IEC 60748-2-7-1992 Semiconductor devices integrated circuits part 2 digital integrated circuits section 7 blank detail specification for integrated circuit fusi.pdf

1、NORME INTERNATIONALE INTERNATIONAL STANDARD CE1 IEC 748-2-7 QC 7901 05 Premire dition First edition 1 992-1 O Dispo sit ifs se mico nd u ct eu rs Circuits intgrs Deuxime partie: Circuits in tgrs n umriques Section sept - Spcification particulire cadre pour les mmoires bipolaires lecture seule progra

2、mmables par fusion circuits intgrs Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section seven - Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories Numro de rfrence Reference number CEMEC 748-2-7: 1992 Numros des pub

3、lications Depuis le ler janvier 1997, les publications de la CE! sont numrotes partir de 60000. Publications consolides Les versions consolides de certaines publications de la CE1 incorporant les amendements sont disponibles. Par exemple, les numros ddition 1.0, 1.1 et 1.2 indiquent respectivement l

4、a publication de base, la publication de base incorporant lamendement 1, et la publication de base incorporant les amendements 1 et 2. Validit de la prsente publication Le contenu technique des publications de la CE1 est constamment revu par la CE1 afin quil reflte ltat actuel de la technique. Des r

5、enseignements relatifs la date de reconfir- mation de la publication sont disponibles dans le Catalogue de la CEI. Les renseignements relatifs i des questions ltude et des travaux en c-Urs entrepris par le comit technique qui a tabli cette publication, ainsi que la liste des publications tablies, se

6、 trouvent dans les documents ci- dessous: Site web de la CEI* Catalogue des publications de la CE1 Publi annuellement et mis a jour rgulirement (Catalogue en ligne) Bufietin de la CE1 Disponible la fois JU -site web de la CEI et comme priodique imprim Terminologie, symboles graphiques et littraux En

7、 ce qui concerne la terminologie gnrale, le lecteur se reportera la CE1 60050: Vocabulaire Electro- technique International (VEI). Pour les symboles graphiques, les symboles littraux et les signes d sage gnral approuvs par la CEI, le lecteur consulter2 la CE1 60027: Symboles littraux a utiliser en l

8、ectrotechnique, la CE1 6041 7: Symboles graphiques utilisables sur le matriel. Index, releve el compilation des feuilles individuelles, et la CE1 60617: Symboles graphiques pour schmas. * Voir adresse . sur la page de titre. Numbering As from 1 January 1997 all IEC publications are issued with a des

9、ignation in the 60000 series. Consolidated publications Consolidated versions of some IEC publications including amendments are available. For example, edition numbers 1 .O, 1.1 and 1.2 refer, respectively, to the base publication. the base publication incor- porating amendment 1 and the base public

10、ation incorporating amendments 1 and 2. Validity of this publication The technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to the date of the reconfirmation of the publication is available

11、in the IEC catalogue. Information on the subjects under consideration and work in progress undertaken by the technical committee which has prepared this publication, as well as the list of publications issued, is to be found at the following IEC sources: IEC web site* Catalogue of IEC publications P

12、ublished yearly with regular updates (On-line catalogue) Available both at the IEC web site and as a printed periodical IEC Bulletin Terminology, graphical and letter symbols For general terminology, readers are referred to IEC 60050: International Electrotechnical Vocabulary (IEV). For graphical sy

13、mbols, and letter symbols and signs approved by the IEC for general use, readers are referred to publications IEC 60027: Letter symbols to be used in electrical technology, IEC 60417: Graphical symbols for use on equipment. Index, survey and compilation of the single sheets and IEC 60617: Graphical

14、symbols for diagrams. * See web site address on title page. NORME INTERNATIONALE INTERNATIONAL STANDARD CE1 IEC 748-2-7 QC 7901 05 Prerpire dition First edition 1992-1 O Dispositifs serniconducteu rs Circuits intgrs Deuxime partie: Circuits intgrs numriques Section sept - Spcification particulire ca

15、dre pour les mmoires bipolaires lecture seule programmables par fusion circuits intgrs Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section seven - Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories 0 CE1 1992 Droit

16、s de reproduction rservs - Copyright - all rights reserved Auaine partie de cette publication ne peut elle doit tre utilise avec les publications suivantes de la CEI: 747-1 OIQC 700000: Dispositifs semiconducteurs - Dixime partie: Spcification gn- rique pour les dispositifs discrets et les circuits

17、intgrs. 748-1 11QC 7901 00: Dispositifs semiconducteurs. Circuits intgrs. Onzime partie: Spcification intermdiaire pour les circuits intgrs semiconducteurs lexclusion des hybrides. Renseignements ncessaires Les nombres placs entre crochets sur cette page et les pages suivantes correspondent aux indi

18、cations suivantes qui doivent tre portes dans les cases prvues A cet effet. Identification de la spcification particulire l Nom de lorganisme National de Normalisation sous lautorit duquel la spcification particulire est tablie. 2 Numro IECQ de la spcification particulire. 3 Numros de rfrence et ddi

19、tion des spcifications gnrique et intermdiaire. 4 Numro national de la spcification particulire, date ddition et toute autre information requise par le systme national. Identification du composant 5 6 Fonction principale et numro de type. Renseignements sur la construction typique (matriaux, technol

20、ogie principale) et le botier. Si les produits ont des variantes, elles doivent tre indiques ainsi que leurs caractristiques. 748-2-7 O IEC -7- SEMICONDUCTOR DEVICES Integrated circuits Part 2: Digital integrated circuits Section seven - Blank detail specification for integrated circuit fusible-link

21、 programmable bipolar read-only memories INTRODUCTION The IEC Quality Assessment System for Electronic Components is operated in accordance with the statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that elec

22、tronic components released by one participating country as conforming with the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing. This blank detail specification is one of a series of blank detail specificatio

23、ns for semi- conductor devices and shall be used with the following IEC Publications: 747-1 O/QC 700000: Semiconductor devices. Part 1 O: Generic specification for discrete devices and integrated circuits. 748-1 1 /QC 7901 00: Semiconductor devices. Integrated circuits. Part 1 I: Sectional speci- fi

24、cation for semiconductor integrated circuits excluding hybrid circuits. Required information Numbers shown in brackets on this and the following pages correspond to the following items of required information, which should be entered in the spaces provided. Identification of the detail specification

25、 l 2 3 4 The name of the National Standards Organization under whose authority the detail specification is issued. The IECQ number of the detail specification. The numbers and issue numbers of the generic and sectional specifications. The national number of the detail specification, date of issue an

26、d any further infor- mation, if required by the national system. Identification of the component 5 Main function and type number. 6 Information on typical construction (materials, the main technology) and the package. If applicable, variants of the products shall be given here together with the variant characteristics.