IEC 62496-2-2017 Optical circuit boards - Basic test and measurement procedures - Part 2 General guidance for definition of measurement conditions for optical c.pdf

1、 IEC 62496-2 Edition 1.0 2017-05 INTERNATIONAL STANDARD Optical circuit boards Basic test and measurement procedures Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards IEC 62496-2:2017-05(en) colour inside THIS PUBLICATION IS COPYR

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11、it boards Basic test and measurement procedures Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 33.180.01 ISBN 978-2-8322-4404-3 Registered trademark of the International Electrotech

12、nical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 IEC 62496-2:2017 IEC 2017 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 Measurement definition system for optical circuit boa

13、rds . 9 4.1 General . 9 4.2 Measurement definition system requirements 9 4.2.1 Accuracy . 9 4.2.2 Accountability 9 4.2.3 Efficiency . 10 4.2.4 Convenience . 10 4.2.5 Independent 10 4.2.6 Scalable 10 4.2.7 Customised requirements 10 4.2.8 Prioritised structure . 10 4.3 Measurement definition criteria

14、 . 10 4.3.1 General . 10 4.3.2 Source characteristics . 11 4.3.3 Launch conditions 11 4.3.4 Input coupling conditions . 14 4.3.5 Output coupling conditions 15 4.3.6 Capturing conditions 16 4.4 Launch and capturing position 16 4.5 Launch and capture direction 17 5 Measurement identification code . 19

15、 5.1 General . 19 5.2 Measurement identification code construction . 19 5.2.1 General . 19 5.2.2 AAA Source characteristics. 19 5.2.3 BBB(b1) Launch conditions . 19 5.2.4 CCC Input coupling conditions 20 5.2.5 DDD Output coupling conditions . 20 5.2.6 EEE Capturing conditions . 20 5.3 Extended measu

16、rement identification code with customisation parameters . 20 5.3.1 General . 20 5.3.2 Customisation parameters with placeholders . 20 5.4 Reference measurements . 21 5.5 Coordinate table AAA Source characteristics . 21 5.5.1 Mandatory parameters . 21 5.5.2 Customisation parameters . 21 5.6 Coordina

17、te table BBB Launch conditions 24 5.6.1 Mandatory parameter. 24 5.6.2 Customisation parameters . 24 5.7 Coordinate table CCC Input coupling conditions. 27 IEC 62496-2:2017 IEC 2017 3 5.7.1 Mandatory parameters . 27 5.7.2 Customisation parameters . 27 5.8 Coordinate table DDD Output coupling conditio

18、ns 29 5.8.1 Mandatory parameters . 29 5.8.2 Customisation parameters . 29 5.9 Coordinate table EEE Capturing conditions 31 5.9.1 Mandatory parameters . 31 5.9.2 Customisation parameters . 31 5.10 Examples of deployment . 34 5.10.1 General . 34 5.10.2 MIC-042-113(400)-001-001-112 (integrating sphere

19、device details including supplier and model number) 34 5.10.3 MIC-072-123(205)-053(1.56, X,X)-001-042 (integrating sphere device details including supplier and model number) 34 5.10.4 Fast polarisation axis: MIC-091-072(150)-042(1.53, 25, -30)-051-004; slow polarisation axis: MIC-091-072(75)-042(1.5

20、3, 25, -120)-051-004 . 35 Annex A (informative) State of the art in optical interconnect technologies . 36 A.1 Diversity of optical interconnect technologies 36 A.2 Fibre-optic circuit laminates 36 A.3 Polymer waveguides . 36 A.4 Planar glass waveguides 36 A.5 Free space optics . 37 A.6 Target appli

21、cations . 37 Bibliography 38 Figure 1 Optical circuit board varieties . 6 Figure 2 Recommended test setup for single-mode fibre launch conditions 13 Figure 3 Recommended test setup for multimode fibre launch conditions . 13 Figure 4 Cross-sectional views of channel under test at input 15 Figure 5 Cr

22、oss-sectional views of the channel under test at output 16 Figure 6 Measurement setup with collinear launch and capture direction . 17 Figure 7 Measurement setup with orthogonal launch and capture direction 18 Figure 8 Measurement setup with oblique launch and capture direction . 18 Figure 9 Measure

23、ment identification code construction 19 Figure 10 Reference measurements with the same MIC . 21 Table 1 Recommended modal launch profiles 12 Table 2 AAA coordinate reference for source characteristics . 22 Table 3 BBB coordinate reference for launch conditions 25 Table 4 CCC coordinate reference fo

24、r input coupling conditions 28 Table 5 DDD coordinate reference for output coupling conditions 30 Table 6 EEE coordinate reference for capturing conditions 32 4 IEC 62496-2:2017 IEC 2017 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ OPTICAL CIRCUIT BOARDS BASIC TEST AND MEASUREMENT PROCEDURES Part 2:

25、General guidance for definition of measurement conditions for optical characteristics of optical circuit boards FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees

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36、tandard IEC 62496-2 has been prepared by IEC technical committee 86: Fibre optics. The text of this document is based on the following documents: CDV Report on voting 86/509/CDV 86/515/RVC Full information on the voting for the approval of this International Standard can be found in the report on vo

37、ting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. IEC 62496-2:2017 IEC 2017 5 A list of all parts in the IEC 62496 series, published under the general title Optical circuit boards Basic test and measurement procedures, can be found o

38、n the IEC website. Future standards in this series will carry the new general title as cited above. Titles of existing standards in this series will be updated at the time of the next edition. The committee has decided that the contents of this document will remain unchanged until the stability date

39、 indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour

40、inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 IEC 62496-2:2017 IEC 2017 INTRODUCTION Bandwidth densities in mod

41、ern data communication systems are driven by interconnect speeds and scalable input/output (I/O) and will continue to increase over the coming years, thereby severely impacting cost and performance in future data communication systems, bringing increased demands in terms of signal integrity and powe

42、r consumption. The projected increase in capacity, processing power and bandwidth density in future information communication systems will need to be addressed by the migration of embedded optical interconnects into system enclosures. In particular, this would necessitate the deployment of optical c

43、ircuit board technologies on some or all key system cards, such as the backplane, motherboard and peripheral circuit boards. Many varieties of optical circuit board technology exist today, which differ strongly from each other in terms of their intrinsic waveguide technology. As shown in Figure 1, t

44、hese varieties include, but are not limited to: a) fibre-optic laminate, b) polymer waveguides and c) planar glass waveguides. Annex A provides a detailed overview of the state of the art of such optical interconnect technologies. a) Fibre-optic laminate b) Polymer waveguides c) Planar glass wavegui

45、des Figure 1 Optical circuit board varieties One important prerequisite to the commercial adoption of optical circuit boards is a reliable test and measurement definition system that is agnostic to the type of waveguide system under test and, therefore, can be applied to different optical circuit bo

46、ard technologies as well as being adaptable to future variants. A serious and common problem with the measurement of optical waveguide systems has been lack of proper definition of the measurement conditions for a given test regime, and consequently strong inconsistencies ensue in the results of mea

47、surements by different parties on the same test sample. To date, no methodology has been established to ensure that test and measurement conditions for such optical waveguide systems are properly identified. This document specifies a method of capturing sufficient information about the measurement c

48、onditions for a given optical circuit board to ensure consistency of measurement results within an acceptable margin. Given the substantial variety in properties and requirements for different optical circuit board types, some test environments and conditions are more appropriate than others for a g

49、iven optical circuit board. It is, therefore, crucial that this measurement identification standard encompass a comprehensive range of test and measurement scenarios for all known types of optical circuit boards and their waveguide systems, while also being sufficiently adaptable and extendable to accommodate future waveguide technologies. In addition, a degree of customisation is possible to account for arbitrary test parameters. IEC IEC IEC IEC 62496-2:2017