1、 IEC 63003 Edition 1.0 2015-12 INTERNATIONAL STANDARD Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505 IEC 63003:2015-12(en)IEEE Std1505.1-2008IEEE Std 1505.1 colourinsideTHIS PUBLICATION IS COPYRIGHT PRO
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17、ements are reasonable or non-discriminatory. Users of this standard are expressly advised that determination of the validity of any patent rights, and the risk of infringement of such rights, is entirely their own responsibility. IEC 63003:2015 IEEE Std 1505.1-2008Published by IEC under license from
18、 IEEE. 2008 IEEE. All rights reserved. International Standard IEC 63003/ IEEE Std 1505.1-2008 has been processed through IEC technical committee 91: Electronics assembly technology, under the IEC/IEEE Dual Logo Agreement. The text of this standard is based on the following documents: IEEE Std FDIS R
19、eport on voting IEEE Std 1505.1-2008 91/1274/FDIS 91/1298/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The IEC Technical Committee and IEEE Technical Committee have decided that the contents of this publicatio
20、n will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IEC 63003:2015 IEEE Std 1505.1-2008IE
21、EE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505Sponsor IEEE Instrumentation and Measurement Society and IEEE Standards Coordinating Committee 20 on Test and Diagnosis for Electronic Systems Approved 2
22、6 September 2008 IEEE-SA Standards Board Approved as a Full-Use Standard on 14 June 2013 IEEE-SA Standards Board IEC 63003:2015 IEEE Std 1505.1-2008Abstract: This standard represents an extension to the IEEE 1505 receiver fixture interface (RFI) standard specification. Particular emphasis is placed
23、on defining within the IEEE 1505 RFI standard a more specific set of performance requirements that employ a common scalable: (a) pin map configuration; (b) specific connector modules; (c) respective contacts; (d) recommended switching implementation; and (e) legacy automatic test equipment (ATE) tra
24、nsitional devices. This is intentionally done to standardize the footprint and assure mechanical and electrical interoperability between past and future automatic test systems (ATS). Keywords: ATE, ATS, fixture, ICD, IEEE 1505.1TM, interface, ITA, mass termination, receiver, scalable, TPS, UUT IEC 6
25、3003:2015 IEEE Std 1505.1-2008I(,ntroduction This introduction is not part of IEEE Std 1505.1-2008, IEEE Standard for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505. This standard stems from the history of ATE imple
26、mentations having unique input/output (I/O) pin out definitions. This uniqueness has prevented the interoperability of test program sets (TPSs) among different ATEs within the same organizations. Even if the same RFI was used by the target ATE, the signals I/O could not be guaranteed to be at the sa
27、me pin location. This is due to there being no suitable standard pin out definition for general purpose electronic testing applications. IEEE Std 1505-2006ahas addressed part of the interoperability problem by defining the common mechanical interface for the ATE. This project takes the TPS interoper
28、ability problem one step further toward completion by standardizing the electrical signal I/O pin map for general purpose electronic testing applications. Particular emphasis is placed on defining within the IEEE 1505 RFI standard a more specific set of performance requirements that employ a common
29、scalable: (a) framework; (b) pin map configuration; (c) specific connector modules; (d) respective contacts; (e) recommended switching implementation; and (f) legacy ATE transitional devices. This is intentionally done to standardize the footprint and assure mechanical and electrical interoperabilit
30、y between past and future ATS. The suggested mechanical and electrical requirements necessary to implement a specific IEEE 1505 RFI product in support of a common test interface (CTI) across all U.S. Department of Defense (DoD) defense agencies, related aerospace industry, and a variety of non-U.S.
31、government agencies such as the U.K. Ministry of Defense (MoD) is provided. The DoD is a major buyer and user of ATE; however, existing acquisition guidance desires the use of commercial standards and/or best practices for these systems. Suitable standards currently do not exist in the commercial ma
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44、tent rights, and the risk of infringement of such rights, is entirely their own responsibility. Further information may be obtained from the IEEE Standards Association. IEC 63003:2015 IEEE Std 1505.1-20081Information on references can be found in Clause 2. IEC 63003:2015 IEEE Std 1505.1-20081Standar
45、d for the Common Test Interface Pin Map Configuration for High-Density, Single-Tier Electronics Test Requirements Utilizing IEEE Std 1505IMPORTANT NOTICE: IEEE Standards documents are not intended to ensure safety, health, or environmental protection, or ensure against interference with or from othe
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48、viewed at http:/standards.ieee.org/IPR/disclaimers.html. 1. Overview 1.1 Scope The scope of this standard is the definition of a pin map utilizing the IEEE 1505 1receiver fixture interface (RFI). The pin map defined within this standard shall apply to military and aerospace automatic test equipment
49、(ATE) testing applications. 1.2 Purpose Standardization of a common input/output (I/O) will enable the interoperability of IEEE 1505 compliant interface fixtures also known as interface test adapters (ITA), interface devices (IDs), or interconnecting devices (ICDs) on multiple ATE systems utilizing the IEEE 1505 RFI. 1.3 Statement of the problem 1.3.1 U.S. Government guidance From 1980 to 1992, the U.S. Department of Defense (DoD) investment in field, depot, and factory automatic test systems (ATS) exceeded $35 billion with an addi
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