EN IEC 61837-2-2018 Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2 Ceramic.pdf

1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connectionsPart 2: Ceramic enclosures (IEC 61837-2:2018)BS EN IEC 61837-2:2018National forewordThis British

2、 Standard is the UK implementation of EN IEC 618372:2018. It is identical to IEC 618372:2018. It supersedes BS EN 618372:2011+A1:2014, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/49, Piezoelectric devices for frequency control and selection.A l

3、ist of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2018 Published by BSI Standards

4、 Limited 2018ISBN 978 0 580 98424 2ICS 29.035.30; 31.140Compliance with a British Standard cannot confer immunity from legal obligations. This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 August 2018.Amendments/corrigenda issued since public

5、ationDate Text affectedBRITISH STANDARDBS EN IEC 618372:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 61837-2 July 2018 ICS 31.140 Supersedes EN 61837-2:2011 English Version Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead

6、 connections - Part 2: Ceramic enclosures (IEC 61837-2:2018) Dispositifs pizolectriques montage en surface pour la commande et le choix de la frquence - Encombrements normaliss et connexions des sorties - Partie 2: Enveloppes en cramique (IEC 61837-2:2018) Oberflchenmontierbare piezoelektrische Baut

7、eile zur Frequenzstabilisierung und -selektion - Norm-Gehusemae und Anschlsse - Teil 2: Keramikgehuse (IEC 61837-2:2018) This European Standard was approved by CENELEC on 2018-06-12. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for givi

8、ng this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three

9、official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electro

10、technical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Roman

11、ia, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1

12、040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 61837-2:2018 E BS EN IEC 618372:2018EN IEC 61837-2:2018 2 European foreword The text of document 49/1252/CDV, future edition 3 of IEC 61837-2, prepared by IEC/TC

13、49 “Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 61837-2:2018. The following dates are fixed: latest date by which the document has to be i

14、mplemented at national level by publication of an identical national standard or by endorsement (dop) 2019-03-12 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2021-06-12 This document supersedes EN 61837-2:2011. Attention is drawn to the possibi

15、lity that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61837-2:2018 was approved by CENELEC as a European Standard without

16、any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60122-3:2010 NOTE Harmonized as EN 60122-3:2010 (not modified). IEC 60191-6:2009 NOTE Harmonized as EN 60191-6:2009 (not modified). IEC 60368-1:2000 NOTE Harmonized as E

17、N 60368-1:2000 (not modified). IEC 60368-2-2:1996 NOTE Harmonized as EN 60368-2-2:1999 (not modified). IEC 60368-3:2010 NOTE Harmonized as EN 60368-3:2010 (not modified). IEC 60679-1:2017 NOTE Harmonized as EN 60679-1:2017 (not modified). IEC 60679-3:2012 NOTE Harmonized as EN 60679-3:2013 (not modi

18、fied). IEC 60862-1:2015 NOTE Harmonized as EN 60862-1:2015 (not modified). IEC 60862-2:2012 NOTE Harmonized as EN 60862-2:2012 (not modified). IEC 60862-3:2003 NOTE Harmonized as EN 60862-3:2003 (not modified). IEC 61019-1:2004 NOTE Harmonized as EN 61019-1:2005 (not modified). IEC 61019-2:2005 NOTE

19、 Harmonized as EN 61019-2:2005 (not modified). ISO 1101:2017 NOTE Harmonized as EN ISO 1101:2017 (not modified). BS EN IEC 618372:2018EN IEC 61837-2:2018 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents a

20、re referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an Intern

21、ational Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 61240 2016 Piezo

22、electric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules EN 61240 2017 BS EN IEC 618372:2018 2 IEC 61837-2:2018 IEC 2018 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 Configuration o

23、f enclosures . 6 5 Designation of types 6 6 Ceramic enclosure dimensions 7 7 Lead connections 7 8 Designation of ceramic enclosures 7 Sheet 1 . 9 Sheet 2 . 11 Sheet 3 . 13 Sheet 4 . 15 Sheet 5 . 17 Sheet 6 . 19 Sheet 7 . 21 Sheet 8 . 23 Sheet 9 . 25 Sheet 10 . 27 Sheet 11 . 29 Sheet 12 . 31 Sheet 13

24、 . 33 Sheet 14 . 35 Sheet 15 . 37 Sheet 16 . 39 Sheet 17 . 41 Sheet 18 . 43 Sheet 19 . 45 Sheet 20 . 47 Sheet 21 . 49 Sheet 22 . 51 Sheet 23 . 53 Sheet 24 . 55 Sheet 25 . 57 Sheet 26 . 59 Sheet 27 . 61 Sheet 28 . 63 Sheet 29 . 65 Sheet 30 . 67 Sheet 31 . 69 Sheet 32 . 71 Sheet 33 . 73 BS EN IEC 6183

25、72:2018IEC 61837-2:2018 IEC 2018 3 Sheet 34 . 75 Sheet 35 . 77 Sheet 36 . 79 Sheet 37 . 81 Sheet 38 . 83 Sheet 39 . 85 Sheet 40 . 87 Sheet 41 . 89 Sheet 42 . 91 Sheet 43 . 93 Sheet 44 . 95 Sheet 45 . 97 Bibliography 99 Table 1 Designation of ceramic enclosures 8 BS EN IEC 618372:2018 4 IEC 61837-2:2

26、018 IEC 2018 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TERMINAL LEAD CONNECTIONS Part 2: Ceramic enclosures FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization fo

27、r standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publis

28、hes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may pa

29、rticipate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement

30、between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Public

31、ations have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or fo

32、r any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the correspon

33、ding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

34、services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC

35、 National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attent

36、ion is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC

37、 shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61837-2 has been prepared by IEC technical committee 49: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection. This third ed

38、ition cancels and replaces the second edition published in 2011 and Amendment 1:2014. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) revision of the figures to match the notation of the drawing

39、s of IEC 61240:2016; b) addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C. As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1. BS EN IEC 618372:2018IEC 61837-2:2018 IEC 2018

40、5 This International Standard is to be read in conjunction with IEC 61240:2016. The text of this International Standard is based on the following documents: CDV Report on voting 49/1252/CDV 49/1276/RVC Full information on the voting for the approval of this International Standard can be found in the

41、 report on voting indicated in the above table. This document has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61837 series, published under the general title Surface mounted piezoelectric devices for frequency control and selection Standard outlines

42、 and terminal lead connections , can be found on the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the doc

43、ument will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. BS EN IEC 618372:2018 6 IEC 61837-2:2018 IEC 2018 SURFACE MOUNTED PIEZOELECTRIC DEVICES FOR FREQUENCY CONTROL AND SELECTION STANDARD OUTLINES AND TE

44、RMINAL LEAD CONNECTIONS Part 2: Ceramic enclosures 1 Scope This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. 2 Normative reference

45、s The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) appl

46、ies. IEC 61240:2016, Piezoelectric devices Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection General rules 3 Terms and definitions No terms and definitions are listed in this document. ISO and IEC maintain terminological databases for use in standar

47、dization at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 Configuration of enclosures The enclosures of the surface-mounted devices are made of ceramic materials with the terminals of deposited m

48、etal film (leadless type) based on a descriptive designation system for semiconductors devices packages. The configuration symbols are shown as follows: DCC (dual chip carrier); QCC (quad chip carrier). 5 Designation of types The designation of types is shown on four parts as follows: BS EN IEC 6183

49、72:2018IEC 61837-2:2018 IEC 2018 7 A: Configuration symbol of enclosures: DCC (dual chip carrier); QCC (quad chip carrier). B: Structure of terminal leads: leadless type has no mark. C: Number of terminal leads D: Serial number of both figures E: Arrangement of terminal land: In the case of DCC types: A (arrangement in the width direction side or the width direction side and the corner); B (arrangement in the length direction side or the length direction side an