IEC 61188-5-8-2007 Printed boards and printed board assemblies - Design and use - Part 5-8 Attachment (land joint) considerations - Area array components (BGA F.pdf

1、 IEC 61188-5-8 Edition 1.0 2007-10 INTERNATIONAL STANDARD NORME INTERNATIONALE Printed board and printed board assemblies Design and use Part 5-8: Attachment (land/joint) considerations Area array components (BGA, FBGA, CGA, LGA) Cartes imprimes et cartes imprimes quipes Conception et utilisation Pa

2、rtie 5-8: Considrations sur les liaisons pastilles/joints Composants matriciels (BGA, FBGA, CGA, LGA) IEC 61188-5-8:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or u

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17、 printed board assemblies Design and use Part 5-8: Attachment (land/joint) considerations Area array components (BGA, FBGA, CGA, LGA) Cartes imprimes et cartes imprimes quipes Conception et utilisation Partie 5-8: Considrations sur les liaisons pastilles/joints Composants matriciels (BGA, FBGA, CGA,

18、 LGA) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE V ICS 31.180 PRICE CODE CODE PRIX ISBN 2-8318-1075-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 61188-5-8 IEC:2007 CON

19、TENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 General information8 3.1 General component description .8 3.2 Marking .8 3.3 Carrier packaging format.9 3.4 Process considerations .9 4 BGA (square) .9 4.1 Field of application 9 4.2 Component descriptions9 4.2.1 Basic constructio

20、n .9 4.2.2 Termination materials 10 4.2.3 Marking .11 4.2.4 Carrier package format11 4.2.5 Process considerations11 4.3 Component dimensions (square) .11 4.3.1 PBGA 1,5 mm pitch component dimensions (square).12 4.3.2 PBGA 1,27 mm pitch component dimensions (square).14 4.3.3 PBGA 1,00 mm pitch compon

21、ent dimensions (square).15 4.4 Solder joint fillet design .17 4.4.1 Solder joint fillet design Non-collapsing, collapsing (level 3) .17 4.5 Land pattern dimensions .18 4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square) .19 4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square) .21 4.5.3 PBG

22、A 1,00 mm pitch land pattern dimensions (square) .23 5 FBGA (square) .25 6 BGA (rectangular) 25 6.1 Field of application 25 6.2 Component descriptions25 6.2.1 Basic construction .25 6.2.2 Termination materials 25 6.2.3 Marking .26 6.2.4 Carrier package format26 6.2.5 Process considerations26 6.3 Com

23、ponent dimensions (rectangular) 26 6.4 Solder joint fillet design .27 6.4.1 Solder joint fillet design Collapsing (level 3) .27 6.4.2 Land approximation .28 6.4.3 Total variation .28 6.5 Land pattern dimensions .28 7 FBGA (rectangular) 29 8 CGA .29 9 LGA29 Bibliography30 61188-5-8 IEC:2007 3 Figure

24、1 Area array land pattern configuration .7 Figure 2 BGA physical configuration examples 10 Figure 3 High land and eutectic solder ball and joint comparison .10 Figure 4 BGA (square).11 Figure 5 General BGA dimensional characteristics.12 Figure 6 Solder joint fillet design18 Figure 7 BGA (square) lan

25、d pattern dimensions.19 Table 1 Ball diameter sizes8 Table 2 BGA products with pitch of 1,5 mm13 Table 3 BGA products with pitch of 1,27 mm14 Table 4 BGA products with pitch of 1,0 mm16 Table 5 BGA product land patterns with pitch of 1,50 mm 20 Table 6 BGA product land patterns with pitch of 1,27 mm

26、 22 Table 7 BGA product land patterns with pitch of 1,00 mm 24 Table 8 Rectangular BGA products with pitch of 1,27 mm 27 Table 9 Rectangular BGA product land patterns with pitch of 1,27 mm.29 4 61188-5-8 IEC:2007 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PRINTED BOARD AND PRINTED BOARD ASSEMBLIES

27、DESIGN AND USE Part 5-8: Attachment (land/joint) considerations Area array components (BGA, FBGA, CGA, LGA) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). T

28、he object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Speci

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34、s not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they ha

35、ve the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whats

36、oever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publica

37、tions is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Stand

38、ard IEC 61188-5-8 has been prepared by IEC technical committee 91: Electronics assembly technology. This bilingual version, published in 2010-01, corresponds to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/705/FDIS 91/737/RVD Full infor

39、mation on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. 61188-5-8 IEC:2007 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 61188-5

40、-8 is to be read in conjunction with IEC 61188-5-1. A list of all parts of the IEC 61188 series, under the general title Printed boards and printed board assemblies Design and use, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged

41、until the maintenance result date0F indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page

42、 of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 61188-5-8 IEC:2007 INTRODUCTION This part of IEC 61188 covers land patterns for area array com

43、ponents which include ball grid array (BGA) parts (rigid, flexible or ceramic substrate); fine pitch ball grid array (FBGA) parts (rigid or flexible substrate); column grid array (CGA) parts (ceramic substrates) and land grid array (LGA) parts (ceramic substrates). Each clause contains information i

44、n accordance with the area array family of components and their requirements for appropriate land patterns. The proposed land pattern dimensions in this standard are based upon the fundamental tolerance calculation combined with the given land geometries and courtyard excesses (see IEC 61188-5-1, Ge

45、neric requirements). The courtyard includes all issues of the normal manufacturing necessities. The unaltered land pattern dimensions of this part are generally applicable for the solder paste application plus the reflow soldering process. Although other standards in the IEC 61188-5 series define th

46、ree levels of land pattern dimensioning, this standard will only define two levels. One level (level 2) is for non collapsing BGA balls; the other level (level 3) is for those BGA components where the ball does collapse around the land. All land descriptions are non-solder mask defined. Each land pa

47、ttern has been assigned an identification number to indicate the characteristics of the specific robustness of the land patterns. Users also have the opportunity to organize the information so that it is most useful for their particular design. If a user has good reason to use a concept different fr

48、om that of IEC 61188-5-1, or if the user prefers unusual land geometries, this standard should be used for checking the resulting ball to land relationship. It is the responsibility of the user to verify the SMD land patterns used for achieving an undisturbed mounting process including testing and a

49、n ensured reliability for the product stress conditions in use. In addition, the size and shape of the proposed land pattern may vary according to the solder resist aperture, the size of the land pattern extension (dog bone), the via within the extension, or if the via is in the land pattern itself. Dimensions of the components listed in this standard are of those ava