IEC 60749-28-2017 Semiconductor devices - Mechanical and climatic test methods - Part 28 Electrostatic discharge (ESD) sensitivity testing - Charged device mode.pdf

1、 IEC 60749-28 Edition 1.0 2017-03 INTERNATIONAL STANDARD Semiconductor devices Mechanical and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing Charged device model (CDM) device level IEC 60749-28:2017-03(en) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyri

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10、7, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 60749-28 Edition 1.0 2017-03 INTERNATIONAL STANDARD Semiconductor devices Mechanical

11、and climatic test methods Part 28: Electrostatic discharge (ESD) sensitivity testing Charged device model (CDM) device level INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.080.01 ISBN 978-2-8322-4139-4 Registered trademark of the International Electrotechnical Commission Warning! Make sure that yo

12、u obtained this publication from an authorized distributor. colour inside 2 IEC 60749-28:2017 IEC 2017 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms and definitions 8 4 Required equipment 9 4.1 CDM ESD tester . 9 4.1.1 General . 9 4.1.2 Current-sensing element 10

13、4.1.3 Ground plane . 10 4.1.4 Field plate/field plate dielectric layer 10 4.1.5 Charging resistor . 11 4.2 Waveform measurement equipment 11 4.2.1 General . 11 4.2.2 Cable assemblies 11 4.2.3 Equipment for high-bandwidth waveform measurement . 11 4.2.4 Equipment for 1,0 GHz waveform measurement 11 4

14、3 Verification modules (metal discs) . 11 4.4 Capacitance meter 11 4.5 Ohmmeter . 12 5 Periodic tester qualification, waveform records, and waveform verification requirements . 12 5.1 Overview of required CDM tester evaluations 12 5.2 Waveform capture hardware . 12 5.3 Waveform capture setup . 12 5

15、4 Waveform capture procedure 12 5.5 CDM tester qualification/requalification procedure 13 5.5.1 CDM tester qualification/requalification procedure . 13 5.5.2 Conditions requiring CDM tester qualification/requalification 13 5.5.3 1 GHz oscilloscope correlation with high bandwidth oscilloscope . 14 5

16、6 CDM tester quarterly and routine waveform verification procedure 14 5.6.1 Quarterly waveform verification procedure . 14 5.6.2 Routine waveform verification procedure . 14 5.7 Waveform characteristics 14 5.8 Documentation 16 5.9 Procedure for evaluating full CDM tester charging of a device 16 6 C

17、DM ESD testing requirements and procedures 17 6.1 Device handling 17 6.2 Test requirements . 17 6.2.1 Test temperature and humidity 17 6.2.2 Device test 17 6.3 Test procedures 17 6.4 CDM test recording / reporting guidelines . 18 7 CDM classification criteria . 18 Annex A (normative) Verification mo

18、dule (metal disc) specifications and cleaning guidelines for verification modules and testers 19 IEC 60749-28:2017 IEC 2017 3 A.1 Tester verification modules and field plate dielectric . 19 A.2 Care of verification modules 19 Annex B (normative) Capacitance measurement of verification modules (metal

19、 discs) sitting on a tester field plate dielectric . 20 Annex C (informative) CDM test hardware and metrology improvements 21 Annex D (informative) CDM tester electrical schematic 23 Annex E (informative) Sample oscilloscope setup and waveform . 24 E.1 General . 24 E.2 Settings for the 1 GHz bandwid

20、th oscilloscope 24 E.3 Settings for the high-bandwidth oscilloscope . 24 E.4 Setup 24 E.5 Sample waveforms from a 1 GHz oscilloscope 24 E.6 Sample waveforms from an 8 GHz oscilloscope 25 Annex F (informative) Field-induced CDM tester discharge procedures 27 F.1 General . 27 F.2 Single discharge proc

21、edure . 27 F.3 Dual discharge procedure . 27 Annex G (informative) Waveform verification procedures . 29 G.1 Factor/offset adjustment method . 29 G.2 Software voltage adjustment method. 32 G.3 Example parameter recording tables . 34 Annex H (informative) Determining the appropriate charge delay for

22、full charging of a large module or device 36 H.1 General . 36 H.2 Procedure for charge delay determination . 36 Annex I (informative) Electrostatic discharge (ESD) sensitivity testing direct contact charged device model (DC-CDM) 38 I.1 General . 38 I.2 Standard test module 38 I.3 Test equipment (CDM

23、 simulator) . 38 I.3.1 Test equipment design. 38 I.3.2 DUT (device under test) support 38 I.3.3 Metal bar/board . 39 I.3.4 Equipment setup 39 I.4 Verification of test equipment 39 I.4.1 General description of verification test equipment 39 I.4.2 Instruments for measurement 41 I.4.3 Verification of t

24、est equipment, using a current probe . 41 I.5 Test procedure 42 I.5.1 Initial measurement . 42 I.5.2 Tests . 42 I.5.3 Intermediate and final measurement 43 I.6 Failure criteria . 43 I.7 Classification criteria . 43 I.8 Summary 43 Bibliography 44 Figure 1 Simplified CDM tester hardware schematic 10 4

25、 IEC 60749-28:2017 IEC 2017 Figure 2 CDM characteristic waveform and parameters . 16 Figure D.1 Simplified CDM tester electrical schematic . 23 Figure E.1 1 GHz TC 500, small verification module 25 Figure E.2 1 GHz TC 500, large verification module . 25 Figure E.3 8 GHz TC 500, small verification mo

26、dule (oscilloscope adjusts for attenuation) 26 Figure E.4 GHz TC 500, large verification module (oscilloscope adjusts for attenuation) 26 Figure F.1 Single discharge procedure (field charging, I CDMPulse, and slow discharge) . 27 Figure F.2 Dual discharge procedure (field charging, 1st I CDMpulse, n

27、o field, 2nd I CDMpulse) . 28 Figure G.1 An example of a waveform verification flow for qualification and quarterly checks using the factor/offset adjustment method . 30 Figure G.2 An example of a waveform verification flow for the routine checks using the factor/offset adjustment method 31 Figure G

28、3 Example of average I peakfor the large verification module high bandwidth oscilloscope . 32 Figure G.4 An example of a waveform verification flow for qualification and quarterly checks using the software voltage adjustment method 33 Figure G.5 An example of a waveform verification flow for the ro

29、utine checks using the software voltage adjustment method . 34 Figure H.1 An example characterization of charge delay vs. I p37 Figure I.1 Examples of discharge circuit where the discharge is caused by closing the switch . 39 Figure I.2 Verification test equipment for measuring the discharge current

30、 flowing to the metal bar/board from the standard test module . 40 Figure I.3 Current waveform. 40 Figure I.4 Measurement circuit for verification method using a current probe . 41 Table 1 CDM waveform characteristics for a 1 GHz bandwidth oscilloscope . 15 Table 2 CDM waveform characteristics for a

31、 high-bandwidth ( 6 GHz) oscilloscope 15 Table 3 CDM ESDS device classification levels . 18 Table A.1 Specification for CDM tester verification modules (metal discs) 19 Table G.1 Example waveform parameter recording table for the factor/offset adjustment method . 35 Table G.2 Example waveform parame

32、ter recording table for the software voltage adjustment method . 35 Table I.1 Dimensions of the standard test modules 38 Table I.2 Specified current waveform . 40 Table I.3 Range of peak current I p1for test equipment 41 Table I.4 Specification of peak current I p1for the current probe verification

33、method 42 IEC 60749-28:2017 IEC 2017 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 28: Electrostatic discharge (ESD) sensitivity testing Charged device model (CDM) device level FOREWORD 1) The International Electrotechnical Commission (

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44、be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-28 has been prepared by IEC technical committee 47: Semiconductor devices in collaboration with IEC technical committee 101: Electrostatics. This standar

45、d is based on ESDA/JEDEC Joint Standard ANSI/ESDA/JEDEC JS-002 which resulted from the merging of JESD22-C101 and ANSI/ESD S5.3.1). It contains the essential elements from both standards. The co-operation of ANSI/ESDA/JEDEC is gratefully acknowledged. 6 IEC 60749-28:2017 IEC 2017 The text of this In

46、ternational Standard is based on the following documents: FDIS Report on voting 47/2362/FDIS 47/2379/RVD Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has been drafted in accordance with

47、 the ISO/IEC Directives, Part 2. A list of all parts in the IEC 60749 series, published under the general title Semiconductor devices Mechanical and climatic test methods, can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the st

48、ability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT

49、 The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC 60749-28:2017 IEC 2017 7 INTRODUCTION The earliest electrostatic discharge (ESD) test models and standards simulate a charged object approaching a device and discharging through the device. T