IEC 63003-2015 Standard for the common test interface pin map configuration for high-density single-tier electronics test requirements utilizing IEEE Std 1505《利.pdf

1、 IEC 63003 Edition 1.0 2015-12 INTERNATIONAL STANDARD Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505 IEC 63003:2015-12(en) IEEE Std 1505.1-2008 IEEE Std 1505.1 colour inside THIS PUBLICATION IS COPYRIGH

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17、g agreements are reasonable or non-discriminatory. Users of this standard are expressly advised that determination of the validity of any patent rights, and the risk of infringement of such rights, is entirely their own responsibility. IEC 63003:2015 IEEE Std 1505.1-2008Published by IEC under licens

18、e from IEEE. 2008 IEEE. All rights reserved. International Standard IEC 63003/IEEE Std 1505.1-2008 has been processed through IEC technical committee 91: Electronics assembly technology, under the IEC/IEEE Dual Logo Agreement. The text of this standard is based on the following documents: IEEE Std F

19、DIS Report on voting IEEE Std 1505.1-2008 91/1274/FDIS 91/1298/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The IEC Technical Committee and IEEE Technical Committee have decided that the contents of this publi

20、cation will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IEC 63003:2015 IEEE Std 1505.1-2

21、008IEEE Std 1505.1-2008 i Copyright 2013 IEEE. All rights reserved. IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505 Sponsor IEEE Instrumentation and Measurement Society and IEEE Standards Coordinati

22、ng Committee 20 on Test and Diagnosis for Electronic Systems Approved 26 September 2008 IEEE-SA Standards Board Approved as a Full-Use Standard on 14 June 2013 IEEE-SA Standards Board IEC 63003:2015 IEEE Std 1505.1-2008 Abstract: This standard represents an extension to the IEEE 1505 receiver fixtur

23、e interface (RFI) standard specification. Particular emphasis is placed on defining within the IEEE 1505 RFI standard a more specific set of performance requirements that employ a common scalable: (a) pin map configuration; (b) specific connector modules; (c) respective contacts; (d) recommended swi

24、tching implementation; and (e) legacy automatic test equipment (ATE) transitional devices. This is intentionally done to standardize the footprint and assure mechanical and electrical interoperability between past and future automatic test systems (ATS). Keywords: ATE, ATS, fixture, ICD, IEEE 1505.1

25、 TM , interface, ITA, mass termination, receiver, scalable, TPS, UUT IEC 63003:2015 IEEE Std 1505.1-2008 IEEE Introduction This introduction is not part of IEEE Std 1505.1-2008, IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requireme

26、nts Utilizing IEEE Std 1505 . This standard stems from the history of ATE implementations having unique input/output (I/O) pin out definitions. This uniqueness has prevented the interoperability of test program sets (TPSs) among different ATEs within the same organizations. Even if the same RFI was

27、used by the target ATE, the signals I/O could not be guaranteed to be at the same pin location. This is due to there being no suitable standard pin out definition for general purpose electronic testing applications. IEEE Std 1505-2006 ahas addressed part of the interoperability problem by defining t

28、he common mechanical interface for the ATE. This project takes the TPS interoperability problem one step further toward completion by standardizing the electrical signal I/O pin map for general purpose electronic testing applications. Particular emphasis is placed on defining within the IEEE 1505 RF

29、I standard a more specific set of performance requirements that employ a common scalable: (a) framework; (b) pin map configuration; (c) specific connector modules; (d) respective contacts; (e) recommended switching implementation; and (f) legacy ATE transitional devices. This is intentionally done t

30、o standardize the footprint and assure mechanical and electrical interoperability between past and future ATS. The suggested mechanical and electrical requirements necessary to implement a specific IEEE 1505 RFI product in support of a common test interface (CTI) across all U.S. Department of Defens

31、e (DoD) defense agencies, related aerospace industry, and a variety of non-U.S. government agencies such as the U.K. Ministry of Defense (MoD) is provided. The DoD is a major buyer and user of ATE; however, existing acquisition guidance desires the use of commercial standards and/or best practices f

32、or these systems. Suitable standards currently do not exist in the commercial marketplace; therefore, this standard will provide such specification. Notice to users Users of IEEE Standards documents should consult all applicable laws and regulations. Compliance with the provisions of any IEEE Standa

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35、tandardization, and the promotion of engineering practices and methods. By making this document available for use and adoption by public authorities and private users, the IEEE does not waive any rights in copyright to this document. aInformation on references can be found in Clause 2. IEC 63003:2015 IEEE Std 1505.1-2008