IEC 60068-2-83-2011 Environmental Testing - Part 2-83 Tests - Test Tf Solderability testing of electronic components for surface mounting devices (SMD) by the w.pdf

1、 IEC 60068-2-83 Edition 1.0 2011-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste Essais denvironnement Partie 2-83: Essais

2、 Essai Tf: Essai de brasabilit des composants lectroniques pour les composants pour montage en surface (CMS) par la mthode de la balance de mouillage utilisant de la pte braser IEC 60068-2-83:2011 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2011 IEC, Geneva, Switzerland All rights reserved. Un

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17、ion 1.0 2011-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste Essais denvironnement Partie 2-83: Essais Essai Tf: Essai de

18、brasabilit des composants lectroniques pour les composants pour montage en surface (CMS) par la mthode de la balance de mouillage utilisant de la pte braser INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE W ICS 19.040; 31.190 PRICE CODE CODE PRIX ISBN 978-2-88912

19、665-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 60068-2-83 IEC:2011 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope . 8 2 Normative references . 8 3 Terms and definitions . 8 4 Test 9 4.1 General description

20、 9 4.2 Test methods 9 5 Preconditioning 9 6 Preparation 10 6.1 Solder paste 10 6.2 Test jig plate . 10 6.3 Specimen holder . 10 7 Quick heating method . 10 7.1 Equipment . 10 7.2 Test jig plate . 11 7.3 Preparation . 12 7.4 Test condition 12 7.4.1 Test temperature . 12 7.4.2 Feed of solder paste an

21、d immersion condition . 13 7.4.3 Immersion and withdrawal conditions for test specimen . 14 7.5 Test procedure 14 7.6 Presentation of the result 15 7.7 Characterisation parameter examples . 15 8 Synchronous method 16 8.1 Equipment . 16 8.2 Test jig plate . 17 8.3 Synchronous fixture . 17 8.4 Prepara

22、tion . 17 8.5 Test condition 17 8.5.1 Test temperature . 17 8.5.2 Feed of solder paste and immersion condition . 17 8.5.3 Immersion and withdrawal conditions for the test specimen . 17 8.6 Test procedure 17 8.7 Presentation of the results . 18 8.8 Characterisation parameter examples . 19 9 Temperatu

23、re profile method 19 9.1 Equipment . 19 9.2 Test jig plate . 19 9.3 Preparation . 20 9.4 Test condition 20 9.4.1 Test temperature . 20 9.4.2 Feed of solder paste and immersion condition . 21 9.4.3 Immersion and withdrawal conditions for test specimen . 21 9.5 Test procedure 21 60068-2-83 IEC:2011 3

24、9.6 Presentation of the result 22 9.7 Characterisation parameter examples . 23 Annex A (normative) Equipment for the quick heating and synchronous method 24 Annex B (informative) Reading of the output data and correction of the result in the quick heating test 25 Annex C (normative) Test equipment f

25、or the temperature profile method . 28 Annex D (informative) Reading of the output data and correction of the result in the temperature profile test . 29 Annex E (informative) Caveats / Notes. 32 Bibliography 36 Figure 1 Examples of the quick heating method test equipment . 11 Figure 2 Example of te

26、st jig plate for quick heating and synchronous method 12 Figure 3 Example of the temperature profile. 13 Figure 4 Example of applying solder paste to a test jig plate 14 Figure 5 Typical output shape of signal in the quick heating method 15 Figure 6 Example of synchronous method test equipment 16 Fi

27、gure 7 Example of synchronous fixture . 17 Figure 8 Typical output shape of signal in the synchronous method . 18 Figure 9 Example of the system for temperature profile method test equipment . 19 Figure 10 Example of the temperature profile . 20 Figure 11 Example of applying solder paste to a test j

28、ig plate 22 Figure 12 Typical output shape of signal in the temperature profile method . 23 Figure B.1 Typical wetting force changes in quick heating method . 26 Figure B.2 Example of correction of the initial time of wetting (F ais larger than 0,5F 1,max ) . 27 Figure B.3 Example of correction of t

29、he initial time of wetting (F ais 0,5F 1,maxor less) . 27 Figure D.1 Typical output forms for profile temperature test . 30 Figure D.2 The case when an extruding force (1,1F maxor larger) is generated immediately after the beginning of wetting 31 Figure E.1 Explanation diagram of test procedure for

30、the quick heating method . 33 Figure E.2 Explanation diagram of test procedure for synchronous method 34 Figure E.3 Showing the wetting force (pull) of some solder pastes . 34 Figure E.4 Explanation diagram of the test procedure for the temperature profile method . 35 Table 1 Specification of the te

31、st jig plate for quick heating and synchronous method . 11 Table 2 Recommended test conditions of the quick heating and synchronous method for rectangular SMD 14 Table 3 Specification of the test jig plate of the temperature profile method . 20 Table 4 Recommended test conditions of the temperature

32、profile method for rectangular SMD . 21 4 60068-2-83 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste FOREWORD 1) The

33、 International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and

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42、 or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. International Standard IEC 60068-2-83 has been prep

43、ared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/975/FDIS 91/992/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the abov

44、e table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 60068-2-83 IEC:2011 5 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data r

45、elated to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 60068-2-83 IEC:2011 INTRODUCTION The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance with this

46、 document may involve the use of patents as indicated below. IEC takes no position concerning the evidence, validity and scope of patent rights. The holders of the patent rights have assured the IEC that they are willing to negotiate licences either free of charge or under reasonable and non-discrim

47、inatory terms and conditions with applicants throughout the world. In this respect, the statement of the holders of these patent rights are registered with IEC. Information may be obtained as indicated below. a) EU patent 0920488.4 “Synchronous test method for assessing soldering pastes” 1Gen3 Syste

48、ms LTD Unit B2 Armstrong Mall Farnborough GU14 0NR United Kingdom b) JP Patent 2630712 “Testing method of characteristics of solder paste and the equipment for the test” Malcom Co., Ltd 4-15-10 Honmachi, Shibuya-ku Tokyo, 151-0071 Japan c) Patent JP 3789041 “Solderability measuring apparatus” Patent

49、 JP 3552061 “Solderability tester and solderability test method” Patent JP 3498100 “Method and device for testing solderability and microcrucible for testing” Patent JP 3153884 “Measuring device for soldering performance of cream solder” Tarutin Kester Co., Ltd. 2-20-11 Yokokawa, Sumida-ku Tokyo, 130-0003 Japan d) Sony Corporation 1-7-1 Konan Minato-ku Tokyo 108-0075 Japan