tests Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method Essais denvironnement Partie 2-69: Essais Essai Te/Tc

2、 Essai de brasabilit des composants lectroniques et cartes imprimes par la mthode de la balance de mouillage (mesure de la force) IEC 60068-2-69:2017-03(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of

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20、DARD NORME INTERNATIONALE Environmental testing Part 2-69: Tests Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method Essais denvironnement Partie 2-69: Essais Essai Te/Tc: Essai de brasabilit des composants lectroniques et c

21、artes imprimes par la mthode de la balance de mouillage (mesure de la force) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 19.040; 31.190 ISBN 978-2-8322-3994-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commiss

22、ion Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 60068-2-69:2017 IEC 2017 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative refere

23、nces 7 3 Terms and definitions 7 4 General description of the method . 8 4.1 General . 8 4.2 Components . 8 4.3 Printed boards 8 4.4 Measurement 8 5 Description of the test apparatus . 8 6 Preparation of specimens 10 6.1 Cleaning . 10 6.2 Preconditioning . 10 7 Materials . 11 7.1 Solder . 11 7.1.1 G

24、eneral . 11 7.1.2 Solder alloy containing lead . 11 7.1.3 Lead-free solder alloy 11 7.1.4 Solder contamination control . 11 7.1.5 Solder mass for solder globule wetting balance method . 12 7.2 Flux 13 7.2.1 Rosin based flux 13 7.2.2 Flux maintenance 13 7.2.3 Test flux selection criteria 13 8 Procedu

25、re 13 8.1 Test temperature 13 8.1.1 Solder alloy containing lead . 13 8.1.2 Lead-free solder alloy 13 8.2 Test procedure 13 8.2.1 Applicable test procedure 13 8.2.2 Solder bath wetting balance procedure 14 8.2.3 Solder globule wetting balance procedure 17 8.2.4 Procedure for testing printed board sp

26、ecimens 20 9 Presentation of results . 21 9.1 Form of force versus time trace . 21 9.2 Test requirements . 22 10 Information to be given in the relevant specification . 23 Annex A (normative) Equipment specification 24 A.1 Characteristics of the apparatus 24 A.2 Solder bath . 24 A.3 Globule support

27、blocks . 25 Annex B (informative) Use of the wetting balance for SMD solderability testing 26 B.1 Definition of the measure of solderability 26 B.2 Gauge R any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- g

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36、hts. International Standard IEC 60068-2-69 has been prepared by IEC technical committee 91: Electronics assembly technology. This third edition cancels and replaces the second edition published in 2007 as well as the second edition of IEC 60068-2-54 published in 2006 and constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: integration of IEC 60068-2-54; inclusion of tests of printed boards; inclusion of new component types, and updating test parameters for the whole component list;