IEC 61837-3-2015 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3 Metal encl.pdf

1、 IEC 61837-3 Edition 2.0 2015-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Part 3: Metal enclosures Dispositifs pizolectriques montage en surface pour la commande et le choix d

2、e la frquence Encombrements normaliss et connexions des sorties Partie 3: Enveloppes mtalliques IEC 61837-3:2015-04(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2015 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or

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20、NORME INTERNATIONALE Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connections Part 3: Metal enclosures Dispositifs pizolectriques montage en surface pour la commande et le choix de la frquence Encombrements normaliss et connexions des

21、sorties Partie 3: Enveloppes mtalliques INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.140 ISBN 978-2-8322-2598-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning!

22、Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 61837-3:2015 IEC 2015 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Configuration of enclosures . 5 4 Desig

23、nation of types 5 5 Metal enclosure dimensions. 6 6 Lead connections 6 7 Designation of metal enclosures 6 Bibliography 20 Table 1 Revised configurations 6 Table 2 Designation of metal enclosures 7 IEC 61837-3:2015 IEC 2015 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTED PIEZOELECTRIC

24、DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 3: Metal enclosures FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Commi

25、ttees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Availa

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34、 publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. Internation

35、al Standard IEC 61837-3 has been prepared by IEC technical committee 49: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. This second edition cancels and replaces the first edition published in 2000. It constitutes a technic

36、al revision. This International Standard is to be read in conjunction with IEC 61240:2012. This edition includes the following significant technical changes with respect to the previous edition: The outline drawing is defined as one set of drawings consisting of four views, which are the view from a

37、bove, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition. 4 IEC 61837-3:2015 IEC 2015 The height of package (G 1 ) is eliminated, instead total height is expressed by the symbol letter G or with a subscript number. T

38、he dimensions of terminal lead spacing are shown by the centre position of the terminal leads and its basic value e is 2.54 n mm (n is an integer) and 1,27 n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a su

39、bscript number such as e 1 , e 2is attached, e.g. e 1 , e 2 , etc. If there are plural spacing values, the subscript number is followed by a hyphen and numbers such as e 1-1 , e 1-2, etc. In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumers con

40、venience. They were expressed as minimum values in the previous edition of IEC 61837-3. If there are plural identical enclosures with different height, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the s

41、heet. The configurations of the enclosures were revised as shown in Table 1. The text of this standard is based on the following documents: FDIS Report on voting 49/1118/FDIS 49/1140/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated i

42、n the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61837 series, published under the general title Surface mounted piezoelectric devices for frequency control and selection Standard outlines and terminal lead connect

43、ions, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reco

44、nfirmed, withdrawn, replaced by a revised edition, or amended. IEC 61837-3:2015 IEC 2015 5 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 3: Metal enclosures 1 Scope This part of IEC 61837 deals with standard outlines an

45、d terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices. 2 Normative references The following documents, in whole or in part, are normatively

46、 referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 61240:2012, Piezoelectric devices Preparation of outline drawing

47、s of surface mounted devices (SMD) for frequency control and selection General rules 3 Configuration of enclosures The enclosures of the surface-mounted devices are made of metal with the formed lead terminals based on the descriptive designation system for semiconductors devices package. All SMD en

48、closures described in this part of IEC 61837 are special surface mount types. Therefore, the following designator is used. SMS (Surface-Mounted, Special) 4 Designation of types The type designator consists of four parts as follows: A: Configuration symbol of enclosures: SMS (Surface-Mounted, Special

49、). B: Structure of terminal leads L: folded leads type; J: folded leads type. If there is a leadless type, it will have no mark. See Clause 3 of IEC 61240:2012, Classification of SMD. C: Number of terminal leads A B C D 6 IEC 61837-3:2015 IEC 2015 D: 2-digit serial number 5 Metal enclosure dimensions The dimensions given in this part of IEC 61837 apply to all completed SMD for frequ