BS PD IEC PAS 61249-8-5-2014 Qualification and performance specification of permanent solder mask and flexible cover materials《永久焊接面罩和柔性覆盖材料的性能规格和合格鉴定》.pdf

1、BSI Standards Publication Qualification and performance specification of permanent solder mask and flexible cover materials PD IEC/PAS 61249-8-5:2014National foreword This Published Document is the UK implementation of IEC/PAS 61249-8-5:2014. The UK participation in its preparation was entrusted to

2、Technical Com- mittee EPL/501, Electronic assembly technology any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC coll

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10、 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. A PAS is a technical specification not fulfilling the requirements for a standard, but ma

11、de available to the public. IEC PAS 61249-8-5, submitted by IPC has been processed by IEC technical committee 91: Electronics assembly technology. It is based on IPC-SM-840E. It is published as a double- logo PAS. The structure and editorial rules used in this PAS reflect the practice of the organiz

12、ation which submitted it. The text of this PAS is based on the following document: This PAS was approved for publication by the P-members of the committee concerned as indicated in the following document Draft PAS Report on voting 91/1157/PAS 91/1174/RVD Following publication of this PAS, the techni

13、cal committee or subcommittee concerned may transform it into an International Standard. PD IEC/PAS 61249-8-5:2014IEC PAS 61249-8-5:2014 IEC 2014 3 This PAS shall remain valid for an initial maximum period of 3 years starting from the publication date. The validity may be extended for a single perio

14、d up to a maximum of 3 years, at the end of which it shall be published as another type of normative document, or shall be withdrawn. PD IEC/PAS 61249-8-5:2014IPC-SM-840E 2010 - December Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Supersedes IPC-

15、SM-840D April 2007 A standard developed by IPC Association Connecting Electronics Industries PD IEC/PAS 61249-8-5:2014The Principles of Standardization In May 1995 the IPCs Technical Activities Executive Committee (TAEC) adopted Principles of Standardization as a guiding principle of IPCs standardiz

16、ation efforts. Standards Should: Show relationship to Design for Manufacturability (DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplied) language Just include spec information Focus on end product performance Include a feedback system on use and problems for fu

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28、 Copyright 2010. IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infri

29、ngement under the Copyright Law of the United States. PD IEC/PAS 61249-8-5:2014IPC-SM-840E Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Developed by the Solder Mask Performance Task Group (5-33B) of the Cleaning and Coating Committee (5-30) and th

30、e Covercoat Materials Task Group (D-13B) of the Flexible Circuits Committee (D-10) of IPC Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 Su

31、persedes: IPC-SM-840D - April 2007 IPC-SM-840C - Amendment 1 - June 2000 IPC-SM-840C - January 1995 IPC-SM-840B - May 1988 IPC-SM-840A - July 1983 IPC-SM-840 - November 1977 PD IEC/PAS 61249-8-5:2014This Page Intentionally Left BlankAcknowledgment Anydocumentinvolvingacomplextechnologydrawsmaterialf

32、romavastnumberofsources.Whiletheprincipalmembers oftheSolderMaskPerformanceTaskGroup(5-33B)oftheCleaningandCoatingCommittee(5-30)andtheCovercoatMate- rialsTaskGroup(D-13B)oftheFlexibleCircuitsCommittee(D-10)areshownbelow,itisnotpossibletoincludeallofthose whoassistedintheevolutionofthisstandard.Toea

33、chofthem,themembersofIPCextendtheirgratitude. FlexibleCircuits Committee SolderMaskPerformance TaskGroup CovercoatMaterials TaskGroup Chair DouglasO.Pauls RockwellCollins Vice-Chair DeboraL.Obitz TraceLaboratories-East Chair DavidA.Vaughan TaiyoAmerica,Inc. Vice-Chair DouglasO.Pauls RockwellCollins

34、Chair SteveA.Musante RaytheonMissileSystems TechnicalLiaisonsofthe IPCBoardofDirectors PeterBigelow IMIInc. SammyYi AptinaImagingCorporation SolderMaskPerformanceTaskGroupandCovercoatMaterialsTaskGroup GregoryBartlett,TeledynePrinted CircuitTechnologies JohnBauer,RockwellCollins MichaelBeauchesne,Am

35、phenolPrinted Circuits,Inc. JoshuaCiviello,DefenseSupplyCenter Columbus MarkFinstad,FlexibleCircuit Technologies,Inc. ThomasF.Gardeski,GeminiSciences MarcGoudreau,VulcanFlexCircuit Corporation RussellGriffith,FlexibleCircuitsInc. MichaelJ.Jawitz,BoeingSatellite DevelopmentCenter NickKoop,MincoProduc

36、tsInc. KarinLaBerge,MicrotekLaboratories JohnLeschisin,MincoProductsInc. AnneLomonte,DraegerMedical Systems,Inc. DuaneB.Mahnke,DBMahnke Consulting ThomasMcCarthy,TaconicAdvanced DielectricDivision RogerJ.Miedico,RaytheonCompany WilliamOrtloff,RaytheonCompany RobertSheldon,PioneerCircuitsInc. TerrySh

37、epler,Electro-Materials,Inc. DouglasJ.Sober,KanekaTexas Corporation BrentSweitzer,MultekFlexible Circuits,Inc. SteveJ.Vetter,NSWCCrane ClarkF.Webster,ALLFlexLLC MiouYamaoka,MeikoElectronicsCo. Ltd. December2010 IPC-SM-840E iii PD IEC/PAS 61249-8-5:2014ThisPageIntentionallyLeftBlank IPC-SM-840E Decem

38、ber2010 iv PD IEC/PAS 61249-8-5:2014TableofContents 1 SCOPEANDDESIGNATION1 1.1 Scope.1 1.2 Purpose1 1.3 Classes.1 1.4 Presentation2 1.5 TermsandDefinitions.2 1.5.1 AsAgreedBetweenUserandSupplier (AABUS).2 1.5.2 Blistering2 1.5.3 Chalking(CuredSolderMaskorCover Material)2 1.5.4 ColorChange(CuredSolde

39、rMaskorCover Material)2 1.5.5 CoC.2 1.5.6 Covercoat.2 1.5.7 Coverfilm.2 1.5.8 CoverMaterial2 1.5.9 Crazing(ConformalorSolderMaskorCover Material)2 1.5.10 Delamination(CuredSolderMaskorCover Material)2 1.5.11 FTIR2 1.5.12 Liquefaction(CuredSolderMaskorCover Material)3 1.5.13 Peeling(CuredSolderMask)3

40、 1.5.14 SAC3053 1.5.15 Softening(CuredSolderMaskorCover Material)3 1.5.16 SolderMask.3 1.5.17 Swelling(CuredSolderMaskorCover Material)3 1.5.18 Tackiness(SolderMaskorCoverMaterial).3 1.5.19 Wicking(SolderMaskorCovercoat)3 1.6 RevisionLevelChanges.3 2 APPLICABLEDOCUMENTS3 2.1 IPC3 2.2 UnderwritersLab

41、oratories4 2.3 ASTM4 2.4 PrecedenceofDocuments4 3 REQUIREMENTS4 3.1 Qualification/Conformance4 3.1.1 MaterialQualificationandConformance.4 3.1.2 PrintedBoardProcessQualificationand Assessment.5 3.1.3 Requalification5 3.2 Materials5 3.2.1 FormulationChange5 3.2.2 Compatibility5 3.2.3 ShelfLife.7 3.2.

42、4 Color7 3.2.5 Cure.7 3.2.6 Non-Nutrient7 3.3 VisualRequirements.7 3.3.1 Appearance.7 3.3.2 Discoloration(MetallicSurfaces)7 3.3.3 Discoloration(SolderMaskorCover Material)7 3.4 DimensionalRequirements7 3.4.1 SolderMaskorCoverMaterialThickness.7 3.5 PhysicalRequirements.7 3.5.1 PencilHardness7 3.5.2

43、 Adhesion7 3.5.3 Machinability8 3.5.4 Flexibility.9 3.6 ChemicalRequirements.9 3.6.1 ResistancetoFabricationSolvents,Cleaning AgentsandFluxes.9 3.6.2 HydrolyticStability.9 3.6.3 Flammability9 3.7 SolderingRequirements.9 3.7.1 Solderability.9 3.7.2 ResistancetoTin-LeadSolder9 3.7.3 ResistancetoLeadFr

44、eeSolder.10 3.8 ElectricalRequirements.10 3.8.1 DielectricStrength10 3.8.2 InsulationResistance.10 3.9 EnvironmentalRequirements.10 3.9.1 MoistureandInsulationResistance.10 3.9.2 ElectrochemicalMigration.10 3.9.3 ThermalShock10 4 QUALITYASSURANCEPROVISIONS11 4.1 ResponsibilityforTesting/Inspection11

45、 4.1.1 InitialQualificationTesting11 4.1.2 TestorInspectionFacilities11 4.2 QualificationInspection.11 4.2.1 SampleSize11 4.2.2 InspectionRoutine11 4.2.3 Failures11 4.3 QualityConformanceTesting/Inspection.11 4.3.1 Testing/InspectionofProductforDelivery11 4.4 PreparationofSpecimensforTest.12 4.4.1 StandardLaboratoryConditions.12 4.4.2 SpecimenSelection.13 4.4.3 Coating13 4.4.4 Number14 December2010 IPC-SM-840E v PD IEC/PAS 61249-8-5:2014