IEC 60191-5-1997 Mechanical standardization of semiconductor devices - Part 5 Recommendations applying to integrated circuit packages using tape automated bondi.pdf

1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 601915 Deuximedition Secondedition 199704 Numroderfrence Referencenumber CEI/IEC601915:1997 Normalisationmcanique desdispositifssemiconducteurs Partie5: Recommandationsapplicablesauxbotiers transfertautomatissurbande(TAB) descircuitsintgrs Mechanic

2、alstandardization ofsemiconductordevices Part5: Recommendationsapplyingtointegrated circuitpackagesusingtapeautomated bonding(TAB)Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIestcons tammentrevuparlaCEIafinquilreflteltatactuelde latechnique. Desrenseignementsrelatifsladatede

3、reconfirmationde lapublicationsontdisponiblesauprsduBureauCentralde laCEI. Lesrenseignementsrelatifscesrvisions,ltablis sementdesditionsrvisesetauxamendementspeuvent treobtenusauprsdesComitsnationauxdelaCEIet danslesdocumentscidessous: BulletindelaCEI AnnuairedelaCEI Publiannuellement Cataloguedespu

4、blicationsdelaCEI Publiannuellementetmisjourrgulirement Terminologie Encequiconcernelaterminologiegnrale,lelecteurse reporteralaCEI50:VocabulaireElectrotechniqueInter national(VEI),quiseprsentesousformedechapitres sparstraitantchacundunsujetdfini.Desdtails completssurleVEIpeuventtreobtenussurdemande

5、 VoirgalementledictionnairemultilinguedelaCEI. Lestermesetdfinitionsfigurantdanslaprsentepubli cationonttsoittirsduVEI,soitspcifiquement approuvsauxfinsdecettepublication. Symbolesgraphiquesetlittraux Pourlessymbolesgraphiques,lessymboleslittrauxetles signesdusagegnralapprouvsparlaCEI,lelecteur con

6、sultera: laCEI27: Symboleslittrauxutiliseren lectrotechnique; laCEI417: Symbolesgraphiquesutilisables surlematriel.Index,relevetcompilationdes feuillesindividuelles; laCEI617: Symbolesgraphiquespourschmas; etpourlesappareilslectromdicaux, laCEI878: Symbolesgraphiquespour quipementslectriquesenpratiq

7、uemdicale. Lessymbolesetsignescontenusdanslaprsentepubli cationonttsoittirsdelaCEI27,delaCEI417,dela CEI617et/oudelaCEI878,soitspcifiquementapprouvs auxfinsdecettepublication. PublicationsdelaCEItabliesparle mmecomitdtudes Lattentiondulecteurestattiresurleslistesfigurantlafin decettepublication,quin

8、umrentlespublicationsdela CEIprparesparlecomitdtudesquiatablila prsentepublication. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthecontent reflectscurrenttechnology. Informationrelatingtothedateofthereconfirmationofthe publicationi

9、savailablefromtheIECCentralOffice. Informationontherevisionwork,theissueofrevised editionsandamendmentsmaybeobtainedfromIEC NationalCommitteesandfromthefollowingIEC sources: IECBulletin IECYearbook Publishedyearly CatalogueofIECpublications Publishedyearlywithregularupdates Terminology Forgeneralter

10、minology,readersarereferredtoIEC50: InternationalElectrotechnicalVocabulary (IEV),whichis issuedintheformofseparatechapterseachdealing withaspecificfield.FulldetailsoftheIEVwillbe suppliedonrequest.SeealsotheIECMultilingual Dictionary. Thetermsanddefinitionscontainedinthepresentpubli cationhaveeithe

11、rbeentakenfromtheIEVorhavebeen specificallyapprovedforthepurposeofthispublication. Graphicalandlettersymbols Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersarereferredto publications: IEC27: Lettersymbolstobeusedinelectrical technology; IEC417: Graphicalsymbolsforu

12、seon equipment.Index,surveyandcompilationofthe singlesheets; IEC617: Graphicalsymbolsfordiagrams; andformedicalelectricalequipment, IEC878:Graphicalsymbolsforelectromedical equipmentinmedicalpractice. Thesymbolsandsignscontainedinthepresentpublication haveeitherbeentakenfromIEC27,IEC417,IEC617 and/o

13、rIEC878,orhavebeenspecificallyapprovedforthe purposeofthispublication. IECpublicationspreparedbythesame technicalcommittee Theattentionofreadersisdrawntotheendpagesofthis publicationwhichlisttheIECpublicationsissuedbythe technicalcommitteewhichhaspreparedthepresent publication.NORME INTERNATIONALE C

14、EI IEC INTERNATIONAL STANDARD 601915 Deuximedition Secondedition 199704 Normalisationmcanique desdispositifssemiconducteurs Partie5: Recommandationsapplicablesauxbotiers transfertautomatissurbande(TAB) descircuitsintgrs Mechanicalstandardization ofsemiconductordevices Part5: Recommendationsapplyingt

15、ointegrated circuitpackagesusingtapeautomated bonding(TAB) W Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue CODEPRIX PRICECODE IEC1997Droitsdereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteniut ilise sousquelqueformequecesoitetparaucunpro

16、cd,lectronique oumcanique,ycomprislaphotocopieetlesmicrofilms,sans laccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilizedin anyformorbyanymeans,electronicormechanical,including photocopyingandmicrofilm,withoutpermissioninwritingfrom thepublisher. InternationalElectrotechnicalCommiss

17、ion 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CommissionElectrotechniqueInternationale InternationalElectrotechnicalCommission2 601915CEI:1997 SOMMAIRE Page AVANTPROPOS 4 INTRODUCTION . 6 Articles 1 Domainedapplication. 8 2 Termesetdfinitions

18、8 3 Descriptiondutransfertautomatiquesurbande(TAB) 10 4 Exigencesdimensionnelles. 10 4.1 Formatdufilm . 12 4.2 Lestrousdalignement. 12 4.3 Ladimensionducorps. 12 4.4 Motifsdesplotsdessai 14 4.5 Motifsdesconnexionsextrieures . 14 4.6 Nombremaximaldeconnexionsextrieures 14 5 Codesdevariation 16 6 Exig

19、encesrelativeslasoudureinterne(ILB)etlasoudureexterne(OLB) . 16 Figures .1 8 Tableaux . 30 Notesrelativesauxfiguresettableaux. 52 Annexes A RsumdesconfigurationsrecommandesdubotierTAB(formatsuper) 56 B RsumdesconfigurationsrecommandesdubotierTAB(formatwide) 58 C Numrotagedesconnexionsextrieures. 60

20、D Numrotagedesplotsdessai. 68601915IEC:1997 3 CONTENTS Page FOREWORD. 5 INTRODUCTION . 7 Clause 1 Scope. 9 2 Termsanddefinitions . 9 3 Descriptionoftapeautomatedbonding(TAB) . 11 4 Dimensionalrequirements 11 4.1 Filmformat 13 4.2 Alignmentholes . 13 4.3 Bodysize. 13 4.4 Testpadpatterns. 15 4.5 Outer

21、leadpatterns 15 4.6 Maximumleadcount 15 5 Variationcodes. 17 6 Requirementsforinnerandouterleadbonding(ILBandOLB) 17 Figures .1 9 Tables . 31 Notestofiguresandtables 53 Annexes A SummaryofrecommendedTABpackageconfigurations(superformat) 57 B SummaryofrecommendedTABpackageconfigurations(wideformat) 5

22、9 C Outerleadnumbering . 61 D Testpadnumbering 694 601915CEI:1997 COMMISSIONLECTROTECHNIQUEINTERNATIONALE _ NORMALISATIONMCANIQUEDESDISPOSITIFSSEMICONDUCTEURS Partie5:Recommandationsapplicablesauxbotierstransfert automatissurbande(TAB)descircuitsintgrs AVANTPROPOS 1) LaCEI(CommissionElectrotechnique

23、Internationale)estuneorganisationmondialedenormalisationcompose delensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIapourobjetde favoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdanslesdomainesde llectricitetdellectronique.Aceteffet,laCEI,entreautresacti

24、vits,publiedesNormesInternationales. Leurlaborationestconfiedescomitsdtudes,auxtravauxdesquelstoutComitnationalintressparle sujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementalesetnongouvernementales,en liaisonaveclaCEI,participentgalementauxtravaux.LaCEIcollaboretroitementaveclOr

25、ganisation InternationaledeNormalisation(ISO),selondesconditionsfixesparaccordentrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniques,reprsentent,danslamesure dupossibleunaccordinternationalsurlessujetstudis,tantdonnquelesComitsnationauxintresss sontreprsen

26、tsdanschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententsouslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationauxdelaCEIsengagentappliquerde faontranspa

27、rente,danstoutelamesurepossible,lesNormesinternationalesdelaCEIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormedelaCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernantlemarquagecommeindicationdapprobationet

28、saresponsabilit nestpasengagequandunmatrielestdclarconformelunedesesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour responsabledenepasavoiridentifidetelsdroitsdep

29、ropritetdenepasavoirsignalleurexistence. LaNormeinternationaleCEI601915attablieparlesouscomit47D:Normalisation mcaniquedesdispositifssemiconducteurs,ducomitdtudes47delaCEI:Dispositifs semiconducteurs. Cettedeuximeditionannuleetremplacelapremireditionparueen1987etconstitueune rvisiontechnique. Letext

30、edecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 47D/107/FDIS 47D/158/RVD Lerapportdevoteindiqudansletableaucidessusdonnetouteinformationsurlevoteayant aboutilapprobationdecettenorme. LesannexesA,B,CetDsontdonnesuniquementtitredinformation.601915IEC:1997 5 INTERNATIONALELECTROTECHNICALCO

31、MMISSION _ MECHANICALSTANDARDIZATIONOFSEMICONDUCTORDEVICES Part5:Recommendationsapplyingtointegratedcircuit packagesusingtapeautomatedbonding(TAB) FOREWORD 1) TheIEC(InternationalElectrotechnicalCommission)isaworldwideorganizationforstandardizationcomprising allnationalelectrotechnicalcommittees(IEC

32、NationalCommittees).TheobjectoftheIECistopromote internationalcooperationonallquestionsconcerningstandardizationintheelectricalandelectronicfields.To thisendandinadditiontootheractivities,theIECpublishesInternationalStandards.Theirpreparationis entrustedtotechnicalcommittees;anyIECNationalCommitteei

33、nterestedinthesubjectdealtwithmay participateinthispreparatorywork.International,governmentalandnongovernmentalorganizationsliaising withtheIECalsoparticipateinthispreparation.TheIECcollaboratescloselywiththeInternationalOrganization forStandardization(ISO)inaccordancewithconditionsdeterminedbyagree

34、mentbetweenthetwo organizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCommittees. 3) Thedocumentsproducedhavetheformofrecommen

35、dationsforinternationaluseandarepublishedintheform ofstandards,technicalreportsorguidesandtheyareacceptedbytheNationalCommitteesinthatsense. 4) Inordertopromoteinternationalunification,IECNationalCommitteesundertaketoapplyIECInternational Standardstransparentlytothemaximumextentpossibleintheirnation

36、alandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandardshallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingproceduretoindicateitsapprovalandcannotberenderedresponsibleforany equipmentdeclaredtobeinconformitywithoneofitsstandards. 6) Attentio

37、nisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethesubject ofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. InternationalStandardIEC601915hasbeenpreparedbysubcommittee47D:Mechanical standardizationofsemiconductordevices,ofIECtechnical

38、committee47:Semiconductor devices. Thissecondeditioncancelsandreplacesthefirsteditionpublishedin1987andconstitutesa technicalrevision. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 47D/107/FDIS 47D/158/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundint

39、hereporton votingindicatedintheabovetable. AnnexesA,B,CandDareforinformationonly.6 601915CEI:1997 INTRODUCTION Lesrecommandationscontenuesdanslaprsentenormecouvrentlesexigencespourles bandesaveccircuitsintgrs(IC)soudstellesquefourniesparunfabricantunutilisateur. Ellesnesontpasdestinesuneutilisations

40、trictementinterneduneentreprise,telleque lemploiduTABentantqutapedansleprocessusdefabricationdesbotiersQFPoudautres botiers. Lesvaleursdesdimensionsoulesexigencesspcifiesdanscettenormepourlalargeurdes bandes,lesperforationsdentranement,lesplotsdessaioulesconnexionsextrieures,etc. correspondentltatde

41、latechnologieladatedepublicationdecettenorme.Les dimensionsrelativeslalargeurdesbandesetauxperforationsdentranementdriventde cellesquisontnormalisespourlesfilmscinmatographiques.Cettenormeneprtendpas dfinirlespossibilitsfuturesdecettetechnologie.Lesprogrsquiinterviendrontdansla technologiedelassembl

42、agedescircuitsintgrspourrontconduire,danslefutur, recommanderlanormalisationdedimensionsnouvellesousupplmentaires.601915IEC:1997 7 INTRODUCTION Therecommendationscontainedinthisstandardcovertherequirementsfortapewithbonded integratedcircuits(IC)assuppliedbyamanufacturertoauser.Theyarenotintendedto governstrictlyinternalusagebyacompanysuchastheuseofTABasonestepinthe manufactureofQFPorotherpackages. Dimensionalvaluesorrequirementsgiveninthisstandardfortapewidth,sprocketholes,tes