IEC 61189-6-2006 Test methods for electrical materials interconnection structures and assemblies - Part 6 Test methods for materials used in electronic assembli.pdf

1、 IEC 61189-6Edition 1.0 2006-07INTERNATIONAL STANDARD NORME INTERNATIONALETest methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies Mthodes dessai pour les matriaux lectriques, les structures dinter

2、connexion et les ensembles Partie 6: Mthodes dessai des matriaux utiliss dans la fabrication des assemblages lectroniques IEC61189-6:2006 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2006 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may b

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15、 termes lectroniques et lectriques. Il contient plus de 20 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans les langues additionnelles. Egalement appel Vocabulaire Electrotechnique International en ligne. Service Clients: www.iec.ch/webstore/custserv/custserv_e

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17、methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies Mthodes dessai pour les matriaux lectriques, les structures dinterconnexion et les ensembles Partie 6: Mthodes dessai des matriaux utiliss dans l

18、a fabrication des assemblages lectroniques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE XICS 31.180 PRICE CODECODE PRIXISBN 2-8318-9716-5 2 61189-6 IEC:2006 CONTENTS FOREWORD.4 INTRODUCTION.6 1 Scope.7 2 Normative references .7 3 Accuracy, precision and resolu

19、tion .7 3.1 Accuracy .8 3.2 Precision .8 3.3 Resolution.9 3.4 Report .9 3.5 Students “t“ distribution 9 3.6 Suggested uncertainty limits10 4 Catalogue of approved test methods 11 5 P: Preparation/conditioning test methods11 6 V: Visual test methods11 7 D: Dimensional test methods 11 8 C: Chemical te

20、st methods.11 8.1 Test 6C01: Determination of acid value of liquid soldering flux Potentiometric and visual titration methods .11 8.2 Test 6C02: Determination of halides in fluxes, silver chromate method14 8.3 Test 6C03: Solids content, flux16 8.4 Test 6C04: Quantitative determination of halide cont

21、ent in fluxes (chloride and bromide).17 8.5 Test 6C05: Qualitative analysis of fluorides and fluxes by spot test .22 8.6 Test 6C06: Quantitative determination of fluoride concentration in fluxes 23 8.7 Test 6C07: Acid number of rosin .26 8.8 Test 6C08: Specific gravity26 8.9 Test 6C09: Determination

22、 of the percentage of flux on/in flux-coated and/or flux-cored solder .27 8.10 Test 6C10: Flux induced corrosion (copper mirror method)28 9 M: Mechanical test methods .30 10 E: Electrical test methods.30 11 N: Environmental test methods.30 12 X: Miscellaneous test methods .31 12.1 Test 6X01: Determi

23、nation of solder powder particle size distribution Screen method for types 1-4 .31 12.2 Test 6X02: Solder powder particle size distribution Measuring microscope method33 12.3 Test 6X03: Solder powder particle size distribution Optical image analyser method34 12.4 Test 6X04: Solder powder particle si

24、ze distribution Measuring laser diffraction method36 12.5 Test 6X05: Determination of maximum solder powder particle size37 12.6 Test 6X06: Solder paste metal content by weight 39 61189-6 IEC:2006 3 Figure 1 Chlorides and/or bromides test results .16 Figure 2 Test equipment of specific gravity (hydr

25、ometer reading).26 Figure 3 Flux type classification by copper mirror test30 Table 1 Students “t“ distribution 10 Table 2 Relation between halide content and mass of specimen 20 Table 3 Mixing ratio from specimen size to water quantity23 Table 4 Specimen size to chloroform mixture.24 Table 5 Screen

26、opening .32 Table 6 Portions of particle sizes by weight % nominal values 32 Table 7 Powder particle size distribution record .32 Table 8 Powder particle size distribution record .34 Table 9 Powder particle size distribution record (optical analysis)36 Table 10 Powder particle size distribution reco

27、rd .37 Table 11 Acceptance of powders by particle sizes .38 Table 12 Test report on solder paste39 Table 13 Test report on solder paste41 4 61189-6 IEC:2006 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 6: Test metho

28、ds for materials used in manufacturing electronic assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co

29、-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred

30、to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this

31、 preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

32、 consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable eff

33、orts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publicat

34、ions transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and

35、 cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts a

36、nd members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Public

37、ation or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Public

38、ation may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61189-6 has been prepared by IEC technical committee 91: Electronic assembly technology. This bilingual version, published in 2008-05, corresponds to

39、 the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/593/FDIS 91/610/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard ha

40、s not been voted upon. 61189-6 IEC:2006 5 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. This standard should be used in conjunction with the following parts of IEC 61189, under the main title Test methods for electrical materials, interconnection structures and

41、 assemblies: Part 1: General test methods and methodology Part 2: Test methods for materials for interconnection structures Part 3: Test methods for interconnection structures (printed boards) Part 4: Test methods for electronic components assembling characteristics (under consideration) Part 5: Tes

42、t methods for printed board assemblies and also the following standard: IEC 60068 series: Environmental testing The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the d

43、ata related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 61189-6 IEC:2006 INTRODUCTION IEC 61189 relates to test methods for printed boards and printed board assemblies, as well as related materials or compone

44、nt robustness, irrespective of their method of manufacture. The IEC 61189 series is divided into separate parts, covering information for the designer and the test methodology engineer or technician. Each part has a specific focus; methods are grouped according to their application and numbered sequ

45、entially as they are developed and released. In some instances test methods developed by other TCs (e.g. TC 104) have been reproduced from existing IEC standards in order to provide the reader with a comprehensive set of test methods. When this situation occurs, it will be noted on the specific test

46、 method; if the test method is reproduced with minor revision, those paragraphs that are different are identified. This part of IEC 61189 contains test methods for evaluating materials used in manufacturing electronic assemblies. The methods are self-contained, with sufficient detail and description

47、 so as to achieve uniformity and reproducibility in the procedures and test methodologies. The tests shown in this standard are grouped according to the following principles: P: preparation/conditioning methods V: visual test methods D: dimensional test methods C: chemical test methods M: mechanical

48、 test methods E: electrical test methods N: environmental test methods X: miscellaneous test methods To facilitate reference to the tests, to retain consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (grou

49、p code) letter showing the group to which the test method belongs. The test method numbers have no significance with respect to an eventual test sequence; that responsibility rests with the relevant specification that calls for the method being performed. The relevant specification, in most instances, also describes pass/fail criterion. The letter and number combinations are for re