IEC 62137-1-3-2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part1-3 Cyclic drop test《表面安装技术 表面安装焊.pdf

1、 IEC 62137-1-3 Edition 1.0 2008-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test methods for surface mount solder joint Part 1-3: Cyclic drop test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints bras

2、s monts en surface Partie 1-3: Essai de chute cyclique IEC 62137-1-3:2008 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic

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16、publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 62137-1-3 Edition 1.0 2008-11 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Environmental and endurance test meth

17、ods for surface mount solder joint Part 1-3: Cyclic drop test Technologie de montage en surface Mthodes dessais denvironnement et dendurance des joints brass monts en surface Partie 1-3: Essai de chute cyclique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE T IC

18、S 31.190 PRICE CODE CODE PRIX ISBN 2-8318-1018-1 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 62137-1-3 IEC:2008 CONTENTS FOREWORD.3 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 General remar

19、ks.6 5 Test equipment and materials.7 5.1 Reflow soldering oven .7 5.2 Drop impact test equipment.7 5.3 Test substrate .7 5.4 Solder alloy .7 5.5 Solder paste7 5.6 Specimen components 7 5.7 Strain gauge8 6 Mounting method8 7 Test method and procedure, and judgment conditions 8 7.1 Test procedure8 7.

20、2 Judgment conditions .9 8 Items to be included in the test report.9 9 Items to be given in the product specification .9 Annex A (normative) Drop impact test equipment.11 Annex B (normative) Test method and procedure.13 Annex C (informative) An example of test equipment and procedure16 Annex D (info

21、rmative) An example of strain gauge attachment procedure18 Bibliography23 Figure 1 Area for evaluation in the cyclic drop test.6 Figure 2 Typical reflow soldering profile.8 Figure A.1 Conceptual illustration of a substrate securing jig (reference) .12 Figure B.1 Strain gauge attachment example and g

22、uide mark 13 Figure B.2 Strain and other waveforms (example)14 Figure B.3 Examples of crack (fracture) modes14 Figure B.4 Correlation between the number of failures and the maximum strain.15 Figure C.1 Example of drop impact test equipment and connections for testing .16 Figure D.1 Items to use19 Fi

23、gure D.2 Strain gauge attachment procedures 21 Figure D.3 Gauge factor compensation 21 Figure D.4 Example of attaching strain gauge and guide mark dimensions 22 62137-1-3 IEC:2008 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR S

24、URFACE MOUNT SOLDER JOINT Part 1-3: Cyclic drop test FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operati

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32、ers of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication o

33、r any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication m

34、ay be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62137-1-3 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: F

35、DIS Report on voting 91/802/FDIS 91/825/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 62137-1-3 IEC:2008 A list of all part

36、s of the IEC 62137 series, under the general title Surface mounting technology Environmental and endurance test methods for surface mount solder joint, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result

37、date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 62137-1-3 IEC:2008 5 SURFACE MOUNTING TECHNOLOGY ENVIRONMENTAL AND ENDURANCE TEST

38、 METHODS FOR SURFACE MOUNT SOLDER JOINT Part 1-3: Cyclic drop test 1 Scope The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the streng

39、th of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in impr

40、oving the strength of the solder joints. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendm

41、ents) applies. IEC 60068-1, Environmental testing Part 1: General and guidance IEC 60194, Printed boards design, manufacture and assembly Terms and definitions IEC 61249-2-7, Materials for printed boards and other interconnecting structures Part 2-7: Reinforced base materials clad and unclad Epoxide

42、 woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad IEC 61188-5 (all parts 5), Printed boards and printed board assemblies Design and use Part 5: Attachment (land-joint) considerations IEC 61190-1-2, Attachment materials for electronic assembly Part 1-2: Requi

43、rements for soldering pastes for high-quality interconnects in electronics assembly IEC 61192-1, Workmanship requirements for soldered electronic assemblies Part 1: General IEC 61760-1, Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) 3

44、Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60068-1 and IEC 60194, as well as the following definitions, apply. 3.1 drop impact strength strength of the test substrate held by a jig that is dropped from a specified height, as represented by the num

45、ber of cyclic drops that finally cause fracture at the intermetallic, the 6 62137-1-3 IEC:2008 surface plating, or within the joint between a surface mounting device (SMD) termination and a printed wiring board (PWB) copper land termination 3.2 strain substrate surface strain value indication measur

46、ed by the strain gauge attached to the surface of the test substrate NOTE It is a numeric dimensionless quantity representing the degree of stretching observed when the test substrate is distorted. 3.3 maximum strain maximum strain in the tensile side (+) on the measured strain waveform 3.4 momentar

47、y interruption detector device that detects extremely short electrical discontinuity (momentary interruptions) in a daisy-chain circuit 4 General remarks The mechanical properties of the joint between a terminal to a land on a printed wiring board using lead-free solder are not the same for the join

48、t using tin-lead solder due to the difference in composing elements of the solders. Thus it becomes important to test the mechanical properties of solder joints using different solder alloys. This test is to evaluate the durability of joints that are formed by reflow soldering between SMD pins/elect

49、rodes and substrate lands in relation to drop heights. To evaluate the drop impact that the specimen joint receives, the strain can be used as an indicator of the impact, and it can quantitatively be measured using a strain gauge. NOTE This drop impact test is not intended to be targeted at components themselves. Refer to IEC 60068-2-27 and IEC 60068-2-31 for test methods o