IEC 61249-8-8-1997 Materials for interconnection structures - Part 8 Sectional specification set for non-conductive films and coatings - Section 8 Temporary pol.pdf

1、NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 6124988 Premiredition Firstedition 199706 Matriauxpourlesstructuresdinterconnexion Partie8: Collectiondespcificationsintermdiairespour lesfilmsetrevtementsnonconducteurs Section8:Revtementsamoviblesdepolymre Materialsforinterconnectionstructures Pa

2、rt8: Sectionalspecificationsetfornonconductive filmsandcoatings Section8:Temporarypolymercoatings Numroderfrence Referencenumber CEI/IEC6124988:1997Validitdelaprsentepublication LecontenutechniquedespublicationsdelaCEIest constammentrevuparlaCEIafinquilreflteltat actueldelatechnique. Desrenseignemen

3、tsrelatifsladatede reconfirmationdelapublicationsontdisponibles auprsduBureauCentraldelaCEI. Lesrenseignementsrelatifscesrvisions, ltablissementdesditionsrvisesetaux amendementspeuventtreobtenusauprsdes ComitsnationauxdelaCEIetdanslesdocuments cidessous: BulletindelaCEI AnnuairedelaCEI Publiannuelle

4、ment CataloguedespublicationsdelaCEI Publiannuellementetmisjourrgulirement Terminologie Encequiconcernelaterminologiegnrale,lelecteur sereporteralaCEI60050: Vocabulaire ElectrotechniqueInternational(VEI),quiseprsente sousformedechapitressparstraitantchacundun sujetdfini.DesdtailscompletssurleVEIpeuv

5、ent treobtenussurdemande.Voirgalementle dictionnairemultilinguedelaCEI. Lestermesetdfinitionsfigurantdanslaprsente publicationonttsoittirsduVEI,soit spcifiquementapprouvsauxfinsdecette publication. Symbolesgraphiquesetlittraux Pourlessymbolesgraphiques,lessymboleslittraux etlessignesdusagegnralappro

6、uvsparlaCEI,le lecteurconsultera: laCEI60027: Symboleslittrauxutiliseren lectrotechnique; laCEI60417: Symbolesgraphiquesutilisablessur lematriel.Index,relevetcompilationdesfeuilles individuelles; laCEI60617: Symbolesgraphiquespourschmas; etpourlesappareilslectromdicaux, laCEI60878: Symbolesgraphique

7、spour quipementslectriquesenpratiquemdicale. Lessymbolesetsignescontenusdanslaprsente publicationonttsoittirsdelaCEI60027,dela CEI60417,delaCEI60617et/oudelaCEI60878, soitspcifiquementapprouvsauxfinsdecette publication. PublicationsdelaCEItabliesparle mmecomitdtudes Lattentiondulecteurestattiresurle

8、slistesfigurant lafindecettepublication,quinumrentles publicationsdelaCEIprparesparlecomit dtudesquiatablilaprsentepublication. Validityofthispublication ThetechnicalcontentofIECpublicationsiskeptunder constantreviewbytheIEC,thusensuringthatthe contentreflectscurrenttechnology. Informationrelatingto

9、thedateofthereconfirmation ofthepublicationisavailablefromtheIECCentral Office. Informationontherevisionwork,theissueofrevised editionsandamendmentsmaybeobtainedfromIEC NationalCommitteesandfromthefollowingIEC sources: IECBulletin IECYearbook Publishedyearly CatalogueofIECpublications Publishedyearl

10、ywithregularupdates Terminology Forgeneralterminology,readersarereferredto IEC60050:InternationalElectrotechnicalVocabulary (IEV),whichisissuedintheformofseparatechapters eachdealingwithaspecificfield.Fulldetailsofthe IEVwillbesuppliedonrequest.SeealsotheIEC MultilingualDictionary. Thetermsanddefini

11、tionscontainedinthepresent publicationhaveeitherbeentakenfromtheIEVor havebeenspecificallyapprovedforthepurposeofthis publication. Graphicalandlettersymbols Forgraphicalsymbols,andlettersymbolsandsigns approvedbytheIECforgeneraluse,readersare referredtopublications: IEC60027:Lettersymbolstobeusedine

12、lectrical technology; IEC60417: Graphicalsymbolsforuseon equipment.Index,surveyandcompilationofthe singlesheets; IEC60617: Graphicalsymbolsfordiagrams; andformedicalelectricalequipment, IEC60878:Graphicalsymbolsforelectromedical equipmentinmedicalpractice. Thesymbolsandsignscontainedinthepresent pub

13、licationhaveeitherbeentakenfromIEC 60027, IEC 60417,IEC60617and/orIEC60878,orhave beenspecificallyapprovedforthepurposeofthis publication. IECpublicationspreparedbythesame technicalcommittee Theattentionofreadersisdrawntotheendpagesof thispublicationwhichlisttheIECpublicationsissued bythetechnicalco

14、mmitteewhichhaspreparedthe presentpublication.NORME INTERNATIONALE CEI IEC INTERNATIONAL STANDARD 6124988 Premiredition Firstedition 199706 Matriauxpourlesstructuresdinterconnexion Partie8: Collectiondespcificationsintermdiairespour lesfilmsetrevtementsnonconducteurs Section8:Revtementsamoviblesdepo

15、lymre Materialsforinterconnectionstructures Part8: Sectionalspecificationsetfornonconductive filmsandcoatings Section8:Temporarypolymercoatings CommissionElectrotechniqueInternationale InternationalElectrotechnicalCommission Pourprix,voircatalogueenvigueur Forprice,seecurrentcatalogue IEC1997Droitsd

16、ereproductionrservs Copyrightallrightsreserved Aucunepartiedecettepublicationnepeuttrereproduiteni utilisesous quelqueformequecesoitetparaucun procd,lectroniqueoumcanique,ycomprislaphoto copieetlesmicrofilms,sanslaccordcritdelditeur. Nopartofthispublicationmaybereproducedorut ilizedin anyformorbyany

17、means,electronicormechanical, includingphotocopyingandmicrofilm,withoutpermissionin writingfromthepublisher. InternationalElectrotechnicalCommission 3,ruedeVarembGeneva,Switzerland Telefax:+41229190300 email:inmailiec.ch IECwebsitehttp:/www.iec.ch CODEPRIX PRICECODE K2 6124988CEI:1997 COMMISSIONLECT

18、ROTECHNIQUEINTERNATIONALE _ MATRIAUXPOURLESSTRUCTURESDINTERCONNEXION Partie8:Collectiondespcificationsintermdiairespourlesfilms etrevtementsnonconducteurs Section8:Revtementsamoviblesdepolymre AVANTPROPOS 1) LaCEI(CommissionElectrotechniqueInternationale)estuneorganisationmondialedenormalisationcomp

19、ose delensembledescomitslectrotechniquesnationaux(ComitsnationauxdelaCEI).LaCEIapourobjetde favoriserlacooprationinternationalepourtouteslesquestionsdenormalisationdanslesdomainesde llectricitetdellectronique.Aceteffet,laCEI,entreautresactivits,publiedesNormesinternationales. Leurlaborationestconfie

20、descomitsdtudes,auxtravauxdesquelstoutComitnationalintressparle sujettraitpeutparticiper.Lesorganisationsinternationales,gouvernementalesetnongouvernementales,en liaisonaveclaCEI,participentgalementauxtravaux.LaCEIcollaboretroitementaveclOrganisation InternationaledeNormalisation(ISO),selondescondit

21、ionsfixesparaccordentrelesdeuxorganisations. 2) LesdcisionsouaccordsofficielsdelaCEIconcernantlesquestionstechniquesreprsentent,danslamesure dupossibleunaccordinternationalsurlessujetstudis,tantdonnquelesComitsnationauxintresss sontreprsentsdanschaquecomitdtudes. 3) Lesdocumentsproduitsseprsententso

22、uslaformederecommandationsinternationales.Ilssontpublis commenormes,rapportstechniquesouguidesetagrscommetelsparlesComitsnationaux. 4) Danslebutdencouragerlunificationinternationale,lesComitsnationauxdelaCEIsengagentappliquerde faontransparente,danstoutelamesurepossible,lesNormesinternationalesdelaC

23、EIdansleursnormes nationalesetrgionales.ToutedivergenceentrelanormeCEIetlanormenationaleourgionale correspondantedoittreindiqueentermesclairsdanscettedernire. 5) LaCEInafixaucuneprocdureconcernantlemarquagecommeindicationdapprobationetsaresponsabilit nestpasengagequandunmatrielestdclarconformelunede

24、sesnormes. 6) LattentionestattiresurlefaitquecertainsdeslmentsdelaprsenteNormeinternationalepeuventfaire lobjetdedroitsdepropritintellectuelleoudedroitsanalogues.LaCEInesauraittretenuepour responsabledenepasavoiridentifidetelsdroitsdepropritetdenepasavoirsignalleurexistence. LaNormeinternationaleCEI

25、6124988attablieparlecomitdtudes52delaCEI: Circuitsimprims. Letextedecettenormeestissudesdocumentssuivants: FDIS Rapportdevote 52/680/FDIS 52/726/RVD Lerapportdevoteindiqudansletableaucidessusdonnetouteinformationsurlevoteayant aboutilapprobationdecettenorme. LannexeAestdonneuniquementtitredinformati

26、on.6124988IEC:1997 3 INTERNATIONALELECTROTECHNICALCOMMISSION _ MATERIALSFORINTERCONNECTIONSTRUCTURES Part8:Sectionalspecificationsetfornonconductivefilmsandcoatings Section8:Temporarypolymercoatings FOREWORD 1) TheIEC(InternationalElectrotechnicalCommission)isaworldwideorganizationforstandardization

27、comprising allnationalelectrotechnicalcommittees(IECNationalCommittees).TheobjectoftheIECistopromote internationalcooperationonallquestionsconcerningstandardizationintheelectricalandelectronicfields. Tothisendandinadditiontootheractivities,theIECpublishesInternationalStandards.Theirpreparation is en

28、trustedtotechnicalcommittees;anyIECNationalCommitteeinterestedinthesubjectdealtwith may participateinthispreparatorywork.International,governmentalandnongovernmentalorganizations liaisingwiththeIECalsoparticipateinthispreparation.TheIECcollaboratescloselywiththeInternational OrganizationforStandardi

29、zation(ISO)inaccordancewithconditionsdeterminedbyagreementbetweenthe twoorganizations. 2) TheformaldecisionsoragreementsoftheIEContechnicalmattersexpress,asnearlyaspossible,an internationalconsensusofopinionontherelevantsubjectssinceeachtechnicalcommitteehasrepresentation fromallinterestedNationalCo

30、mmittees. 3) Thedocumentsproducedhavetheformofrecommendationsforinternationaluseandarepublishedintheform ofstandards,technicalreportsorguidesandtheyareacceptedbytheNationalCommitteesinthatsense. 4) Inordertopromoteinternationalunification,IECNationalCommitteesundertaketoapplyIECInternational Standar

31、dstransparentlytothemaximumextentpossibleintheirnationalandregionalstandards.Any divergencebetweentheIECStandardandthecorrespondingnationalorregionalstandardshallbeclearly indicatedinthelatter. 5) TheIECprovidesnomarkingproceduretoindicateitsapprovalandcannotberenderedresponsibleforany equipmentdecl

32、aredtobeinconformitywithoneofitsstandards. 6) AttentionisdrawntothepossibilitythatsomeoftheelementsofthisInternationalStandardmaybethesubject ofpatentrights.TheIECshallnotbeheldresponsibleforidentifyinganyorallsuchpatentrights. InternationalStandardIEC6124988hasbeenpreparedbyIECtechnicalcommittee52:

33、 Printedcircuits. Thetextofthisstandardisbasedonthefollowingdocuments: FDIS Reportonvoting 52/680/FDIS 52/726/RVD Fullinformationonthevotingfortheapprovalofthisstandardcanbefoundinthereporton votingindicatedintheabovetable. AnnexAisforinformationonly.4 6124988CEI:1997 MATRIAUXPOURLESSTRUCTURESDINTER

34、CONNEXION Partie8:Collectiondespcificationsintermdiairespourlesfilms etrevtementsnonconducteurs Section8:Revtementsamoviblesdepolymre 1 Domainedapplication LaprsentespcificationdtaillelintrieurdelasrieCEI61249lesexigencesconcernant lhomologationdesrevtementsamoviblesderservedebrasure.Danscettespcifi

35、cation ceuxcisontdsignsparletermemasque,dufaitquilspeuventtreaismentenlevs. Lesmasquesdebrasagedtachablessontappliqus(habituellementparsrigraphie)auxzonesde lacarteimprimetermineouflanavantexpdition,afindeprotgerceszonesdelacarteouflan durantlesprocessusultrieursdemontage.Typiquement,lesmasquesdebra

36、sagedtachables sontutilisspourprotgerlescontactsdeclavierpendantlefluxageetlebrasagesimultanultrieur. Lenlvementdumasquelaisseraalorsunezonedecontactnontamedpourvuedersidus. Lesexigencesexprimesdanslaprsentespcificationaurontalorsunecertainevaliditlimitepour lvaluationdeladquationdescartesimprimesqu

37、isontfourniesavecdesmasquesdebrasage dtachables.Ilconvientquelesexigencespourlalivraisondescartesimprimesutilisantdes masquesdebrasagedtachablessoientcomprisesdanslaSpcificationParticulireClient(CDS). Lesexigencespourlhomologationdesrevtementspermanentsderservedebrasureen polymresontdonnesdanslaCEI6

38、124985 1) quiatutilise,autantquepossible,comme modledansllaborationdelaprsentespcification. 2Rfrences normatives Lesdocumentsnormatifssuivantscontiennentdesdispositionsqui,parsuitedelarfrence quiyestfaite,constituentdesdispositionsvalablespourlaprsentesectiondelaCEI612498. Aumomentdelapublication,le

39、sditionsindiquestaientenvigueur.Toutdocumentnormatif estsujetrvisionetlespartiesprenantesauxaccordsfondssurlaprsentesectionde la CEI 612498sontinvitesrechercherlapossibilitdappliquerlesditionslesplus rcentesdesdocumentsnormatifsindiqusciaprs.LesmembresdelaCEIetdelISO possdentleregistredesNormesinter

40、nationalesenvigueur. CEI60068220:1979, EssaisdenvironnementPartie2:EssaisEssaiT:Soudure Modificationn1(1987) CEI611891:1997, Mthodesdessaipourlesmatriauxlectriques,lesstructuresdinter connexionetlesensemblesPartie1:Mthodesdessaignralesetmthodologie CEI611892: 1997, Mthodesdessaipourlesmatriauxlectri

41、ques,lesstructuresdinterconnexion etlesensemblesPartie2:Mthodesdessaidesmatriauxpourstructuresdinterconnexion CEI611893: 1997, Mthodesdessaipourlesmatriauxlectriques,lesstructuresdinterconnexion etlesensemblesPartie3:Mthodesdessaidesstructuresdinterconnexion(cartesimprimes) CEI6124985: Matriauxpourl

42、esstructuresdinterconnexionPartie8:Sriedespci ficationsintermdiairespourlesfilmsetrevtementsnonconducteursSection5: Revtementspermanentsdepolymre 1) CEI6232641:1996, CartesimprimesPartie4:Cartesimprimesmulticouchesrigides avecconnexionsintercouches.SpcificationintermdiaireSection1:Spcificationparti culiredagrment:niveaux