IEC 62047-13-2012 Semiconductor devices - Micro-electromechanical devices - Part 13 Bend- and shear-type test methods of measuring adhesive strength for MEMS st.pdf

1、 IEC 62047-13 Edition 1.0 2012-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 13:

2、 Mthodes dessais de types courbure et cisaillement de mesure de la rsistance dadhrence pour les structures MEMS IEC 62047-13:2012 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2012 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reprod

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16、ette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 62047-13 Edition 1.0 2012-02 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structure

17、s Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 13: Mthodes dessais de types courbure et cisaillement de mesure de la rsistance dadhrence pour les structures MEMS INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE P ICS 31.080.99 PRICE CODE COD

18、E PRIX ISBN 978-2-88912-937-9 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obten

19、u cette publication via un distributeur agr. 2 62047-13 IEC:2012 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Test method . 6 4.1 General . 6 4.2 Data analysis 7 5 Test equipment . 8 5.1 General . 8 5.2 Actuator 8 5.3 Force measurement sensor . 8 5.4 Ali

20、gnment system 8 5.5 Recorder . 8 6 Test pieces . 9 6.1 Design of test pieces . 9 6.2 Preparation of test pieces 9 7 Test conditions . 9 7.1 Method for gripping . 9 7.2 Speed of testing 9 7.3 Alignment of test piece 9 7.4 Test environment. 10 8 Test report 10 Annex A (informative) Technical backgroun

21、d . 11 Bibliography 14 Figure 1 Columnar test pieces . 6 Figure 2 Adhesive strength test method . 7 Figure 3 Alignment between columnar test piece and loading tool 10 Figure A.1 Example of the RRT results (see 1) 11 Figure A.2 Effects of aspect ratio of columnar test piece on the stress condition in

22、 bend type test (see 2) . 12 Figure A.3 Effects of knife edge angle of loading tool and aspect ratio of columnar test piece on the stress condition in bend test . 13 62047-13 IEC:2012 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 13: Bend -

23、and shear - type test methods of measuring adhesive strength for MEMS structures FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to prom

24、ote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides

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33、the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-13 has been p

34、repared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/109/FDIS 47F/119/RVD Full information on the voting for the approval of this standard can be f

35、ound in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62047-13 IEC:2012 A list of all parts of IEC 62047 series, published under the general title Semiconductor devices Micro-electromechanical devices, can be

36、 found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, wi

37、thdrawn, replaced by a revised edition, or amended. 62047-13 IEC:2012 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures 1 Scope This part of IEC 62047 specifies the adhesive testing method between

38、micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 m to 1 mm, respectively. Micro-sized elements of MEMS devices are mad

39、e up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combin

40、ation of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for micro- sized-ele

41、ments in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine

42、for micro-sized materials has not been generalized. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edi

43、tion of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconductor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1

44、adhesive bend strength nominal strength at failure on adhesive joint area by bending mode 3.2 adhesive shear strength nominal strength at failure on adhesive joint area by shear mode 6 62047-13 IEC:2012 D S T 3 1 2 l c 4 3 4S 4 D l c3 2 4 3 1 T IEC 192/12 Key Configurations or specimen Dimensions of

45、 specimen 1 Top view D diameter of columnar test piece 2 Side view l clength of columnar test piece 3 Column type test piece l c /D aspect ratio of columnar test piece 4 Substrate thickness of substrate S spacing between columnar test pieces Figure 1 Columnar test pieces 4 Test method 4.1 General Th

46、is standard specifies the adhesive testing methods between a columnar test piece (see Figure 1) and substrate. Displacement or force is applied to a columnar test piece at a constant speed and the force at delamination is measured to analyze the adhesive strength between the columnar test piece and

47、substrate. A knife edge shape with tapered tip is utilized as the loading tool to apply the force to a columnar test piece. The angle of the knife edge is changed by loading types of measuring adhesive strength as follows. In case of measuring adhesive bend strength by applying bending force at the

48、end of a columnar test piece (bend type test), the knife edge of loading tool is used by slanting its apex in the upper direction against the test piece as shown in Figure 2 a). In such a case, it is easier to align the loading tool and a test piece since point load is applied at the end of the colu

49、mnar test piece. Attention should be drawn to the fact that the bend type test is not pure bending, which includes compression component to the columnar root. The compression component increases by increasing the contact angle of the knife edge. In order to minimize the effect of compression component, the contact angle of the knife edge ( b ) should be within a range of from 10 to 20.